公开(公告)号：US20130125982A1

公开(公告)日：2013-05-23

申请号：US13813011

申请日：2011-07-27

申请人： Seiji Oguri ,  Isamu Tanaka ,  Norihiko Matsushima ,  Akio Yamamoto

发明人： Seiji Oguri ,  Isamu Tanaka ,  Norihiko Matsushima ,  Akio Yamamoto

IPC分类号： H01L31/032

CPC分类号： H01L31/0322 ,  H01L31/046 ,  H01L31/0465 ,  H01L31/0749 ,  Y02E10/541

摘要： It is aimed to provide a photoelectric conversion device having high adhesion between a light-absorbing layer and an electrode layer as well as high photoelectric conversion efficiency. A photoelectric conversion device comprises a light-absorbing layer including a chalcopyrite-based compound semiconductor and oxygen. The light-absorbing layer includes voids therein. An atomic concentration of oxygen in the vicinity of the voids is higher than an average atomic concentration of oxygen in the light-absorbing layer.

摘要翻译： 旨在提供一种在光吸收层和电极层之间具有高粘附性的光电转换装置以及高的光电转换效率。 光电转换装置包括包含基于黄铜矿的化合物半导体和氧的光吸收层。 光吸收层包括其中的空隙。 空隙附近的氧原子浓度高于光吸收层中氧的平均原子浓度。

公开(公告)号：US20130000722A1

公开(公告)日：2013-01-03

申请号：US13634972

申请日：2011-02-28

申请人： Kazuki Yamada ,  Isamu Tanaka ,  Seiichiro Inai

发明人： Kazuki Yamada ,  Isamu Tanaka ,  Seiichiro Inai

IPC分类号： H01L31/0236 ,  H01L31/18

CPC分类号： H01L31/03923 ,  H01L31/02363 ,  H01L31/046 ,  H01L31/0465 ,  Y02E10/541 ,  Y02P70/521

摘要： It is aimed to provide a photoelectric conversion device having improved conversion efficiency, and a method for manufacturing the photoelectric conversion device. For achieving this object, a photoelectric conversion device including a first semiconductor layer and a second semiconductor layer is employed. In the photoelectric conversion device, the first semiconductor layer includes one principal surface on which a plurality of projections are scattered, includes a I-III-VI group compound semiconductor, and has a first conductivity type. The second semiconductor layer is disposed on the one principal surface, has a thickness in a normal direction of the one principal surface, and has a second conductivity type different from the first conductivity type. Further, a first distance along which each of the projections is projected in the normal direction is longer than a second distance along which the second semiconductor layer is provided in the normal direction.

公开(公告)号：US20060282193A1

公开(公告)日：2006-12-14

申请号：US11493619

申请日：2006-07-27

申请人： Sakae Ishikawa ,  Satoshi Ishihara ,  Tomoaki Arai ,  Isamu Tanaka

发明人： Sakae Ishikawa ,  Satoshi Ishihara ,  Tomoaki Arai ,  Isamu Tanaka

IPC分类号： G06F7/00

CPC分类号： B65D19/44 ,  B65D19/385 ,  B65D2203/06

摘要： When a first article is to be delivered to a customer and a second article is to be collected from the customer, first rack components required for delivery of the first article and second rack components not required for delivery of the first article, yet required for collecting the second article, are specified. Delivery procedure and collection procedure of the articles using the specified first rack components and second rack components are instructed to a worksite. Accordingly, delivery and collection of the articles can be carried out by making efficient use of the rack components commonly used for the first article and the second article.

