公开(公告)号：US4347304A

公开(公告)日：1982-08-31

申请号：US277049

申请日：1981-06-24

申请人： Hideki Sakurai ,  Mitsuo Nakatani ,  Hitoshi Oka ,  Hitoshi Yokono ,  Tokio Isogai

发明人： Hideki Sakurai ,  Mitsuo Nakatani ,  Hitoshi Oka ,  Hitoshi Yokono ,  Tokio Isogai

IPC分类号： G03C5/58 ,  G03F7/004 ,  H05K3/18 ,  G03C5/00

CPC分类号： H05K3/185 ,  G03C5/58 ,  G03F7/0043 ,  Y10S430/143

摘要： Metallic images of uniform quality can be formed on substrates having through-holes by a process using a positive type resist characterized by using as a coating solution for the substrate a solution of a photosensitive material of (a) at least one organic compound having at least one linkage of --M--M--M ).sub.n (M=Si, Ge or Sn; n=0, 1 or more) in the molecule or (b) a mixture of at least one organic compound (a) mentioned above and at least one photosensitizer, dissolved in a solvent such as a halogenated hydrocarbon, an aromatic hydrocarbon, a heterocyclic compound, or a mixture thereof, followed by irradiation with an actinic light through a photomask and electroless plating.

摘要翻译： 可以通过使用正型抗蚀剂的方法在具有通孔的基板上形成具有均匀质量的金属图像，其特征在于使用作为基底的涂布溶液的（a）至少一种有机化合物的感光材料的溶液，所述有机化合物至少具有 分子中nMM（M = Si，Ge或Sn; n = 0,1或更多）的一个连接，或（b）上述至少一种有机化合物（a）和至少一种光敏剂的混合物， 溶解在溶剂如卤代烃，芳族烃，杂环化合物或其混合物中，然后通过光掩模和化学镀被光化的光照射。

公开(公告)号：US4310563A

公开(公告)日：1982-01-12

申请号：US197150

申请日：1980-10-15

申请人： Hitoshi Oka ,  Kenji Nakamura ,  Hitoshi Yokono ,  Tokio Isogai ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka

发明人： Hitoshi Oka ,  Kenji Nakamura ,  Hitoshi Yokono ,  Tokio Isogai ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka

IPC分类号： G01N27/333 ,  C23C18/16 ,  G01N27/30 ,  G01N27/416 ,  C23C3/02 ,  B05D1/18

CPC分类号： C23C18/1683

摘要： The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH.A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.

摘要翻译： 通过使用通过在0.1-1N无机酸中蚀刻金属铜制备的氧化铜，然后在0.1-1N的碱金属氢氧化物水溶液中氧化蚀刻的金属铜，化学镀铜溶液的pH被长时间精确地测量 作为用于pH测量的主要电极或根据pH的还原剂浓度测量。 用于测量铜离子浓度和络合剂的众所周知的测量方法的组合可以精确地测量还原剂，铜离子和络合剂的pH值和浓度，持续比常规方法更长的时间。

公开(公告)号：US4303443A

公开(公告)日：1981-12-01

申请号：US159231

申请日：1980-06-13

申请人： Osamu Miyazawa ,  Hitoshi Oka ,  Isamu Tanaka ,  Akira Matsuo ,  Hitoshi Yokono ,  Nobuo Nakagawa ,  Tokio Isogai

发明人： Osamu Miyazawa ,  Hitoshi Oka ,  Isamu Tanaka ,  Akira Matsuo ,  Hitoshi Yokono ,  Nobuo Nakagawa ,  Tokio Isogai

IPC分类号： C23C18/40 ,  C23C3/02

CPC分类号： C23C18/40

摘要： When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.2 OH, is used as a complexing agent for cupric ions and a nitrogen-containing cyclic compound is used as a complexing agent for cuprous ions in an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent and a stabilizer, or an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent, a stabilizer and a complexing agent for cuprous ions, the plating rate of the electroless copper plating solution, mechanical strength of plating film, and stability of the plating solution are improved.

摘要翻译： 当使用在一个分子中具有至少两个聚烯烃二醇链的胺化合物作为稳定剂和亚烷基二胺化合物时，其各氨基中的至少一个氢原子被CH 2 COOX（其中X是H或Na）取代，和 在其氨基中的另一个氢原子被CH 2 OH取代，用作铜离子的络合剂，并且含氮环状化合物用作含有水，水的无电镀铜溶液中的亚硝酸根离子的络合剂 可溶性铜盐，铜离子络合剂，还原剂，pH控制剂和稳定剂，或包含水，水溶性铜盐，铜离子络合剂，还原剂的化学镀铜溶液 药剂，pH控制剂，稳定剂和亚铜离子络合剂，化学镀铜溶液的电镀速率，电镀膜的机械强度和稳定剂 改善了电镀溶液的性能。

