公开(公告)号：US07978939B2

公开(公告)日：2011-07-12

申请号：US12140052

申请日：2008-06-16

申请人： Hideaki Ozawa ,  Kenji Yamazaki ,  Tomoki Umezawa

发明人： Hideaki Ozawa ,  Kenji Yamazaki ,  Tomoki Umezawa

IPC分类号： G02B6/12 ,  G02B6/36

CPC分类号： G02B6/4214 ,  G02B6/4246 ,  G02B6/4249 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： An optical module comprises: an optical element array comprising plural optical elements that emits or receives light; and an optical waveguide comprising a clad and plural cores respectively with optical path changing portions, the cores being disposed in the clad with an interval. The optical path changing portions are optically connected to the optical elements. The optical path changing portions are arranged in a first direction having an angle with respect to a formation direction of the cores, the first direction being corresponding to an arrangement direction of said plurality of optical elements.

摘要翻译： 光学模块包括：包括发射或接收光的多个光学元件的光学元件阵列; 以及光波导，其包括分别具有光路改变部的包层和多个芯，所述芯以间隔设置在所述包层中。 光路改变部分光学连接到光学元件。 光路改变部分沿相对于芯的形成方向具有角度的第一方向布置，第一方向对应于所述多个光学元件的排列方向。

公开(公告)号：US06378994B1

公开(公告)日：2002-04-30

申请号：US09650668

申请日：2000-08-30

申请人： Yoshihisa Ueda ,  Koji Ikegami ,  Masaki Kataoka ,  Kazuyuki Oda ,  Toshinobu Hamazaki ,  Koichi Saitoh ,  Kohzo Hara ,  Kenji Yamazaki ,  Norikuni Funatsu ,  Takayuki Takeuchi ,  Kunihito Satou ,  Ichiro Tomikawa ,  Tomoki Umezawa ,  Michiaki Murata

发明人： Yoshihisa Ueda ,  Koji Ikegami ,  Masaki Kataoka ,  Kazuyuki Oda ,  Toshinobu Hamazaki ,  Koichi Saitoh ,  Kohzo Hara ,  Kenji Yamazaki ,  Norikuni Funatsu ,  Takayuki Takeuchi ,  Kunihito Satou ,  Ichiro Tomikawa ,  Tomoki Umezawa ,  Michiaki Murata

IPC分类号： B41J205

CPC分类号： B41J2/14024 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1604 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642

摘要： The present invention provides a liquid jet printing head, a method of manufacturing the same, and a liquid jet printing apparatus, which allow stable, high speed, and continuous printing. A liquid jet printing head provides an inflow of liquid from an inlet to a common chamber, then along with the surface of heating elements of a heating element substrate and with a wall of a housing to separate channels. Liquid drops will be ejected by heating the heating elements. Since liquid may flow linearly from the inlet to the separate channels in accordance with the present invention, smooth flow promotes evacuation of bubbles through a nozzle, while cooling the heating element substrate with liquid flowing along with the substrate. The present invention provides thereby stable printing with high speed, continuous ejection (printing) of liquid drops.

摘要翻译： 本发明提供了一种液体喷射打印头，其制造方法和液体喷射打印装置，其允许稳定，高速和连续打印。 液体喷射打印头提供液体从入口到公共室的流入，然后与加热元件基底的加热元件的表面以及壳体的壁分离以分离通道。 通过加热加热元件将喷出液滴。 由于根据本发明液体可以从入口线路流到分离的通道，所以平稳流动促进气泡通过喷嘴排出，同时用液体与基底一起流动的液体冷却加热元件基板。 本发明提供了以液滴的高速，连续喷射（印刷）的稳定印刷。

公开(公告)号：US06659600B2

公开(公告)日：2003-12-09

申请号：US09862319

申请日：2001-05-23

申请人： Kazuyuki Oda ,  Koji Ikegami ,  Tomoki Umezawa ,  Ichiro Tomikawa ,  Masaki Kataoka ,  Kenji Yamazaki ,  Norikuni Funatsu ,  Yoshihisa Ueda ,  Kohzo Hara ,  Takayuki Takeuchi ,  Kunihito Satou ,  Toshinobu Hamazaki ,  Koichi Saitoh

发明人： Kazuyuki Oda ,  Koji Ikegami ,  Tomoki Umezawa ,  Ichiro Tomikawa ,  Masaki Kataoka ,  Kenji Yamazaki ,  Norikuni Funatsu ,  Yoshihisa Ueda ,  Kohzo Hara ,  Takayuki Takeuchi ,  Kunihito Satou ,  Toshinobu Hamazaki ,  Koichi Saitoh

