Lithographic apparatus
    1.
    发明授权
    Lithographic apparatus 失效
    平版印刷设备

    公开(公告)号:US07113258B2

    公开(公告)日:2006-09-26

    申请号:US10939999

    申请日:2004-09-14

    摘要: A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer. Simultaneous alignment between marks on the back and front of the wafer and a mask can be performed using a pre-existing alignment system. The lithographic projection apparatus is further provided with immersion system for providing a fluid between the lens and the substrate.

    摘要翻译: 光刻投影装置设置有内置在晶片台中的光学系统,用于产生设置在晶片背面的晶片标记的图像。 图像位于晶片正面的平面上,并且可以通过对准系统从晶片的正面观察。 可以使用预先存在的对准系统来执行晶片背面和前面的标记与掩模之间的同时对准。 光刻投影装置还设置有用于在透镜和基板之间提供流体的浸没系统。

    Lithographic method
    4.
    发明申请
    Lithographic method 审中-公开
    平版印刷法

    公开(公告)号:US20090207399A1

    公开(公告)日:2009-08-20

    申请号:US12318035

    申请日:2008-12-19

    IPC分类号: G03B27/58 G01B11/00

    摘要: A method of calibrating a front to backside alignment capable lithographic apparatus. The method includes attaching a substrate having a plurality of alignment marks to a carrier, the substrate being arranged such that the alignment marks face towards the carrier; reducing the thickness of the substrate; using an alignment system of the apparatus to measure the positions of images of alignment marks formed by optics in a substrate table of the apparatus; projecting a pattern onto the substrate, the position of the pattern being determined according to the measured positions of the alignment marks; measuring the positions of the projected pattern and the alignment marks provided on the opposite side of the substrate, the position of the alignment marks provided on the opposite side of the substrate being measured by the alignment system directing radiation through the substrate; and comparing the measured positions in order to determine an overlay error.

    摘要翻译: 校准从前到后对准的光刻设备的方法。 所述方法包括将具有多个对准标记的基板附接到载体上,所述基板布置成使得所述对准标记朝向所述载体; 减小基板的厚度; 使用所述装置的对准系统来测量由所述装置的衬底台中的光学元件形成的对准标记的图像的位置; 将图案投影到基板上,根据对准标记的测量位置确定图案的位置; 测量投影图案的位置和设置在基板的相对侧上的对准标记,设置在基板的相对侧上的对准标记的位置由通过基板引导辐射的对准系统测量; 并比较测量位置以确定重叠误差。

    Lithographic projection mask, device manufacturing method, and device manufactured thereby
    5.
    发明授权
    Lithographic projection mask, device manufacturing method, and device manufactured thereby 失效
    平版印刷掩模,器件制造方法以及由此制造的器件

    公开(公告)号:US07019814B2

    公开(公告)日:2006-03-28

    申请号:US10738977

    申请日:2003-12-19

    IPC分类号: G03B27/42 G03B27/52

    CPC分类号: G03F9/7084 G03F9/7076

    摘要: A method according to one embodiment of the invention may be used in determining relative positions of developed patterns on a substrate (exposed e.g. using the step mode). Such a method uses reference marks which are located within or even superimposed on device patterns. Also disclosed is a mask of a lithographic projection apparatus including reference marks that may be used in such a method.

    摘要翻译: 根据本发明的一个实施例的方法可用于确定显影图案在基底上的相对位置(例如使用步骤模式曝光)。 这种方法使用位于设备图案内或甚至叠加在设备图案上的参考标记。 还公开了包括可以以这种方法使用的参考标记的光刻投影设备的掩模。

    Device manufacturing method and a calibration substrate
    8.
    发明授权
    Device manufacturing method and a calibration substrate 失效
    器件制造方法和校准基板

    公开(公告)号:US07501215B2

    公开(公告)日:2009-03-10

    申请号:US11167578

    申请日:2005-06-28

    IPC分类号: G03F9/00 G03C5/00

    摘要: The present invention relates to a device manufacturing method wherein a plurality of front side marks are manufactured on the front side of the substrate. These marks are used to locally align the substrate when exposing. After certain processing steps, the positions of the front side marks are measured and compared with respect to their original positions. The measured position changes of the front side marks, i.e. their behaviour, can then be analyzed. The original positions and actual positions are defined with respect to a nominal grid which is defined using global alignment marks which are positioned at the back side of the substrate. Because the global alignment marks are positioned at the back side, they are not affected by any processing step.

    摘要翻译: 本发明涉及一种器件制造方法,其中在基板的正面上制造多个正面标记。 这些标记用于在曝光时局部对准衬底。 在一些处理步骤之后,测量前侧标记的位置并相对于其原始位置进行比较。 然后可以分析前侧标记的测量位置变化,即其行为。 原始位置和实际位置相对于使用位于基板背面的全局对准标记定义的标称网格而定义。 因为全局对准标记位于后侧,所以它们不受任何处理步骤的影响。

    Alternate side lithographic substrate imaging
    10.
    发明授权
    Alternate side lithographic substrate imaging 失效
    备用侧光刻基片成像

    公开(公告)号:US07320847B2

    公开(公告)日:2008-01-22

    申请号:US10705218

    申请日:2003-11-12

    IPC分类号: G03F9/00

    CPC分类号: G03F9/7003

    摘要: A device manufacturing method capable of imaging structures on one side of a substrate aligned to markers on the other side, is presented herein. One embodiment of the present invention comprises providing a first substrate having first and second surfaces, patterning the first surface of the substrate with at least one reversed alignment marker, providing a protective layer over the alignment marker, and bonding the first surface of the first substrate to a second substrate. The embodiment further includes locally etching the first substrate as far as the protective layer to form a trench around the reversed alignment marker, and forming at least one patterned layer on the second surface using a lithographic projection apparatus having a front-to-backside alignment system while aligning the substrate to the alignment markers revealed in each trench.

    摘要翻译: 本文提供了能够对与另一侧的标记对准的衬底的一侧上的结构进行成像的器件制造方法。 本发明的一个实施例包括提供具有第一表面和第二表面的第一衬底,用至少一个反向对准标记图案化衬底的第一表面,在对准标记上提供保护层,以及将第一衬底的第一表面 到第二基板。 该实施例还包括局部蚀刻第一衬底至保护层,以形成围绕反向对准标记的沟槽,以及使用具有前后对准系统的光刻投影装置在第二表面上形成至少一个图案化层 同时将衬底对准每个沟槽中显示的对准标记。