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    Electroless copper plating solution
    3.
    发明授权
    Electroless copper plating solution 失效
    化学镀铜溶液

    公开(公告)号：US4303443A

    公开(公告)日：1981-12-01

    申请号：US159231

    申请日：1980-06-13

    申请人： Osamu Miyazawa ,  Hitoshi Oka ,  Isamu Tanaka ,  Akira Matsuo ,  Hitoshi Yokono ,  Nobuo Nakagawa ,  Tokio Isogai

    发明人： Osamu Miyazawa ,  Hitoshi Oka ,  Isamu Tanaka ,  Akira Matsuo ,  Hitoshi Yokono ,  Nobuo Nakagawa ,  Tokio Isogai

    IPC分类号： C23C18/40 ,  C23C3/02

    CPC分类号： C23C18/40

    摘要： When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.2 OH, is used as a complexing agent for cupric ions and a nitrogen-containing cyclic compound is used as a complexing agent for cuprous ions in an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent and a stabilizer, or an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent, a stabilizer and a complexing agent for cuprous ions, the plating rate of the electroless copper plating solution, mechanical strength of plating film, and stability of the plating solution are improved.

    摘要翻译： 当使用在一个分子中具有至少两个聚烯烃二醇链的胺化合物作为稳定剂和亚烷基二胺化合物时，其各氨基中的至少一个氢原子被CH 2 COOX（其中X是H或Na）取代，和 在其氨基中的另一个氢原子被CH 2 OH取代，用作铜离子的络合剂，并且含氮环状化合物用作含有水，水的无电镀铜溶液中的亚硝酸根离子的络合剂 可溶性铜盐，铜离子络合剂，还原剂，pH控制剂和稳定剂，或包含水，水溶性铜盐，铜离子络合剂，还原剂的化学镀铜溶液 药剂，pH控制剂，稳定剂和亚铜离子络合剂，化学镀铜溶液的电镀速率，电镀膜的机械强度和稳定剂 改善了电镀溶液的性能。

    Process for forming metallic image
    4.
    发明授权
    Process for forming metallic image 失效
    金属图像形成工艺

    公开(公告)号：US4347304A

    公开(公告)日：1982-08-31

    申请号：US277049

    申请日：1981-06-24

    申请人： Hideki Sakurai ,  Mitsuo Nakatani ,  Hitoshi Oka ,  Hitoshi Yokono ,  Tokio Isogai

    发明人： Hideki Sakurai ,  Mitsuo Nakatani ,  Hitoshi Oka ,  Hitoshi Yokono ,  Tokio Isogai

    IPC分类号： G03C5/58 ,  G03F7/004 ,  H05K3/18 ,  G03C5/00

    CPC分类号： H05K3/185 ,  G03C5/58 ,  G03F7/0043 ,  Y10S430/143

    摘要： Metallic images of uniform quality can be formed on substrates having through-holes by a process using a positive type resist characterized by using as a coating solution for the substrate a solution of a photosensitive material of (a) at least one organic compound having at least one linkage of --M--M--M ).sub.n (M=Si, Ge or Sn; n=0, 1 or more) in the molecule or (b) a mixture of at least one organic compound (a) mentioned above and at least one photosensitizer, dissolved in a solvent such as a halogenated hydrocarbon, an aromatic hydrocarbon, a heterocyclic compound, or a mixture thereof, followed by irradiation with an actinic light through a photomask and electroless plating.

    摘要翻译： 可以通过使用正型抗蚀剂的方法在具有通孔的基板上形成具有均匀质量的金属图像，其特征在于使用作为基底的涂布溶液的（a）至少一种有机化合物的感光材料的溶液，所述有机化合物至少具有 分子中nMM（M = Si，Ge或Sn; n = 0,1或更多）的一个连接，或（b）上述至少一种有机化合物（a）和至少一种光敏剂的混合物， 溶解在溶剂如卤代烃，芳族烃，杂环化合物或其混合物中，然后通过光掩模和化学镀被光化的光照射。

    Process for producing solar cells
    6.
    发明授权
    Process for producing solar cells 失效
    太阳能电池生产工艺

    公开(公告)号：US4643913A

    公开(公告)日：1987-02-17

    申请号：US687162

    申请日：1984-12-28

    申请人： Masaaki Okunaka ,  Mitsuo Nakatani ,  Haruhiko Matsuyama ,  Hitoshi Yokono ,  Tokio Isogai ,  Tadashi Saitoh ,  Kunihiro Matsukuma ,  Sumiyuki Midorikawa ,  Satoru Suzuki