公开(公告)号：US5479262A

公开(公告)日：1995-12-26

申请号：US96981

申请日：1993-07-27

申请人： Kazuhiko Namiki ,  Eiko Mito ,  Masahiro Ishikawa ,  Michihito Ohashi ,  Isamu Tanaka

发明人： Kazuhiko Namiki ,  Eiko Mito ,  Masahiro Ishikawa ,  Michihito Ohashi ,  Isamu Tanaka

IPC分类号： G03G21/00 ,  G03G15/04 ,  G03G15/36 ,  G03G21/14 ,  H04N1/00 ,  H04N1/04 ,  H04N1/10 ,  H04N1/107 ,  H04N1/193 ,  H04N1/38 ,  H04N1/387 ,  H04N1/21

CPC分类号： H04N1/387 ,  H04N1/00681 ,  H04N1/00708 ,  H04N1/00716 ,  H04N1/00737 ,  H04N1/00748 ,  H04N1/00795 ,  H04N1/00816 ,  H04N1/38 ,  H04N1/1013 ,  H04N1/193 ,  H04N2201/0434

摘要： A digital image forming apparatus which detects a center of a book document when reading and writing an image of the document, including a document, a document board on which the document is set, a reading device for reading the document by scanning the document, an A/D converter for converting an analog signal which is read by the reading device to a digital signal, a signal processor for processing the digital signal, including a first detector for detecting the existence of a dark portion in the image of the document and judging the document to be a book document if the document image has the dark portion, based on the signal corresponding to at least two lines on the document in a scanning direction, or in a direction perpendicular to the scanning direction and a second detector for detecting a center portion of the document on the basis of each center dark portion of each signal of the lines if the document is judged to be a book document, and a writing device for writing the digital signal on a photoconductive element in relation to the detected center portion. Edge portions of the document can similarly be detected and used in writing an image of the document so that an unnecessary part of the book document can be erased with simple structure and operation.

摘要翻译： 一种数字图像形成装置，其在读取和写入文档的图像时检测书本文档的中心，包括文档，设置有文档的文档板，通过扫描文档读取文档的读取装置， 用于将由读取装置读取的模拟信号转换为数字信号的A / D转换器，用于处理数字信号的信号处理器，包括用于检测文档图像中暗部的存在的第一检测器，并且判断 基于与扫描方向上的原稿上的至少两条线对应的信号或与扫描方向垂直的方向的文档图像具有暗部的文档作为书本文档，以及第二检测器，用于检测文档 如果文档被判断为书本文件，则基于每行信号的每个中心暗部分的文档的中心部分，以及用于写入数字的书写装置 相关于检测到的中心部分的感光元件上的信号。 文档的边缘部分可以类似地被检测并用于书写文档的图像，使得书本文档的不必要部分能够以简单的结构和操作被擦除。

公开(公告)号：US5268255A

公开(公告)日：1993-12-07

申请号：US767893

申请日：1991-09-30

申请人： Hiroshi Kikuchi ,  Makio Watanabe ,  Shinichiro Imabayashi ,  Reiko Yano ,  Isamu Tanaka ,  Hitoshi Oka ,  Yukihiro Taniguchi ,  Shigeru Fujita

发明人： Hiroshi Kikuchi ,  Makio Watanabe ,  Shinichiro Imabayashi ,  Reiko Yano ,  Isamu Tanaka ,  Hitoshi Oka ,  Yukihiro Taniguchi ,  Shigeru Fujita

IPC分类号： C08G59/00 ,  C08F2/50 ,  C08F283/10 ,  C08G59/18 ,  C08G59/50 ,  C08L63/00 ,  G03F1/00 ,  G03F7/027 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28 ,  G03F7/004

CPC分类号： H05K3/287 ,  C08F283/10 ,  C08G59/5046 ,  G03F7/032 ,  Y10S430/119

摘要： A printed circuit board has a resist layer made from a photo-setting resist composition containing:(A) a polyfunctional unsaturated compound which is solid at room temperature,(B) a polyfunctional unsaturated compound which is liquid at room temperature,(C) a photopolymerization initiator,(D) an epoxy resin,(E) at least one member selected from the group consisting of:(i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and(ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.

