Method of coating a surface of a substrate with a metal by electroplating
    1.
    发明申请
    Method of coating a surface of a substrate with a metal by electroplating 审中-公开
    通过电镀用金属涂覆基材表面的方法

    公开(公告)号:US20070062817A1

    公开(公告)日:2007-03-22

    申请号:US11266798

    申请日:2005-11-04

    IPC分类号: C25D3/38

    摘要: The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the said surface to be coated is brought into contact with an electroplating bath while the said surface is not under electrical bias; a step of forming the coating during which the said surface is biased; a step during which the said surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40 mM; and at least one copper complexing agent.

    摘要翻译: 本发明的目的是通过电镀用铜涂覆基底表面的方法。 根据本发明,该方法包括:在所述表面不受电偏压的情况下使所述待涂覆的所述表面与电镀槽接触的步骤; 形成所述表面偏压的涂层的步骤; 所述表面在电气偏压下与电镀浴分离的步骤; 上述电镀浴在溶剂溶液中包含:铜离子源,浓度为0.4至40mM; 和至少一种铜络合剂。

    Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
    2.
    发明申请
    Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices 有权
    用于在半导体器件的制造中直接镀铜和填充以形成互连的方法和组合物

    公开(公告)号:US20070272560A1

    公开(公告)日:2007-11-29

    申请号:US11708293

    申请日:2007-02-20

    IPC分类号: C25D3/38 H01L21/44

    摘要: The object of the present invention is a method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices. According to the invention, this method comprises providing an electrolytic copper bath containing, in solution in a solvent, a source of copper ions with a concentration of between 45 and 200 mM, preferably of between 45 and 100 mM and at least one copper complexing agent which is an aliphatic polyamine having 2 to 4 amine functions with a concentration of between 30 and 200 mM, preferably of between 60 and 200 mM; the copper/complexing agent(s) molar ratio being of between 0.2 and 2, preferably between 0.3 and 1.5; bringing said copper diffusion barrier layer of said substrate into contact with said electrolytic copper bath, applying an electrical bias to the substrate for a duration adjusted according to the thickness of copper to be electroplated, removing the substrate from said electrolytic copper bath.

    摘要翻译: 本发明的目的是在半导体器件的制造中直接镀铜和填充以形成互连的方法和组合物。 根据本发明,该方法包括提供一种电解铜浴,其在溶剂中含有浓度为45-200mM,优选45-100mM的铜离子源和至少一种铜络合剂 其是具有2至4个胺官能团的脂族多胺,其浓度为30至200mM,优选为60至200mM; 铜/络合剂的摩尔比为0.2至2,优选0.3至1.5; 使所述衬底的所述铜扩散阻挡层与所述电解铜浴接触,向所述衬底施加电偏压持续时间,以根据要电镀的铜的厚度调节,从所述电解铜浴移除衬底。

    Electroplating composition intended for coating a surface of a substrate with a metal
    3.
    发明申请
    Electroplating composition intended for coating a surface of a substrate with a metal 审中-公开
    用于用金属涂覆基材表面的电镀组合物

    公开(公告)号:US20070062818A1

    公开(公告)日:2007-03-22

    申请号:US11266799

    申请日:2005-11-04

    IPC分类号: C25D3/38

    摘要: The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer in the fabrication of interconnects for integrated circuits. According to the invention, this composition comprises, in solution in a solvent: a source of copper ions, in a concentration of between 0.4 and 40 mM; at least one copper complexing agent chosen from the group comprising primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the said composition being less than 7, preferably between 3.5 and 6.5.

