公开(公告)号：US20220212418A1

公开(公告)日：2022-07-07

申请号：US17453588

申请日：2021-11-04

申请人： Henkel IP & Holding GmbH ,  Henkel AG & Co. KGaA

发明人： Sina Chaeichian ,  Kaspar Schaerer ,  Ruairi O'Kane ,  Li Li ,  Michael D. Halbasch ,  Martin Renkel ,  Omar L. Abu-Shanab ,  Brian Deegan ,  Anna Esmeralda Javier

IPC分类号： B29C65/00

摘要： This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

公开(公告)号：US20240018399A1

公开(公告)日：2024-01-18

申请号：US18471360

申请日：2023-09-21

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan ,  David Branagan ,  Nigel Sweeney ,  Yongxia Wang

IPC分类号： C09J133/10

CPC分类号： C09J133/10 ,  C09J2301/416 ,  C09J2301/408 ,  C09J2301/312

摘要： The present invention relates to a radiation curable (meth)acrylic adhesive composition comprising, consisting essentially of: i) a (meth)acrylated polydiene resin; ii) a multi-functional (meth)acrylic monomer component; iii) a mono-functional (meth)acrylic monomer component; and iv) a photo initiator component.

公开(公告)号：US11697740B2

公开(公告)日：2023-07-11

申请号：US16922065

申请日：2020-07-07

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan ,  Darren Nolan ,  Brendan Kneafsey ,  Mark Loane

IPC分类号： C09D4/06 ,  B29C45/18 ,  C08F2/48 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F220/28 ,  C09D5/00 ,  C09D153/02 ,  C08F285/00 ,  C08F287/00 ,  B29C45/14 ,  B29K23/00 ,  B29K705/02 ,  B29K709/08

CPC分类号： C09D5/002 ,  B29C45/14311 ,  C08F220/281 ,  C08F285/00 ,  C08F287/00 ,  C09D4/06 ,  C09D153/025 ,  B29K2023/00 ,  B29K2705/02 ,  B29K2709/08 ,  C08F220/1811 ,  C08F287/00 ,  C08F220/06 ,  C08F285/00 ,  C08F220/06 ,  C08F285/00 ,  C08F220/1811 ,  C08F285/00 ,  C08F220/285 ,  C08F287/00 ,  C08F220/285 ,  C08F287/00 ,  C08F220/1811 ,  C08F287/00 ,  C08F220/281 ,  C08F220/1811 ,  C08F220/06 ,  C08F230/02 ,  C08F285/00 ,  C08F220/281 ,  C08F220/1811 ,  C08F220/06 ,  C08F230/02

摘要： A curable primer composition comprising:(a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.

公开(公告)号：US11661487B2

公开(公告)日：2023-05-30

申请号：US16713498

申请日：2019-12-13

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan

IPC分类号： C08J7/18 ,  C09J133/08 ,  C09J163/00

CPC分类号： C08J7/18 ,  C09J133/08 ,  C09J163/00 ,  C08J2371/00 ,  C08J2377/00 ,  C08J2379/08 ,  C08J2381/04

摘要： A method of activating a surface of a plastics substrate formed from:



(a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
(b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA);
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
for subsequent bonding,

the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:

includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.




Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

公开(公告)号：US20230272186A1

公开(公告)日：2023-08-31

申请号：US18112046

申请日：2023-02-21

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan ,  Brendan Kneafsey ,  Nigel Sweeney ,  Patrick O'Dwyer ,  Stephen Fearon ,  Gavin Haberlin ,  David Birkett ,  David Condron ,  Marc Hamm ,  Vincent O'Brien

IPC分类号： C08K5/3437 ,  C08F265/06 ,  C08F222/10

CPC分类号： C08K5/3437 ,  C08F265/06 ,  C08F222/102

摘要： The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators may be embraced generally within the structure below




where X is CH2, O, S, NR′, CR″R′″ or C═O; R is hydrogen or (meth)acryl; R6 is hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; and A and A1 are each individually selected from hydrogen or taken together create a ring structure of 5 to 12 total ring atoms, wherein the ring structure may be cycloaliphatic, cycloheteroaliphatic or aromatic or combinations thereof with or without substitution by one or more hydroxyl or (meth)acryl groups; and n is 0 or 1, provided that when R is hydrogen, A and A′ cannot both be hydrogen or taken together cannot be naphthyl.

