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1.发明授权公开(公告)号：US08465656B2
公开(公告)日：2013-06-18
申请号：US12733105
申请日：2008-06-23
申请人： Harumi Nagao , Yoshiyuki Asakawa , Kenji Ikeuchi
发明人： Harumi Nagao , Yoshiyuki Asakawa , Kenji Ikeuchi
IPC分类号： H01B13/00
CPC分类号： H05K3/067 , C23C22/52 , C23C22/58 , C23F1/18 , C23F1/28 , H05K3/26 , H05K3/388 , H05K2201/0338 , H05K2201/0761 , H05K2203/0796
摘要： A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing permanganate and acetic acid.
摘要翻译： 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压材料，然后在无粘合剂的铜箔层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂铜包覆层压板进行蚀刻处理的方法，然后使用含有高锰酸盐和乙酸的酸式氧化剂进行处理 。
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2.发明申请公开(公告)号：US20100139959A1
公开(公告)日：2010-06-10
申请号：US12733105
申请日：2008-06-23
申请人： Harumi Nagao , Yoshiyuki Asakawa , Kenji Ikeuchi
发明人： Harumi Nagao , Yoshiyuki Asakawa , Kenji Ikeuchi
CPC分类号： H05K3/067 , C23C22/52 , C23C22/58 , C23F1/18 , C23F1/28 , H05K3/26 , H05K3/388 , H05K2201/0338 , H05K2201/0761 , H05K2203/0796
摘要： A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing permanganate and acetic acid.
摘要翻译： 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂铜包覆层压板进行蚀刻处理的方法，然后使用含有高锰酸盐和乙酸的酸式氧化剂进行处理 。
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3.发明授权公开(公告)号：US08663484B2
公开(公告)日：2014-03-04
申请号：US12452479
申请日：2008-06-23
申请人： Harumi Nagao , Yoshiyuki Asakawa
发明人： Harumi Nagao , Yoshiyuki Asakawa
IPC分类号： H01B13/00
CPC分类号： H05K3/067 , C23F1/26 , C23F1/28 , H05K1/0393 , H05K3/26 , H05K3/388 , H05K2201/0761 , H05K2203/0796 , Y10T428/12569 , Y10T428/31681
摘要： A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing potassium permanganate.
摘要翻译： 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂覆铜层压板进行蚀刻处理的方法，然后使用含有高锰酸钾的酸式氧化剂进行处理。
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4.发明申请公开(公告)号：US20100126762A1
公开(公告)日：2010-05-27
申请号：US12452479
申请日：2008-06-23
申请人： Harumi Nagao , Yoshiyuki Asakawa
发明人： Harumi Nagao , Yoshiyuki Asakawa
CPC分类号： H05K3/067 , C23F1/26 , C23F1/28 , H05K1/0393 , H05K3/26 , H05K3/388 , H05K2201/0761 , H05K2203/0796 , Y10T428/12569 , Y10T428/31681
摘要： A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing potassium permanganate.
摘要翻译： 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂覆铜层压板进行蚀刻处理的方法，然后使用含有高锰酸钾的酸式氧化剂进行处理。
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公开(公告)号：US07634212B2
公开(公告)日：2009-12-15
申请号：US11369192
申请日：2006-03-06
申请人： Yoshiyuki Asakawa
发明人： Yoshiyuki Asakawa
IPC分类号： G03G15/00
CPC分类号： G03G15/5016
摘要： A control panel adapted to be attached to a main body of an image forming device is disclosed. The control panel has a plurality of positions with respect to the image forming device main body and comprises: a panel main body; a fixed member adapted to be fixed relative to the main body of the image forming device; a movable member movable between a first position wherein the movable member engages the fixed member to maintain the panel main body in a selected one of the plurality of positions and a second position, spaced from the first position in a first direction, wherein the movable member disengages the fixed member to allow movement of the panel main body; a control member operatively connected to the movable member and movable substantially in the first direction to move the movable member between the first position and the second position.
