公开(公告)号：US20080296691A1

公开(公告)日：2008-12-04

申请号：US11807654

申请日：2007-05-30

申请人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

IPC分类号： H01L29/76

CPC分类号： H01L27/0207 ,  H01L27/11 ,  H01L27/1104

摘要： A semiconductor structure includes an array of unit metal-oxide-semiconductor (MOS) devices arranged in a plurality of rows and a plurality of columns is provided. Each of the unit MOS devices includes an active region laid out in a row direction and a gate electrode laid out in a column direction. The semiconductor structure further includes a first unit MOS device in the array and a second unit MOS device in the array, wherein active regions of the first and the second unit MOS devices have different conductivity types.

摘要翻译： 半导体结构包括以多行排列的单位金属氧化物半导体（MOS）器件的阵列，并且提供多个列。 每个单位MOS器件包括布置在行方向上的有源区和沿列方向布置的栅电极。 半导体结构还包括阵列中的第一单元MOS器件和阵列中的第二单元MOS器件，其中第一和第二单位MOS器件的有源区具有不同的导电类型。

公开(公告)号：US20120286368A1

公开(公告)日：2012-11-15

申请号：US13558109

申请日：2012-07-25

申请人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

IPC分类号： H01L27/088

CPC分类号： H01L27/0207 ,  H01L27/11 ,  H01L27/1104

摘要： A semiconductor structure includes an array of unit metal-oxide-semiconductor (MOS) devices arranged in a plurality of rows and a plurality of columns is provided. Each of the unit MOS devices includes an active region laid out in a row direction and a gate electrode laid out in a column direction. The semiconductor structure further includes a first unit MOS device in the array and a second unit MOS device in the array, wherein active regions of the first and the second unit MOS devices have different conductivity types.

摘要翻译： 半导体结构包括以多行排列的单位金属氧化物半导体（MOS）器件的阵列，并且提供多个列。 每个单位MOS器件包括布置在行方向上的有源区和沿列方向布置的栅电极。 半导体结构还包括阵列中的第一单元MOS器件和阵列中的第二单元MOS器件，其中第一和第二单位MOS器件的有源区具有不同的导电类型。

公开(公告)号：US08237201B2

公开(公告)日：2012-08-07

申请号：US11807654

申请日：2007-05-30

申请人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Jen-Bin Hsu ,  Chung Long Cheng ,  Mong Song Liang

IPC分类号： H01L27/118

CPC分类号： H01L27/0207 ,  H01L27/11 ,  H01L27/1104

摘要： A semiconductor structure includes an array of unit metal-oxide-semiconductor (MOS) devices arranged in a plurality of rows and a plurality of columns is provided. Each of the unit MOS devices includes an active region laid out in a row direction and a gate electrode laid out in a column direction. The semiconductor structure further includes a first unit MOS device in the array and a second unit MOS device in the array, wherein active regions of the first and the second unit MOS devices have different conductivity types.

摘要翻译： 半导体结构包括以多行排列的单位金属氧化物半导体（MOS）器件的阵列，并且提供多个列。 每个单位MOS器件包括布置在行方向上的有源区和沿列方向布置的栅电极。 半导体结构还包括阵列中的第一单元MOS器件和阵列中的第二单元MOS器件，其中第一和第二单位MOS器件的有源区具有不同的导电类型。

公开(公告)号：US07898037B2

公开(公告)日：2011-03-01

申请号：US11833128

申请日：2007-08-02

申请人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Jung-Hui Kao ,  Sheng-Chen Chung ,  Chung Long Cheng ,  Shun-Jang Liao

发明人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Jung-Hui Kao ,  Sheng-Chen Chung ,  Chung Long Cheng ,  Shun-Jang Liao

IPC分类号： H01L29/78

CPC分类号： H01L29/785 ,  H01L21/76807 ,  H01L21/76895 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823475 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

摘要： A semiconductor structure and methods of forming the same are provided. The semiconductor structure includes a semiconductor substrate; a first inter-layer dielectric (ILD) over the semiconductor substrate; a contact extending from a top surface of the first ILD into the first ILD; a second ILD over the first ILD; a bottom inter-metal dielectric (IMD) over the second ILD; and a dual damascene structure comprising a metal line in the IMD and a via in the second ILD, wherein the via is connected to the contact.