公开(公告)号：US20240294804A1

公开(公告)日：2024-09-05

申请号：US18605534

申请日：2024-03-14

申请人： Henkel AG & Co. KGaA

发明人： Michael Doherty ,  Brian Deegan ,  Stephen Fearon ,  David Condron ,  Barry Burns

IPC分类号： C09J5/02 ,  B32B37/12 ,  C09J133/04

CPC分类号： C09J5/02 ,  B32B37/1284 ,  C09J133/04 ,  B32B2037/1253 ,  B32B2309/04 ,  B32B2310/0831 ,  B32B2310/0837 ,  B32B2311/30 ,  B32B2457/00 ,  C09J2433/00

摘要： A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising:



(a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface;
(b) activating the primed bonding surface of the first substrate by exposing the primed bonding surface to actinic radiation;
(c) applying, to the so activated bonding surface of the first substrate, and/or or to the bonding surface of the second substrate, a UV curable anaerobic adhesive;
(d) mating the bonding surfaces together with the UV curable anaerobic adhesive therebetween; and
(e) exposing the UV curable anaerobic adhesive between the mated surfaces to actinic UV radiation. The method is particularly suited for obtaining bonds with good tensile shear strength with electrical substrates coated with an insulating varnish.

公开(公告)号：US11926768B2

公开(公告)日：2024-03-12

申请号：US17340259

申请日：2021-06-07

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan ,  Gavin Haberlin ,  Brendan Kneafsey ,  Stephen Fearon

IPC分类号： C09J5/02 ,  B29C65/00 ,  B29C65/48 ,  B29C65/82 ,  C08J5/12 ,  C08J7/12 ,  C09J7/25 ,  C09J7/35 ,  C09J7/38 ,  C09J7/50

CPC分类号： C09J5/02 ,  B29C65/483 ,  B29C65/8215 ,  B29C66/028 ,  B29C66/73921 ,  C08J5/124 ,  C08J7/123 ,  C09J7/255 ,  C09J7/35 ,  C09J7/38 ,  C09J7/50 ,  C08J2361/16 ,  C08J2367/02 ,  C08J2367/03 ,  C08J2379/08 ,  C08J2381/04 ,  C08J2479/08 ,  C08J2481/04 ,  C09J2301/416 ,  C09J2461/008 ,  C09J2467/008 ,  C09J2477/008 ,  C09J2479/088 ,  C09J2481/008

摘要： A method of activating a surface of a plastics substrate formed from:



(a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
(b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA);
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);




for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from
about 0.5 J/cm2 to about 300 J/cm2.
Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

公开(公告)号：US11787911B2

公开(公告)日：2023-10-17

申请号：US17184760

申请日：2021-02-25

申请人： Henkel AG & Co. KGaA

发明人： Brian Deegan

IPC分类号： C08J3/28 ,  C09J5/02 ,  C09J163/00 ,  C08J5/12 ,  C09J133/08 ,  B29C65/00

CPC分类号： C08J3/28 ,  B29C66/026 ,  B29C66/028 ,  C08J5/124 ,  C09J5/02 ,  C09J133/08 ,  C09J163/00 ,  C08J2345/00 ,  C08J2347/00 ,  C08J2371/00 ,  C08J2377/06 ,  C08J2379/08 ,  C08J2381/04

摘要： A method of activating a surface of a plastics substrate formed from:



(a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
(b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA);
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.




Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.