    摘要翻译: 本发明的目的是一种电镀组合物,其特别用于在制造用于集成电路的互连件中涂覆铜扩散阻挡层。 根据本发明,该组合物在浓度为0.4至40mM之间的溶剂溶液中包含铜离子源; 选自伯脂族胺,仲脂族胺,叔脂族胺,芳族胺,氮杂环和肟的至少一种铜络合剂; 铜/络合剂的摩尔比在0.1和2.5之间,优选在0.3和1.3之间; 并且所述组合物的pH小于7,优选3.5至6.5。

    Bicycle rear wheel suspension system
    8.
    发明授权
    Bicycle rear wheel suspension system 失效
    自行车后轮悬挂系统

    公开(公告)号:US08235409B2

    公开(公告)日:2012-08-07

    申请号:US12901893

    申请日:2010-10-11

    IPC分类号: B62K25/28 B62K25/04

    CPC分类号: B62K25/04 B62K25/286

    摘要: A bicycle frame assembly having a number of rotatable members configured to absorb shocks and impacts associated with operation of the bicycle. The assembly includes a frame constructed to support a rider and a chain stay having a rearward end that extends toward a wheel hub and a forward end that is pivotably connected to the frame. An absorber is pivotably connected to the forward end of the chain stay and extends to a rocker arm that is pivotably connected to the frame. A seat stay is pivotably connected to a rearward end of the rocker arm and extends to the rearward end of the chain stay. The rearward ends of the seat stay and the chain stay are pivotably connected to rotate about a common axis.

    摘要翻译: 一种具有多个可旋转构件的自行车车架组件,其构造成吸收与自行车的操作相关的冲击和冲击。 该组件包括构造成支撑骑手的框架和具有朝向轮毂延伸的后端的链条撑杆和可枢转地连接到框架的前端。 吸收器可枢转地连接到链条的前端并且延伸到可枢转地连接到框架的摇臂。 座椅支架可枢转地连接到摇臂的后端并延伸到链条的后端。 座椅支柱和链条支柱的后端可枢转地连接以围绕公共轴线旋转。

    Bicycle Rear Wheel Suspension System
    9.
    发明申请
    Bicycle Rear Wheel Suspension System 失效
    自行车后轮悬挂系统

    公开(公告)号:US20110025015A1

    公开(公告)日:2011-02-03

    申请号:US12901893

    申请日:2010-10-11

    IPC分类号: B62K25/04 B62K3/02

    CPC分类号: B62K25/04 B62K25/286

    摘要: A bicycle frame assembly having a number of rotatable members configured to absorb shocks and impacts associated with operation of the bicycle. The assembly includes a frame constructed to support a rider and a chain stay having a rearward end that extends toward a wheel hub and a forward end that is pivotably connected to the frame. An absorber is pivotably connected to the forward end of the chain stay and extends to a rocker arm that is pivotably connected to the frame. A seat stay is pivotably connected to a rearward end of the rocker arm and extends to the rearward end of the chain stay. The rearward ends of the seat stay and the chain stay are pivotably connected to rotate about a common axis.

    摘要翻译: 一种具有多个可旋转构件的自行车车架组件,其构造成吸收与自行车的操作相关的冲击和冲击。 该组件包括构造成支撑骑手的框架和具有朝向轮毂延伸的后端的链条撑杆和可枢转地连接到框架的前端。 吸收器可枢转地连接到链条的前端并且延伸到可枢转地连接到框架的摇臂。 座椅支架可枢转地连接到摇臂的后端并延伸到链条的后端。 座椅支柱和链条支柱的后端可枢转地连接以围绕公共轴线旋转。

    Bicycle derailleur system
    10.
    发明授权
    Bicycle derailleur system 有权
    自行车拨链器系统

    公开(公告)号:US07703785B2

    公开(公告)日:2010-04-27

    申请号:US11839931

    申请日:2007-08-16

    IPC分类号: B62M1/02

    CPC分类号: B62K25/286 B62M9/125

    摘要: A bicycle derailer assembly that is mounted concentrically with an axle of a rear wheel assembly. The derailer is constructed to be mounted to the bicycle such that the derailer is pivotable about a common axis with the rear wheel and such that the rear wheel can be removed from the bicycle without interfering with the connection of the derailer to the bicycle. The derailer system provides a derailer that is robust and reduces interference of the derailer with the performance of bicycle maintenance.

    摘要翻译: 与后轮组件的轴同心安装的自行车脱轨器组件。 脱轨器被构造成安装到自行车上,使得脱轨器可以绕与后轮的共同轴线枢转,并且使得后轮可以从自行车上移除而不会干扰脱轨器与自行车的连接。 脱轨器系统提供了一个稳固的脱轨器,并减少了脱轨器与自行车维护性能的干扰。