摘要翻译： 公开了一种适于附接到图像形成装置的主体的控制面板。 控制面板相对于图像形成装置主体具有多个位置，包括：面板主体; 适于相对于图像形成装置的主体固定的固定构件; 可移动部件，其在第一位置和第二位置之间移动，第一位置可移动部件与固定部件接合，以将面板主体保持在多个位置中选定的一个位置，而第二位置与第一位置沿第一方向间隔开， 使固定构件脱离，以允许面板主体移动; 控制构件，其可操作地连接到所述可动构件并且可大致沿所述第一方向移动，以在所述第一位置和所述第二位置之间移动所述可动构件。
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公开(公告)号：US20080090095A1
公开(公告)日：2008-04-17
申请号：US11661308
申请日：2005-08-24
申请人： Junichi Nagata , Yoshiyuki Asakawa
发明人： Junichi Nagata , Yoshiyuki Asakawa
CPC分类号： C23C28/00 , C23C14/20 , C23C28/021 , C23C28/023 , H05K1/0393 , H05K3/388 , Y10T428/12535 , Y10T428/12569 , Y10T428/12826 , Y10T428/1291 , Y10T428/12944 , Y10T428/24967 , Y10T428/265 , Y10T428/31681
摘要： The present invention provides adhesiveless copper clad laminates, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability, and provides a method for manufacturing such adhesiveless copper clad laminates. In adhesiveless copper clad laminates according to the present invention provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.
摘要翻译： 本发明提供了由于在通过干式电镀工艺在绝缘膜上形成基底金属层时产生的针孔而在铜膜部分上没有缺陷的无粘合铜包覆层压板在绝缘膜上具有优异的粘附性 和基体金属层和耐腐蚀性，并且具有绝缘可靠性高的铜膜层，并且提供了制造这种无粘合剂覆铜层压板的方法。 在根据本发明的无粘合铜包覆层压板中，通过直接在绝缘膜的至少一个平面上形成基底金属层而不在其间形成粘合剂，然后通过在基底金属层上形成铜膜层而提供， 通过干式电镀法形成膜厚为3〜50nm的金属层，主要含有铬比为4〜22重量％，钼比例为5〜40重量％的铬钼镍合金， 平衡是镍。
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公开(公告)号：US20060230689A1
公开(公告)日：2006-10-19
申请号：US11369192
申请日：2006-03-06
申请人： Yoshiyuki Asakawa
发明人： Yoshiyuki Asakawa
IPC分类号： B66B9/00
CPC分类号： G03G15/5016
摘要： A control panel adapted to be attached to a main body of an image forming device is disclosed. The control panel has a plurality of positions with respect to the image forming device main body and comprises: a panel main body; a fixed member adapted to be fixed relative to the main body of the image forming device; a movable member movable between a first position wherein the movable member engages the fixed member to maintain the panel main body in a selected one of the plurality of positions and a second position, spaced from the first position in a first direction, wherein the movable member disengages the fixed member to allow movement of the panel main body; a control member operatively connected to the movable member and movable substantially in the first direction to move the movable member between the first position and the second position.
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公开(公告)号：US08288011B2
公开(公告)日：2012-10-16
申请号：US12805921
申请日：2010-08-24
申请人： Junichi Nagata , Yoshiyuki Asakawa
发明人： Junichi Nagata , Yoshiyuki Asakawa
CPC分类号： C23C18/206 , C23C14/20 , C23C18/165 , C23C18/38 , C23C18/50 , C23C24/00 , H05K1/0393 , H05K3/388 , Y10T428/12535 , Y10T428/12569 , Y10T428/12826 , Y10T428/1291 , Y10T428/12944 , Y10T428/24967 , Y10T428/265 , Y10T428/31681
摘要： Adhesiveless copper clad laminates wherein a base metal layer is directly formed on at least one side of an insulating film without using an adhesive and a copper conductor layer having a desired thickness is formed on the base metal layer, the adhesiveless copper clad laminates is characterized in that a base metal layer having a thickness of 3 to 50 nm is formed on an insulating film by a dry plating method and a copper film layer is formed on the base metal layer, and the base metal layer mainly contains (1) a vanadium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel or (2) a vanadium-chromium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium and chromium in total including at least 2% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel.