摘要翻译： 提供半导体结构及其形成方法。 半导体结构包括半导体衬底; 半导体衬底上的第一层间电介质（ILD）; 从第一ILD的顶表面延伸到第一ILD中的接触; 第一个ILD的第二个ILD; 在第二ILD上的底部金属间电介质（IMD）; 以及包括IMD中的金属线和第二ILD中的通孔的双镶嵌结构，其中所述通孔连接到所述触点。

公开(公告)号：US07868361B2

公开(公告)日：2011-01-11

申请号：US11766425

申请日：2007-06-21

申请人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

发明人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

IPC分类号： H01L21/76

CPC分类号： H01L29/66477 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/088 ,  H01L27/0922 ,  H01L29/7848

摘要： A semiconductor device having a core device with a high-k gate dielectric and an I/O device with a silicon dioxide or other non-high-k gate dielectric, and a method of fabricating such a device. A core well and an I/O well are created in a semiconductor substrate and separated by an isolation structure. An I/O device is formed over the I/O well and has a silicon dioxide or a low-k gate dielectric. A resistor may be formed on an isolation structure adjacent to the core well. A core-well device such as a transistor is formed over the core well, and has a high-k gate dielectric. In some embodiments, a p-type I/O well and an n-type I/O well are created. In a preferred embodiment, the I/O device or devices are formed prior to forming the core device and protected with a sacrificial layer until the core device is fabricated.

公开(公告)号：US08286114B2

公开(公告)日：2012-10-09

申请号：US11833119

申请日：2007-08-02

申请人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Sheng-Chen Chung ,  Chih-Tsung Yao ,  Jung-Hui Kao ,  Chung Long Cheng ,  Gary Shen ,  Gwan Sin Chang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Sheng-Chen Chung ,  Chih-Tsung Yao ,  Jung-Hui Kao ,  Chung Long Cheng ,  Gary Shen ,  Gwan Sin Chang

IPC分类号： G06F17/50

CPC分类号： H01L29/785 ,  H01L21/76807 ,  H01L21/76895 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823475 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

摘要： A method for defining a layout of 3-D devices, such as a finFET, is provided. The method includes determining an area required by a desired 3-D device and designing a circuit using planar devices having an equivalent area. The planar device corresponding to the desired 3-D device is used to layout a circuit design, thereby allowing circuit and layout designers to work at a higher level without the need to specify each individual fin or 3-D structure. Thereafter, the planar design may be converted to a 3-D design by replacing planar active areas with 3-D devices occupying an equivalent area.

摘要翻译： 提供了一种用于定义诸如finFET的3-D器件的布局的方法。 该方法包括确定期望的3-D设备所需的区域和使用具有等效面积的平面设备来设计电路。 对应于期望的3-D器件的平面器件用于布局电路设计，从而允许电路和布局设计者在更高级别工作，而不需要指定每个单独的鳍或3-D结构。 此后，平面设计可以通过用占据等同面积的3-D器件代替平面有源区域而被转换成3维设计。

公开(公告)号：US20110076813A1

公开(公告)日：2011-03-31

申请号：US12961167

申请日：2010-12-06

申请人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

发明人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

IPC分类号： H01L21/8238

CPC分类号： H01L29/66477 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/088 ,  H01L27/0922 ,  H01L29/7848

摘要： A semiconductor device having a core device with a high-k gate dielectric and an I/O device with a silicon dioxide or other non-high-k gate dielectric, and a method of fabricating such a device. A core well and an I/O well are created in a semiconductor substrate and separated by an isolation structure. An I/O device is formed over the I/O well and has a silicon dioxide or a low-k gate dielectric. A resistor may be formed on an isolation structure adjacent to the core well. A core-well device such as a transistor is formed over the core well, and has a high-k gate dielectric. In some embodiments, a p-type I/O well and an n-type I/O well are created. In a preferred embodiment, the I/O device or devices are formed prior to forming the core device and protected with a sacrificial layer until the core device is fabricated.

摘要翻译： 具有具有高k栅极电介质的核心器件和具有二氧化硅或其它非高k栅极电介质的I / O器件的半导体器件及其制造方法。 核心阱和I / O阱在半导体衬底中产生并被隔离结构隔开。 I / O器件形成在I / O阱上，并具有二氧化硅或低k栅极电介质。 可以在与芯井相邻的隔离结构上形成电阻器。 在核心阱上形成诸如晶体管的核心阱器件，并且具有高k栅极电介质。 在一些实施例中，产生p型I / O阱和n型I / O阱。 在优选实施例中，在形成核心器件之前形成I / O器件或器件，并用牺牲层进行保护，直到制造核心器件。

公开(公告)号：US20080315320A1

公开(公告)日：2008-12-25

申请号：US11766425

申请日：2007-06-21

申请人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

发明人： Chung Long Cheng ,  Sheng-Chen Chung ,  Kong-Beng Thei ,  Harry Chuang ,  Mong Song Liang