IPC分类号： B41J219

CPC分类号： B41J2/17513 ,  B41J2/175 ,  B41J2/19

摘要： The present invention provides an inkjet recording head cartridge and an inkjet recording apparatus that have a simple structure and high reliability. Since individual flow passages in which ink emission orifices are formed are communicated directly with a rectangular ink supply chamber, it is prevented that a bubble of such a size as to cause printing defects rises through an ink supply chamber and blocks the individual flow passages. Also, since ink heated within the ink supply chamber is moved upward to the ink tank chamber by convection and grows an air lump sealed beforehand, it is prevented that a bubble will grow in the ink supply chamber. Furthermore, by allocating a large cross-sectional area to the ink supply chamber, it is prevented that meniscus oscillation of the ink emission orifices is amplified by pressure oscillation caused by ink emission and causes a printing defect. Therefore, reliable printing can be performed with a simple construction.

公开(公告)号：US07407595B2

公开(公告)日：2008-08-05

申请号：US11184804

申请日：2005-07-20

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： B29D11/00

CPC分类号： G02B6/42 ,  G02B6/12002 ,  G02B6/1221 ,  G02B6/4214 ,  G02B2006/12104

摘要： A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plate-like member, forming a combined body, in which the inclined surfaces and the openings correspond to each other, by bonding the wafer and the plate-like member, and dividing the combined body into small pieces each of which includes the inclined surface and the opening.

摘要翻译： 用于连接到设置在基板中的光波导路径的用于光路转换的光学部件的制造方法包括通过蚀刻在晶片上形成多个倾斜表面，形成对应于板状部件中的倾斜表面的开口，形成组合 主体，其中倾斜表面和开口彼此对应，通过粘合晶片和板状构件，并将组合体分成小片，每个小片包括倾斜表面和开口。

公开(公告)号：US20070183707A1

公开(公告)日：2007-08-09

申请号：US11525819

申请日：2006-09-25

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： G02B6/12

CPC分类号： G02B6/4204 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4292

摘要： An optical connector includes: a board having a first signal-light propagation medium with a first optical signal end; and a chassis disposed on the board. The chassis includes: an insertion-and-removal section having an insertion-hole forming wall that defines an insertion hole, into which a second optical signal end of a second signal-light propagation medium is removably inserted. The wall has: a support surface. supporting a side face portion of the second signal end; and an abutting surface on which abuts a front-end portion of the second signal end. The chassis further includes an optical connection section provided with a through-hole forming wall defining a through hole optically connecting the first signal end with the inserted second signal. The optical connector further includes a biasing member that positions the second signal end inserted into the insertion-and-removal section by biasing the second signal end to both the abutting and support surfaces.

摘要翻译： 光连接器包括：具有第一信号光传播介质和第一光信号端的板; 以及设置在板上的底盘。 底盘包括：插入和移除部分，其具有限定插入孔的插入孔形成壁，第二信号光传播介质的第二光学信号端可拆卸地插入该插入孔中。 墙壁有：支撑面。 支撑第二信号端的侧面部分; 以及邻接表面，其邻接第二信号端的前端部分。 底盘还包括设置有通孔形成壁的光学连接部分，该通孔形成壁限定了将第一信号端与插入的第二信号光学连接的通孔。 光学连接器还包括偏置构件，其通过将第二信号端偏压到抵接和支撑表面而将插入到插入和移除部分中的第二信号端定位。

公开(公告)号：US20060215982A1

公开(公告)日：2006-09-28

申请号：US11184804

申请日：2005-07-20

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： G02B6/10

CPC分类号： G02B6/42 ,  G02B6/12002 ,  G02B6/1221 ,  G02B6/4214 ,  G02B2006/12104

摘要： A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plate-like member, forming a combined body, in which the inclined surfaces and the openings correspond to each other, by bonding the wafer and the plate-like member, and dividing the combined body into small pieces each of which includes the inclined surface and the opening.

摘要翻译： 用于连接到设置在基板中的光波导路径的用于光路转换的光学部件的制造方法包括通过蚀刻在晶片上形成多个倾斜表面，形成对应于板状部件中的倾斜表面的开口，形成组合 主体，其中倾斜表面和开口彼此对应，通过粘合晶片和板状构件，并将组合体分成小片，每个小片包括倾斜表面和开口。

公开(公告)号：US20060210217A1

公开(公告)日：2006-09-21

申请号：US11295610

申请日：2005-12-07

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： G02B6/12

CPC分类号： G02B6/4221 ,  G02B6/4225 ,  G02B6/4227 ,  G02B6/4232 ,  G02B6/4249

摘要： An optical module mounting method for mounting an optical module including a plurality of light emitting points onto a substrate including an optical waveguide is provided. The method includes mounting the optical module on the substrate such that a surface of the optical module including the plurality of light emitting points faces one end of the optical waveguide; measuring optical coupling efficiency between each of the light emitting points and the optical waveguide; and selecting a light emitting point to be used based on the optical coupling efficiency measurements.