摘要翻译： 无粘性铜包覆层压板，其中在不使用粘合剂的情况下在绝缘膜的至少一侧直接形成贱金属层，并在基底金属层上形成具有所需厚度的铜导体层， 通过干式电镀法在绝缘膜上形成厚度为3〜50nm的贱金属层，在基体金属层上形成铜膜层，贱金属层主要含有（1）钒 - 由4〜13重量％的钒，5〜40重量％的钼，余量的镍或（2）4〜13重量％的钒 - 铬 - 钼 - 镍合金组成的钼 - 镍合金 的钒和铬总计包括至少2重量％的钒，5至40重量％的钼，余量为镍。
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公开(公告)号：US20080102305A1
公开(公告)日：2008-05-01
申请号：US11661307
申请日：2005-08-24
申请人： Junichi Nagata , Yoshiyuki Asakawa
发明人： Junichi Nagata , Yoshiyuki Asakawa
CPC分类号： C23C28/00 , C23C14/205 , C23C18/165 , C23C18/38 , C23C28/021 , C23C28/023 , H05K1/0393 , H05K3/388 , H05K2201/0317 , Y10T428/12535 , Y10T428/12569
摘要： The present invention provides adhesiveless copper clad laminates wherein there is formed a copper film layer having high adhesiveness and insulation reliability, and a method for manufacturing such adhesiveless copper clad laminates.In adhesiveless copper clad laminates wherein a base metal layer is directly formed on at least one side of an insulating film without using an adhesive and a copper conductor layer having a desired thickness is formed on the base metal layer, the adhesiveless copper clad laminates is characterized in that a base metal layer having a thickness of 3 to 50 nm is formed on an insulating film by a dry plating method and a copper film layer is formed on the base metal layer, and the base metal layer mainly contains (1) a vanadium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel or (2) a -vanadium-chromium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium and chromium in total including at least 2% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel.
摘要翻译： 本发明提供了无粘性铜包覆层压板，其中形成了具有高粘合性和绝缘可靠性的铜膜层，以及这种无粘合剂覆铜层压板的制造方法。 在无粘性铜包覆层压板中，其中在绝缘膜的至少一侧上直接形成基底金属层而不使用粘合剂，并且在基底金属层上形成具有所需厚度的铜导体层，所述无粘合剂覆铜层压板的特征在于 由于通过干式电镀法在绝缘膜上形成厚度为3〜50nm的贱金属层，在基底金属层上形成铜膜层，贱金属层主要含有（1）钒 钼 - 镍合金，由4〜13重量％的钒，5〜40重量％的钼，余量的镍或（2）a-钒 - 铬 - 钼 - 镍合金组成，由4〜13重量％ 的钒和铬总计包括至少2重量％的钒，5至40重量％的钼，余量为镍。
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公开(公告)号：US5134443A
公开(公告)日：1992-07-28
申请号：US579610
申请日：1990-09-07
申请人： Hiroshi Sumi , Yoshiyuki Asakawa
发明人： Hiroshi Sumi , Yoshiyuki Asakawa
CPC分类号： G03G15/6558 , G03G21/1623 , G03G21/1647 , G03G2215/00383 , G03G2215/00405 , G03G2215/00409 , G03G2215/0054 , G03G2215/00548 , G03G2215/00713 , G03G2221/1624 , G03G2221/1642 , G03G2221/1654 , G03G2221/1672 , G03G2221/1675 , G03G2221/18
摘要： The main body of the image-forming machine is provided with an image-forming unit and a conveying unit disposed opposite to the image-forming unit. The conveying unit supports a mounting and detaching unit so that it is selectively movable to a set position or a non-set position. A locking means is provided between the mounting and detaching unit and the main body of the image-forming machine. When the mounting and detaching unit is held at the non-set position, the lock means is cancelled, and the conveying unit can be drawn from the main body of the image-forming machine. As a result, a large space is created beneath the image-forming unit, and jamming can be easily disposed of.
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