    发明人： Masaaki Okunaka ,  Mitsuo Nakatani ,  Haruhiko Matsuyama ,  Hitoshi Yokono ,  Tokio Isogai ,  Tadashi Saitoh ,  Kunihiro Matsukuma ,  Sumiyuki Midorikawa ,  Satoru Suzuki

    IPC分类号： H01L31/04 ,  C07F7/00 ,  H01L21/283 ,  H01L21/288 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/18

    CPC分类号： C07F7/006 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

    摘要： A process for producing solar cells which comprises applying a composition for anti-reflection coating formation on one side of a silicon base plate having a p-n junction therein, printing an Ag paste for contact formation on predetermined areas of the coat, and heat-treating the resulting plate at a temperature of 400.degree. to 900.degree. C. to complete anti-reflection coating and a light-receiving side contact, the process being characterized in that the composition for anti-reflection coating formation contains as essential component, (a) at least one member selected from the metal-organic ligand complex compounds represented by the general formula M(OR.sub.1).sub.n (L).sub.a-n wherein M is a metal selected from Zn, Al, Ga, In, Ti, Zr, Sn, V, Nb, Ta, Mo, and W; R.sub.1 is a C.sub.1 -C.sub.18 alkyl group; L is an organic ligand which forms an non-hydrolyzable bond with the metal ion; a is the valency of the metal M; and n is an integer satisfying 1.ltoreq.n

    摘要翻译： 一种太阳能电池的制造方法，其特征在于，在具有pn结的硅基板的一面上涂布抗反射涂层用组合物，在所述涂层的规定区域印刷用于接触形成的Ag浆料，并对所述涂料进行热处理 得到的板在400-900℃的温度下完成防反射涂层和光接收侧接触，其特征在于用于防反射涂层形成的组合物包含作为必要组分的（a）在 选自由通式M（OR1）n（L）a表示的金属 - 有机配体络合物中的至少一种成分其中M是选自Zn，Al，Ga，In，Ti，Zr，Sn，V，Nb ，Ta，Mo和W; R1是C1-C18烷基; L是与金属离子形成不可水解键的有机配体; a为金属M的化合价; n为1，n为1的整数，通式（OR 1）n-1M（L）anOM（OR 1）n-1（L）a表示的水解缩合物，（b） 化合物，和（c）溶剂。

    Process for producing transparent electroconductive film
    8.
    发明授权
    Process for producing transparent electroconductive film 失效
    制造透明导电膜的方法

    公开(公告)号：US4369208A

    公开(公告)日：1983-01-18

    申请号：US215334

    申请日：1980-12-11

    申请人： Masaaki Okunaka ,  Ryoichi Sudo ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsuo Yamazaki

    发明人： Masaaki Okunaka ,  Ryoichi Sudo ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsuo Yamazaki

    IPC分类号： H01B13/00 ,  C03C17/27 ,  C23C18/12 ,  C23C18/14 ,  H05K1/09 ,  H05K3/02 ,  B05D3/06

    CPC分类号： C23C18/14 ,  C03C17/27 ,  C23C18/1216 ,  C23C18/1245 ,  C03C2217/211 ,  C03C2217/215 ,  C03C2217/24 ,  C03C2218/11 ,  C03C2218/322 ,  H05K1/092 ,  H05K3/02

    摘要： A transparent electroconductive film of lower resistance with a smaller content of remaining organic components and less pinholes than those of the conventional transparent electroconductive film is produced by applying a coating solution selected from (a) a coating solution comprising an inorganic indium compound free from a photosensitive group in the molecule or an inorganic tin compound free from a photosensitive group in the molecule, an organic ligand, and an organic solvent, (b) a coating solution comprising an organic indium compound free from a photosensitive group in the molecule, or an organic tin compound free from a photosensitive group in the molecule, and an organic solvent, and (c) the coating solution (a) or (b) further containing a dopant to the surface of a substrate, thereby forming a film thereon, and then irradiating the substrate with radiation capable of exciting organic groups, for example, ultraviolet rays in a state where the substrate is kept at a high temperature (100.degree.-600.degree. C.), and then baking the substrate at a high temperature.

    摘要翻译： 通过涂布选自（a）包含无光感光体的无机铟化合物的涂布溶液的涂布溶液，制备具有较低电阻的透明导电膜，其具有较少的剩余有机组分含量和较少的针孔， 或分子中不含光敏基团的无机锡化合物，有机配体和有机溶剂，（b）包含在分子中不含感光性基团的有机铟化合物的涂布溶液或有机溶剂 分子内不含光敏基团的锡化合物和有机溶剂，和（c）在基材表面还含有掺杂剂的涂布液（a）或（b），从而在其上形成膜，然后照射 具有能够激发有机基团的辐射的基板，例如在基板保持高温的状态下的紫外线 （100°-600℃），然后在高温下烘烤该基材。