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公开(公告)号：US20100037933A1
公开(公告)日：2010-02-18
申请号：US12189839
申请日：2008-08-12
IPC分类号： H01L31/052 , H01L31/048 , H01L31/18
CPC分类号： H01L31/0504 , H01L31/0201 , H01L31/022433 , H01L31/0475 , H01L31/048 , H01L31/049 , H01L31/0508 , Y02E10/50
摘要： A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.
摘要翻译： 太阳能电池板及其制造方法。 该方法包括：在底盖板的顶表面上形成导电母线; 形成靠近顶盖板的底表面的导电接触框架，顶盖板对可见光透明; 并且将太阳能电池芯片的行和列阵列放置在底盖板和顶盖板之间，太阳能电池芯片阵列的每个太阳能电池芯片包括与顶表面相邻的阳极和与底表面相邻的阴极 所述母线与所述太阳能电池芯片阵列的每个太阳能电池芯片的每个阳极电接触，并且所述接触框架接触所述太阳能电池芯片阵列的每个太阳能电池芯片的每个阳极。
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公开(公告)号：US09583658B2
公开(公告)日：2017-02-28
申请号：US12849555
申请日：2010-08-03
IPC分类号： H01L31/0224 , H01L31/048 , H01L31/02 , H01L31/05 , H01L31/0475
CPC分类号： H01L31/0504 , H01L31/0201 , H01L31/022433 , H01L31/0475 , H01L31/048 , H01L31/049 , H01L31/0508 , Y02E10/50
摘要： A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each cathode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.
摘要翻译： 太阳能电池板及其制造方法。 该方法包括：在底盖板的顶表面上形成导电母线; 形成靠近顶盖板的底表面的导电接触框架，顶盖板对可见光透明; 并且将太阳能电池芯片的行和列阵列放置在底盖板和顶盖板之间，太阳能电池芯片阵列的每个太阳能电池芯片包括与顶表面相邻的阳极和与底表面相邻的阴极 的太阳能电池芯片阵列的每个太阳能电池芯片的每个阴极的电气接触，并且接触框架与太阳能电池芯片阵列的每个太阳能电池芯片的每个阳极接触。
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公开(公告)号：US20100297800A1
公开(公告)日：2010-11-25
申请号：US12849555
申请日：2010-08-03
IPC分类号： H01L31/18
CPC分类号： H01L31/0504 , H01L31/0201 , H01L31/022433 , H01L31/0475 , H01L31/048 , H01L31/049 , H01L31/0508 , Y02E10/50
摘要： A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.
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公开(公告)号：US20100304519A1
公开(公告)日：2010-12-02
申请号：US12849448
申请日：2010-08-03
申请人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
发明人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
IPC分类号： H01L31/18 , H01L21/027 , H01L21/283
CPC分类号： H01L31/068 , H01L31/02168 , H01L31/022425 , H01L31/022433 , H01L31/1804 , H01L31/1868 , Y02E10/547 , Y02P70/521
摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.
摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。
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公开(公告)号：US07897434B2
公开(公告)日：2011-03-01
申请号：US12189911
申请日：2008-08-12
申请人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
发明人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
IPC分类号： H01L21/00
CPC分类号： H01L31/068 , H01L31/02168 , H01L31/022425 , H01L31/022433 , H01L31/1804 , H01L31/1868 , Y02E10/547 , Y02P70/521
摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.
摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。
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公开(公告)号：US20100037939A1
公开(公告)日：2010-02-18
申请号：US12189911
申请日：2008-08-12
申请人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
发明人： Hans-Juergen Eickelmann , Michael Haag , Harold J. Hovel , Rainer Klaus Krause , Markus Schmidt , Xiaoyan Shao , Steven Erik Steen
IPC分类号： H01L31/00
CPC分类号： H01L31/068 , H01L31/02168 , H01L31/022425 , H01L31/022433 , H01L31/1804 , H01L31/1868 , Y02E10/547 , Y02P70/521
摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.
摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。
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公开(公告)号：US20110100443A1
公开(公告)日：2011-05-05
申请号：US12916236
申请日：2010-10-29
申请人： Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Carl Radens , Brian C. Sapp
发明人： Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Carl Radens , Brian C. Sapp
IPC分类号： H01L31/06 , H01L31/0236
CPC分类号： H01L31/022425 , H01L31/068 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A method for manufacturing a photovoltaic solar cell device includes the following. A p-n junction having a first doping density is formed. Formation of the p-n junction is enhanced by introducing a second doping density to form high doped areas for a dual emitter application. The high doped areas are defined by a masking process integrated with the formation of the p-n junction, resulting in a mask pattern of the high doped areas. A metallization of the high doped areas occurs in accordance with the mask pattern of the high doped areas.
摘要翻译： 光伏太阳能电池器件的制造方法包括以下。 形成具有第一掺杂密度的p-n结。 通过引入第二掺杂密度以形成用于双发射器应用的高掺杂区域来增强p-n结的形成。 高掺杂区域由与p-n结的形成集成的掩模工艺限定，产生高掺杂区域的掩模图案。 根据高掺杂区域的掩模图案发生高掺杂区域的金属化。
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8.发明授权公开(公告)号：US07336445B2
公开(公告)日：2008-02-26
申请号：US11325897
申请日：2006-01-04
申请人： Rainer Klaus Krause , Jan Marien , Johannes Thomas Paul , Gunther Wilhelm Sandmann , Gerhard Anton Scherb , Hubert Erwin Schuy , Stefan Seifried
发明人： Rainer Klaus Krause , Jan Marien , Johannes Thomas Paul , Gunther Wilhelm Sandmann , Gerhard Anton Scherb , Hubert Erwin Schuy , Stefan Seifried
IPC分类号： G11B5/48
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/10 , G11B5/102 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B5/3169 , G11B5/3173 , G11B5/3903 , G11B5/4853 , G11B2005/3996 , Y10S29/016 , Y10T29/49032 , Y10T29/49155
摘要： A magnetic recording device makes use of an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer. A method of making the conductive stud using a photolithography process is also disclosed.
摘要翻译： 磁记录装置利用被固定在其周围的绝缘体材料中的“锚定”导电柱。 导电柱形成在导电层上，该导电层耦合到磁记录装置的读取头或写头元件的一部分。 导电柱具有形成在导电层上的顶部螺柱部分和底部底切部分。 在一个示出的实施例中，底部底切部分的宽度大于顶部螺柱部分的宽度。 由于绝缘子形成在导电柱体周围并且在其底部底切部分周围，所以提供了导电柱和导电层之间的牢固耦合。 优选地，导电层由铜（Cu）制成，导电柱由金（Au）制成，绝缘体是氧化铝（Al 2 O 3 O 3）。 种子层可以形成在导电柱和导电层之间。 还公开了使用光刻工艺制造导电柱的方法。
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公开(公告)号：US07270940B2
公开(公告)日：2007-09-18
申请号：US10707288
申请日：2003-12-03
CPC分类号： H01L21/02348 , H01L21/02126 , H01L21/02282 , H01L21/0274 , H01L21/312
摘要： The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.
摘要翻译： 本发明涉及一种通过在基片上提供聚合引发剂层来构成基底的方法，在聚合引发剂层上施加辐射场，以选择性地降低聚合引发剂层的聚合引发剂的密度，施加单体，然后聚合 单体，聚合由聚合引发剂层的起始物引发，并且使用聚合单体作为掩模来构建底物。
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公开(公告)号：US20110100451A1
公开(公告)日：2011-05-05
申请号：US12866737
申请日：2009-01-13
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022433 , H01L31/0475 , H01L31/0508 , Y02E10/50
摘要： A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.
摘要翻译： 硅太阳能电池通过提供载体板并且通过向载体板施加第一接触图案来制造。 第一接触图案包括一组第一层状接触。 硅太阳能电池进一步通过将多个硅片施加到第一接触图案并且通过向多个硅片施加第二接触图案而制造。 该组第一层状接触件的每个第一层状接触件与最多两个硅片片层叠接触。 第二接触图案包括一组第二层状接触。 该组第二层状接触件的每个第二层状接触件与最多两个硅片片层叠接触。
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