摘要:
Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.
摘要:
An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.
摘要:
To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.
摘要:
An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.
摘要:
A photon-emission microscope method and system are described which allow both emission spot localization and continuous spectral analysis of the emited light from the emission spot of a biased electronic circuit. The system includes an emission microscope, a detector and an in-line, direct vision, chromatically dispersing prismatic device. The microscope system advantageously uses only one detector which does not need to be moved to be able to detect both the localization and spectral images. In a particular embodiment, localization of emission spots may be performed using monochromatic light which allows sharp images of the electronic circuit despite the fact that the electronic circuit is viewed through the dispersing device. Further, an improved procedure is described for overcoming errors caused by saturation of the detector at high sensitivities.