摘要翻译： 提供了一种用于将包括多个发光点的光学模块安装到包括光波导的基板上的光学模块安装方法。 该方法包括将光学模块安装在基板上，使得包括多个发光点的光学模块的表面面向光波导的一端; 测量每个发光点和光波导之间的光耦合效率; 以及基于光耦合效率测量来选择要使用的发光点。

公开(公告)号：US07362926B2

公开(公告)日：2008-04-22

申请号：US11525819

申请日：2006-09-25

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/36

CPC分类号： G02B6/4204 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4292

摘要： An optical connector includes: a board having a first signal-light propagation medium with a first optical signal end; and a chassis disposed on the board. The chassis includes: an insertion-and-removal section having an insertion-hole forming wall that defines an insertion hole, into which a second optical signal end of a second signal-light propagation medium is removably inserted. The wall has: a support surface. supporting a side face portion of the second signal end; and an abutting surface on which abuts a front-end portion of the second signal end. The chassis further includes an optical connection section provided with a through-hole forming wall defining a through hole optically connecting the first signal end with the inserted second signal. The optical connector further includes a biasing member that positions the second signal end inserted into the insertion-and-removal section by biasing the second signal end to both the abutting and support surfaces.

摘要翻译： 光连接器包括：具有第一信号光传播介质和第一光信号端的板; 以及设置在板上的底盘。 底盘包括：插入和移除部分，其具有限定插入孔的插入孔形成壁，第二信号光传播介质的第二光学信号端可拆卸地插入该插入孔中。 墙壁有：支撑面。 支撑第二信号端的侧面部分; 以及邻接表面，其邻接第二信号端的前端部分。 底盘还包括设置有通孔形成壁的光学连接部分，该通孔形成壁限定了将第一信号端与插入的第二信号光学连接的通孔。 光学连接器还包括偏置构件，其通过将第二信号端偏压到抵接和支撑表面而将插入到插入和移除部分中的第二信号端定位。

公开(公告)号：US20070058910A1

公开(公告)日：2007-03-15

申请号：US11399386

申请日：2006-04-07

申请人： Tomoki Umezawa

发明人： Tomoki Umezawa

IPC分类号： G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4203

摘要： A light transmitting/receiving element includes a first base member, a second base member, an exiting window, and a transmitting portion. A surface light-emitting element is formed on a top surface of the first base member. The second base member is provided on the first base member, and a light-receiving element is formed on a top surface of the second base member. The exiting window is provided at the light-receiving element. Light, which the surface light-emitting element emits, exits from the exiting window. The transmitting portion is provided between the exiting window and the surface light-emitting element, and the light passes through the transmitting portion.

摘要翻译： 光发射/接收元件包括第一基底构件，第二基底构件，出射窗口和透射部分。 表面发光元件形成在第一基底构件的顶表面上。 第二基体部件设置在第一基体部件上，在第二基体部件的上表面上形成有光接收元件。 退出的窗口设置在光接收元件处。 表面发光元件发射的光从出射窗口射出。 透射部分设置在出射窗和表面发光元件之间，光通过透射部分。

公开(公告)号：US07490985B2

公开(公告)日：2009-02-17

申请号：US11204020

申请日：2005-08-16

申请人： Brian Ormond ,  Tomoki Umezawa

发明人： Brian Ormond ,  Tomoki Umezawa

IPC分类号： A61B6/08 ,  G21K5/00

CPC分类号： H05K3/303 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0274 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An arrangement device including: a photography section, which photographs a first mark and a second mark in a state in which a semiconductor integrated circuit to which the first mark is applied and a member to which the second mark is applied, which member is to be used in combination with the semiconductor integrated circuit, overlap; and a movement section, which relatively moves at least one of the semiconductor integrated circuit and the member with respect to the other thereof on the basis of positions of the first mark and the second mark which have been photographed by the photography section.

摘要翻译： 一种布置装置，包括：拍摄部，其在施加有第一标记的半导体集成电路和应用了第二标记的构件的状态下拍摄第一标记和第二标记，该成员将是 与半导体集成电路结合使用，重叠; 以及运动部，其基于由摄影部拍摄的第一标记和第二标记的位置，相对于另一方相对于半导体集成电路和构件中的至少一个相对移动。