摘要翻译： 印刷电路板具有由光固化抗蚀剂组合物制成的抗蚀剂层，其含有：（A）在室温下为固体的多官能不饱和化合物，（B）室温下为液体的多官能不饱和化合物，（C） 光聚合引发剂，（D）环氧树脂，（E）选自以下的至少一种：（i）环氧树脂用固化剂和三聚氰胺或其衍生物，和（ii）具有 2,4-二氨基-s-三嗪环和咪唑环。

公开(公告)号：US5091283A

公开(公告)日：1992-02-25

申请号：US499706

申请日：1990-03-27

申请人： Isamu Tanaka ,  Hitoshi Oka ,  Makio Watanabe ,  Hiroshi Kikuchi ,  Shinichiro Imabayashi ,  Yukihiro Taniguti

发明人： Isamu Tanaka ,  Hitoshi Oka ,  Makio Watanabe ,  Hiroshi Kikuchi ,  Shinichiro Imabayashi ,  Yukihiro Taniguti

IPC分类号： C08L31/08 ,  C08F290/00 ,  C08F299/00 ,  C08G59/00 ,  C08G59/40 ,  G03F7/028 ,  G03F7/038 ,  H05K3/28

CPC分类号： G03F7/028 ,  G03F7/038 ,  H05K3/287 ,  Y10S430/119

摘要： A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.

摘要翻译： 一种可光固化的邻苯二甲酸二烯丙酯树脂组合物，其特征在于，相对于100重量份的邻苯二甲酸二烯丙酯预聚物，含有0.1〜10重量份的防止背面不良固化的试剂和20〜100重量份的填料，特别适用于 用于形成阻焊剂的部分添加方法，其有效防止紫外线的背面不期望的固化，并且具有抵抗电阻铜的物质释放的性能，以降低电镀铜膜的性能以及提供良好的机械性能。

公开(公告)号：US4555532A

公开(公告)日：1985-11-26

申请号：US659565

申请日：1984-10-10

申请人： Isamu Tanaka ,  Hiroshi Kikuchi ,  Akira Tomizawa ,  Hitoshi Oka

发明人： Isamu Tanaka ,  Hiroshi Kikuchi ,  Akira Tomizawa ,  Hitoshi Oka

IPC分类号： B23K35/22 ,  C08G59/50 ,  C08L63/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  C09D3/58

CPC分类号： C08L63/00 ,  B23K35/224 ,  C08G59/5053 ,  C23C18/1605 ,  H05K3/184 ,  H05K3/285 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K3/0076

摘要： An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.

摘要翻译： 含有二氨基三嗪改性咪唑化合物和双氰胺作为潜在硬化剂的环氧树脂组合物在阻焊油墨组合物的使用寿命方面得到改善，并且可以得到耐化学镀浴的抗蚀剂也优异。

公开(公告)号：US20120319244A1

公开(公告)日：2012-12-20

申请号：US13575916

申请日：2011-01-25

申请人： Seiji Oguri ,  Keizo Takeda ,  Koichiro Yamada ,  Kotaro Tanigawa ,  Isamu Tanaka ,  Riichi Sasamori ,  Hiromitsu Ogawa

发明人： Seiji Oguri ,  Keizo Takeda ,  Koichiro Yamada ,  Kotaro Tanigawa ,  Isamu Tanaka ,  Riichi Sasamori ,  Hiromitsu Ogawa

IPC分类号： H01L31/18 ,  H01L21/20 ,  H01L29/20

CPC分类号： H01L31/0749 ,  H01L31/0322 ,  H01L31/046 ,  Y02E10/541 ,  Y02P70/521

摘要： A method for manufacturing a semiconductor layer according to an embodiment of the present invention comprises preparing a first compound, preparing a second compound, making a semiconductor layer forming solution, and forming a semiconductor layer including a group compound by using this semiconductor layer forming solution. The first compound contains a first chalcogen-element-containing organic compound, a first Lewis base, a I-B group element, and a first III-B group element. The second compound contains an organic ligand and a second III-B group element. The semiconductor layer forming solution contains the first compound, the second compound, and an organic solvent.