IPC分类号： H01L29/76 ,  H01L27/12 ,  H01L27/01 ,  H01L31/0392

CPC分类号： H01L29/66477 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/088 ,  H01L27/0922 ,  H01L29/7848

摘要： A semiconductor device having a core device with a high-k gate dielectric and an I/O device with a silicon dioxide or other non-high-k gate dielectric, and a method of fabricating such a device. A core well and an I/O well are created in a semiconductor substrate and separated by an isolation structure. An I/O device is formed over the I/O well and has a silicon dioxide or a low-k gate dielectric. A resistor may be formed on an isolation structure adjacent to the core well. A core-well device such as a transistor is formed over the core well, and has a high-k gate dielectric. In some embodiments, a p-type I/O well and an n-type I/O well are created. In a preferred embodiment, the I/O device or devices are formed prior to forming the core device and protected with a sacrificial layer until the core device is fabricated.

摘要翻译： 具有具有高k栅极电介质的核心器件和具有二氧化硅或其它非高k栅极电介质的I / O器件的半导体器件及其制造方法。 核心阱和I / O阱在半导体衬底中产生并被隔离结构隔开。 I / O器件形成在I / O阱上，并具有二氧化硅或低k栅极电介质。 可以在与芯井相邻的隔离结构上形成电阻器。 在核心阱上形成诸如晶体管的核心阱器件，并且具有高k栅极电介质。 在一些实施例中，产生p型I / O阱和n型I / O阱。 在优选实施例中，在形成核心器件之前形成I / O器件或器件，并用牺牲层进行保护，直到制造核心器件。

公开(公告)号：US20080263492A1

公开(公告)日：2008-10-23

申请号：US11833119

申请日：2007-08-02

申请人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Sheng-Chen Chung ,  Chih-Tsung Yao ,  Jung-Hui Kao ,  Chung Long Cheng ,  Gary Shen ,  Gwan Sin Chang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Sheng-Chen Chung ,  Chih-Tsung Yao ,  Jung-Hui Kao ,  Chung Long Cheng ,  Gary Shen ,  Gwan Sin Chang

IPC分类号： G06F17/50

CPC分类号： H01L29/785 ,  H01L21/76807 ,  H01L21/76895 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823475 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

摘要： A method for defining a layout of 3-D devices, such as a finFET, is provided. The method includes determining an area required by a desired 3-D device and designing a circuit using planar devices having an equivalent area. The planar device corresponding to the desired 3-D device is used to layout a circuit design, thereby allowing circuit and layout designers to work at a higher level without the need to specify each individual fin or 3-D structure. Thereafter, the planar design may be converted to a 3-D design by replacing planar active areas with 3-D devices occupying an equivalent area.

摘要翻译： 提供了一种用于定义诸如finFET的3-D器件的布局的方法。 该方法包括确定期望的3-D设备所需的区域和使用具有等效面积的平面设备来设计电路。 对应于期望的3-D器件的平面器件用于布局电路设计，从而允许电路和布局设计者在更高级别工作，而不需要指定每个单独的鳍或3-D结构。 此后，平面设计可以通过用占据等同面积的3-D器件代替平面有源区域而被转换成3维设计。

公开(公告)号：US20080258228A1

公开(公告)日：2008-10-23

申请号：US11833128

申请日：2007-08-02

申请人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Jung-Hui Kao ,  Sheng-Chen Chung ,  Chung Long Cheng ,  Shun-Jang Liao

发明人： Harry Chuang ,  Kong-Beng Thei ,  Mong Song Liang ,  Jung-Hui Kao ,  Sheng-Chen Chung ,  Chung Long Cheng ,  Shun-Jang Liao

IPC分类号： H01L29/78 ,  H01L21/8238

CPC分类号： H01L29/785 ,  H01L21/76807 ,  H01L21/76895 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823475 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

摘要： A semiconductor structure and methods of forming the same are provided. The semiconductor structure includes a semiconductor substrate; a first inter-layer dielectric (ILD) over the semiconductor substrate; a contact extending from a top surface of the first ILD into the first ILD; a second ILD over the first ILD; a bottom inter-metal dielectric (IMD) over the second ILD; and a dual damascene structure comprising a metal line in the IMD and a via in the second ILD, wherein the via is connected to the contact.

摘要翻译： 提供半导体结构及其形成方法。 半导体结构包括半导体衬底; 半导体衬底上的第一层间电介质（ILD）; 从第一ILD的顶表面延伸到第一ILD中的接触; 第一个ILD的第二个ILD; 在第二ILD上的底部金属间电介质（IMD）; 以及包括IMD中的金属线和第二ILD中的通孔的双镶嵌结构，其中所述通孔连接到所述触点。