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公开(公告)号：US20060261454A1
公开(公告)日：2006-11-23
申请号：US11133576
申请日：2005-05-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US08637978B2
公开(公告)日：2014-01-28
申请号：US13235781
申请日：2011-09-19
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
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公开(公告)号：US08852999B2
公开(公告)日：2014-10-07
申请号：US13235852
申请日：2011-09-19
IPC分类号： H01L21/00 , H01L33/00 , G06K19/077 , H01L25/16 , H01L21/56 , H01L25/065 , G11C5/04 , H01L23/31 , H01L31/0203 , H01L23/29 , H01L23/28 , H01L21/50 , H01L23/00 , H05K3/00 , H05K1/18
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US20120007226A1
公开(公告)日：2012-01-12
申请号：US13235781
申请日：2011-09-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US20120009732A1
公开(公告)日：2012-01-12
申请号：US13235852
申请日：2011-09-19
IPC分类号： H01L21/56
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
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公开(公告)号：US08022519B2
公开(公告)日：2011-09-20
申请号：US11133576
申请日：2005-05-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：USD548740S1
公开(公告)日：2007-08-14
申请号：US29230382
申请日：2005-05-19
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公开(公告)号：US20080128879A1
公开(公告)日：2008-06-05
申请号：US11679094
申请日：2007-02-26
申请人： Hem Takiar , Shrikar Bhagath , Chin-Tien Chiu , Ong King Hoo
发明人： Hem Takiar , Shrikar Bhagath , Chin-Tien Chiu , Ong King Hoo
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/85186 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and second semiconductor die are separated by a low profile intermediate adhesive layer in which the wire bond loops from the first semiconductor die are embedded. After the intermediate layer is applied, the second semiconductor die may be stacked on top of the intermediate layer. A dielectric layer may be formed on a back surface of the second semiconductor die. As the back side of the second semiconductor die is an electrical insulator, the intermediate layer need not space the wire bond loops from the second semiconductor die as in the prior art, and the apex of bond wires may come into contact with the dielectric layer. The intermediate layer may thus be made thinner in comparison to conventional stacked semiconductor die configurations.
摘要翻译： 公开了一种低剖面半导体封装，其包括至少安装到衬底的第一和第二层叠半导体管芯。 第一半导体管芯和第二半导体管芯由嵌入第一半导体管芯的引线接合环路的低剖面中间粘合剂层分开。 在施加中间层之后，第二半导体管芯可以堆叠在中间层的顶部上。 可以在第二半导体管芯的后表面上形成电介质层。 由于第二半导体管芯的背面是电绝缘体，所以如现有技术那样，中间层不需要与第二半导体管芯的引线接合环空间，并且接合线的顶点可能与介电层接触。 因此，与传统的堆叠半导体管芯配置相比，中间层可以被制成更薄。
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公开(公告)号：US20070004094A1
公开(公告)日：2007-01-04
申请号：US11171095
申请日：2005-06-30
申请人： Hem Takiar , Shrikar Bhagath , Ken Wang
发明人： Hem Takiar , Shrikar Bhagath , Ken Wang
IPC分类号： H01L21/58
CPC分类号： H01L23/49855 , H01L23/49838 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/0224 , H05K1/0253 , H05K1/0271 , H05K2201/09681 , H05K2201/09781 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.
摘要翻译： 公开了用于半导体封装的衬底的表面上的虚拟电路图案，该虚拟电路图案包括直线段，其长度受到控制，以便不在所述线段内产生高于所需应力的应力。 虚拟电路图案可以由线或邻接的或间隔开的多边形（例如六边形）形成。 虚拟电路图案的部分也可以形成为随机选择的取向，尺寸和位置。
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10.发明申请Integrated circuit package having stacked integrated circuits and method therefor 审中-公开具有堆叠集成电路的集成电路封装及其方法公开(公告)号：US20060267173A1
公开(公告)日：2006-11-30
申请号：US11140608
申请日：2005-05-26
申请人： Hem Takiar , Shrikar Bhagath , Ken Ming Wang
发明人： Hem Takiar , Shrikar Bhagath , Ken Ming Wang
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/01004 , H01L2924/14 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.
摘要翻译： 公开了用于在集成电路封装内堆叠集成电路管芯的改进的技术。 这些改进的技术允许集成电路封装内的集成电路管芯的堆叠密度更高。 此外，改进的堆叠技术允许用于将各种集成电路管芯彼此或与衬底电连接的常规焊接技术。 这些改进的方法对于在集成电路封装内堆叠相同尺寸（并且通常是相同功能的）集成电路管芯特别有用。 这种集成电路封装的一个例子是非易失性存储器集成电路封装，其包含堆叠地布置的多个相同大小的存储器集成电路管芯。
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