摘要翻译： 根据本发明的实施方案的半导体层的制造方法包括通过使用该半导体层形成溶液制备第一化合物，制备第二化合物，制备半导体层形成溶液，以及形成包含基团化合物的半导体层。 第一化合物含有第一含硫族元素的有机化合物，第一路易斯碱，I-B族元素和第一III-B族元素。 第二化合物含有有机配体和第二III-B族元素。 半导体层形成溶液含有第一化合物，第二化合物和有机溶剂。

公开(公告)号：US20120288988A1

公开(公告)日：2012-11-15

申请号：US13511983

申请日：2010-12-16

申请人： Seiichiro Inai ,  Daisuke Nishimura ,  Isamu Tanaka

发明人： Seiichiro Inai ,  Daisuke Nishimura ,  Isamu Tanaka

IPC分类号： H01L31/18 ,  H01L21/368

CPC分类号： H01L31/0749 ,  H01L21/02551 ,  H01L21/02568 ,  H01L21/02601 ,  H01L21/02628 ,  H01L31/0322 ,  H01L31/046 ,  Y02E10/541 ,  Y02P70/521

摘要： It is an object of the present invention to provide a method for manufacturing a semiconductor layer, a method for manufacturing a photoelectric conversion device, and a semiconductor layer forming solution which are able to easily manufacture a good semiconductor layer having a desired thickness. To accomplish this object, a starting solution containing a metallic element, a chalcogen organic compound and a Lewis base organic compound is initially produced. Next, heating the starting solution produces fine particles. The fine particles contain a metal chalcogenide which is a compound of the metallic element and a chalcogen element included in the chalcogen organic compound. A semiconductor layer is formed by using a semiconductor layer forming solution in which the fine particles are dispersed.

摘要翻译： 本发明的目的是提供一种能够容易地制造具有期望厚度的良好半导体层的半导体层制造方法，制造光电转换装置和半导体层形成溶液的方法。 为了实现这个目的，最初制备了含有金属元素，硫族元素有机化合物和路易斯碱有机化合物的起始溶液。 接下来，加热起始溶液产生细小颗粒。 细颗粒含有金属硫族化物，其是金属元素的化合物和包括在硫属有机化合物中的硫族元素元素。 通过使用其中分散有细颗粒的半导体层形成溶液形成半导体层。

公开(公告)号：US4460718A

公开(公告)日：1984-07-17

申请号：US469279

申请日：1983-02-24

申请人： Isamu Tanaka ,  Hitoshi Oka ,  Akira Tomizawa ,  Hiroshi Kikuchi

发明人： Isamu Tanaka ,  Hitoshi Oka ,  Akira Tomizawa ,  Hiroshi Kikuchi

IPC分类号： H05K3/28 ,  C08G59/00 ,  C08G59/40 ,  C08L63/00 ,  C09D11/00 ,  C09D11/02 ,  C09D11/10 ,  C09D163/00 ,  H05K3/18 ,  H05K3/42 ,  C08L63/02 ,  C08L63/04 ,  C08L63/08

CPC分类号： C08G59/4021 ,  C09D163/00 ,  H05K3/184

摘要： An epoxy resin composition comprising an epoxide compound, a guanidine compound, a filler, a thixotropic agent and an organic solvent and having a thixotropy index of 5 to 40 and a viscosity of 800 to 10,000 poises (at 20.degree. C.) is suitable for forming a resist film which is used in electroless metal plating with excellent heat resistance, solder resistance and corrosion resistance, and the like.

摘要翻译： 包含环氧化合物，胍化合物，填料，触变剂和有机溶剂并且具有5至40的触变指数和800至10,000泊的粘度（在20℃）的环氧树脂组合物适用于 在耐电镀性，耐焊接性，耐腐蚀性优异的无电镀金属电镀中形成抗蚀剂膜等。