公开(公告)号：US4324629A

公开(公告)日：1982-04-13

申请号：US160201

申请日：1980-06-17

申请人： Hitoshi Oka ,  Hiroshi Kikuchi ,  Hitoshi Yokono ,  Haruo Suzuki ,  Toyofusa Yoshimura ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka ,  Tokio Isogai

发明人： Hitoshi Oka ,  Hiroshi Kikuchi ,  Hitoshi Yokono ,  Haruo Suzuki ,  Toyofusa Yoshimura ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka ,  Tokio Isogai

IPC分类号： C23C18/16 ,  C23C18/31 ,  C23G1/36 ,  C25D21/16 ,  B01D13/02

CPC分类号： B01D61/44 ,  C23C18/1617 ,  B01D2311/04 ,  Y10S204/13

摘要： During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution.These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

摘要翻译： 在循环使用化学镀铜溶液时，与铜离子相反的阴离子，通过还原剂的氧化形成的阴离子，以及二氧化碳从空气中吸收二氧化碳，这些都对电镀具有抑制作用，还有钠离子 在电镀溶液中没有积累抑制作用。 这些积聚的离子可以通过电渗析去除。 特别地，通过在电渗析之前将所使用的化学镀溶液的pH调节至2-11，并且在电渗析中使用选择性的单价阴离子可渗透膜作为阴离子交换膜，可以令人满意地再生。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

公开(公告)号：US5633175A

公开(公告)日：1997-05-27

申请号：US373769

申请日：1995-01-17

申请人： Hiroshi Kikuchi ,  Yasushi Sano ,  Satoru Todoroki ,  Hitoshi Oka ,  Toshiyuki Koshita ,  Masato Kikuchi ,  Mitsuo Nakatani ,  Michio Tsukii

发明人： Hiroshi Kikuchi ,  Yasushi Sano ,  Satoru Todoroki ,  Hitoshi Oka ,  Toshiyuki Koshita ,  Masato Kikuchi ,  Mitsuo Nakatani ,  Michio Tsukii

IPC分类号： C11D7/32 ,  G02F1/1362 ,  G03F7/42 ,  B08B3/08 ,  B08B3/10 ,  H01L21/335

CPC分类号： C11D7/3218 ,  G03F7/425 ,  G02F1/1362 ,  Y10S438/951

摘要： A liquid crystal display device is produced by effecting in the course of its production steps a resist-peeling method including the steps of (a) changing the quality of a resist layer on a substrate, (b) contacting the changed resist with a liquid containing 2-amino-1-ethanol, and (c) removing the liquid containing the thus peeled resist from the surface of the etched resist, and optionally, (d) regenerating a liquid containing 2-amino-1-ethanol by distillation from the liquid used in step (c) and reusing the regenerated liquid in step (b).

摘要翻译： 通过在其制造步骤中进行抗蚀剂剥离方法来制造液晶显示装置，该方法包括以下步骤：（a）改变基板上的抗蚀剂层的质量，（b）使改变的抗蚀剂与含有 2-氨基-1-乙醇，和（c）从蚀刻抗蚀剂的表面除去含有这样剥离的抗蚀剂的液体，任选地，（d）通过蒸馏从液体中再生含有2-氨基-1-乙醇的液体 在步骤（c）中使用并在步骤（b）中重新使用再生液体。

公开(公告)号：US5399202A

公开(公告)日：1995-03-21

申请号：US986683

申请日：1992-12-08

申请人： Hiroshi Kikuchi ,  Yasushi Sano ,  Satoru Todoroki ,  Hitoshi Oka ,  Toshiyuki Koshita ,  Masato Kikuchi ,  Mitsuo Nakatani ,  Michio Tsukii

发明人： Hiroshi Kikuchi ,  Yasushi Sano ,  Satoru Todoroki ,  Hitoshi Oka ,  Toshiyuki Koshita ,  Masato Kikuchi ,  Mitsuo Nakatani ,  Michio Tsukii

IPC分类号： C23F1/00 ,  C09D9/00 ,  C11D7/32 ,  G02F1/1362 ,  G03F7/42 ,  H01L21/027 ,  H01L21/30 ,  H01L21/302 ,  H01L21/3065 ,  H05K3/06 ,  B08B3/08 ,  B08B3/10

CPC分类号： C11D7/3281 ,  C11D7/3218 ,  G03F7/425 ,  G02F1/1362

摘要： A resist is peeled without leaving a residue after peeling, by bringing a resist-peeling liquid comprising a primary aliphatic amine of 2-6 carbon atoms into contact with the surface of an etched novolak positive photoresist, and removing the resist-peeling liquid containing the thus peeled resist from the surface of the etched resist. The used resist-peeling liquid can easily be recovered and regenerated.

摘要翻译： 通过使包含2-6个碳原子的脂肪族脂族胺的抗蚀剂剥离液与蚀刻的酚醛清漆型正性光致抗蚀剂的表面接触，除去剥离后的残留物，除去含有 从而从蚀刻抗蚀剂的表面剥离抗蚀剂。 所使用的抗蚀剂剥离液可以容易地回收和再生。

公开(公告)号：US20070257228A1

公开(公告)日：2007-11-08

申请号：US10581277

申请日：2004-12-03

申请人： Takeo Tsukada ,  Tomohisa Azuma ,  Masakazu Hirose ,  Hitoshi Oka

发明人： Takeo Tsukada ,  Tomohisa Azuma ,  Masakazu Hirose ,  Hitoshi Oka

IPC分类号： H01L41/083

CPC分类号： C04B35/475 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3224 ,  C04B2235/3227 ,  H01L41/187

摘要： A piezoelectric ceramics having ceramic particles, wherein said ceramic particles comprises bismuth layer compound containing at least Sr, Ln (note that Ln is a lanthanoid element), Bi, Ti and O and including MIIBi4Ti4O15 type crystal (MII is an element composed of Sr and Ln) as a main component, and an oxide of Mn as a subcomponent; and an average particle diameter by the code length measuring method is 0.8 to 4.7 μm: by which it is possible to provide piezoelectric ceramics having a large Qmax in a third harmonic mode of thickness vertical vibration in a relatively high frequency band (for example, 16 to 65 MHz), a resonator an other piezoelectric element comprising the piezoelectric ceramics as a piezoelectric substance thereof.

摘要翻译： 一种具有陶瓷颗粒的压电陶瓷，其中所述陶瓷颗粒包括至少含有Sr，Ln的铋层化合物（注意Ln是镧系元素），Bi，Ti和O，并且包括M II > 4 15 15 类型晶体（M II）是由Sr和Ln组成的元素作为主要成分， 和Mn的氧化物作为副成分; 并且通过代码长度测量方法的平均粒径为0.8至4.7μm：通过该压电陶瓷可以在相对的厚度垂直振动的三次谐波模式中提供具有大Q最大值的压电陶瓷 高频带（例如，16至65MHz），谐振器和包括作为其压电体的压电陶瓷的其它压电元件。

公开(公告)号：US6090306A

公开(公告)日：2000-07-18

申请号：US248314

申请日：1999-02-11

申请人： Taeko Tsubokura ,  Hitoshi Oka ,  Kazuo Miyabe ,  Masayoshi Inoue

发明人： Taeko Tsubokura ,  Hitoshi Oka ,  Kazuo Miyabe ,  Masayoshi Inoue

IPC分类号： C04B35/46 ,  C04B35/472 ,  H01L41/187 ,  H01L41/29 ,  H01L41/333 ,  H01L41/39 ,  H01L41/00 ,  C04B35/475 ,  C04B35/499

CPC分类号： C04B35/472 ,  H01L41/187

摘要： Provided is a piezoelectric ceramic which achieves a high density, good temperature characteristics and a high Curie temperature, which can fully prevent (a) a decrease in Qmax (Qmax refers to a tan.theta.max when the maximum value of phase angles of third harmonic is a .theta.max), (b) a decrease in q (dynamic range of resonance frequency), (c) an increase in a fundamental wave and (d) the occurrence of a spurious mode in the vicinity of third harmonic, caused by downsizing, and which can materialize a small-sized high-performance piezoelectric element, the piezoelectric ceramic having a composition of the general formula,(Pb.sub.a-k-y-z Sr.sub.x Ln.sub.y Bi.sub.z)(Ti.sub.1-b-c Mn.sub.b Me.sub.c)O.sub.3wherein Ln is at least one element selected from the group consisting of La, Ce and Pr, Me is at least one element selected from the group consisting of Nb, Sb and Ta, and x, y, z, a, b and c represent molar ratios, the composition satisfying 0.ltoreq.x.ltoreq.0.2, 0

摘要翻译： 提供了一种实现高密度，良好的温度特性和高居里温度的压电陶瓷，其可以完全防止（a）Qmax的降低（Qmax是指当三次谐波的相位角的最大值为 （θ）），（b）q（共振频率的动态范围）的减小，（c）基波的增加和（d）由于尺寸缩小引起的三次谐波附近的杂散模式的发生， 并且其可以实现小型高性能压电元件，具有通式为（Pba-ky-zSrxLnyBiz）（Ti1-b-cMnbMec）O3的组成的压电陶瓷是其中Ln中的至少一种元素， 由La，Ce和Pr组成，Me是选自Nb，Sb和Ta中的至少一种元素，x，y，z，a，b和c表示摩尔比，组成满足0 0.05和0.005 < = 0。 05。