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公开(公告)号：US5331051A
公开(公告)日：1994-07-19
申请号：US928349
申请日：1992-08-12
CPC分类号： C08G18/657 , C08G18/5024 , C08G18/632 , C08G18/638 , C08G2120/00
摘要： A polyurea resin molding composition for RIM use comprising (a) polyoxyalkylenpolyamine having an average molecular weight greater than about 400 and a plurality of terminal primary or secondary amino groups, (b) an aromatic polyamine and/or xylylenediamine and (c) a polyisocyanate. The component (a) contains dispersed therein a polymer prepared by the in situ polymerization of at least two different olefinically unsaturated monomers in the presence of a radical polymerization initiator, the ratio of the average amino equivalent of said polyamines (a) and (b) in combination to the average NCO equivalent of said polyisocyanate (c) being between about 1:0.7 to 1:1.5.
摘要翻译： 一种用于RIM用途的聚脲树脂模塑组合物，其包含（a）平均分子量大于约400的聚氧亚烷基多胺和多个末端伯或仲氨基，（b）芳族多胺和/或苯二甲胺和（c）多异氰酸酯。 组分（a）在其中分散有在自由基聚合引发剂存在下通过至少两种不同的烯属不饱和单体的原位聚合制备的聚合物，所述多胺（a）和（b）的平均氨基当量的比例 与所述多异氰酸酯（c）的平均NCO当量的组合在约1:0.7至1:1.5之间。
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公开(公告)号：US5278226A
公开(公告)日：1994-01-11
申请号：US917396
申请日：1992-07-23
IPC分类号： C08F2/44 , C08F2/00 , C08F283/06 , C08L33/00 , C08L33/04 , C08L71/02 , C08K5/06 , C08K5/16 , C08K5/17
CPC分类号： C08F283/06
摘要： A stable polymer dispersion in polyoxyalkylenepolyamine is provided by the in situ polymerization of at two different monomers selected respectively from (a) a first monomer capable of forming a homopolymer which does not precipitate out upon the in situ polymerization and (b) a second monomer capable of forming a homopolymer which precipitates out upon the in situ polymerization. The dispersion is useful as a raw materials of polyurea RIM, forms, elastomers and other products.
摘要翻译： 聚氧亚烷基多胺中稳定的聚合物分散体是通过在两种不同的单体进行原位聚合来提供的，分别选自（a）能够形成在原位聚合时不沉淀的均聚物的第一单体，和（b） 形成在原位聚合时析出的均聚物。 该分散体可用作聚脲RIM，形式，弹性体和其他产品的原料。
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公开(公告)号：US5192814A
公开(公告)日：1993-03-09
申请号：US875764
申请日：1992-04-29
CPC分类号： C08G18/325 , C08G18/5024 , C08G18/6685 , C08G2120/00
摘要： A polyurea resin molding composition for reaction injection molding use which comprises (a) a polyoxyalkylenepolyamine, (b) an aromatic polyamine and/or a xylylenediamine and (c) a polyisocyanate, wherein either one or both of components (a) and (b) have been modified by a Michael reaction with an unsaturated compound of the formula CH.sub.2 .dbd.C(R)--Y wherein R is H or CH.sub.3 and Y is an electron attracting group. The use of such modified polyamine(s) improves in-mold flow and green strength characteristics.
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公开(公告)号：US5550198A
公开(公告)日：1996-08-27
申请号：US356540
申请日：1994-12-15
申请人： Toshiyuki Oshima , Hideo Ishibashi , Hiromasa Minamino , Satoshi Yamamoto , Takaharu Izumo , Mitsuharu Kaneko
发明人： Toshiyuki Oshima , Hideo Ishibashi , Hiromasa Minamino , Satoshi Yamamoto , Takaharu Izumo , Mitsuharu Kaneko
CPC分类号： C08G18/6685 , C08G18/283 , C08G18/5024 , C08G18/643 , C08G2120/00
摘要： A polyurea resin composition for RIM or coating use Comprises (a) a polyoxyalkylenepolyamine, (b) an aromatic polyamine and/or a xylylenediamine and (c) a polyisocyanate compound with either one or both of components (a) and (b) having been modified by a Michael reaction with a vinyl monomer having an electron attracting group to convert the primary amino group thereof to a secondary amino group. The composition also contains as an internal mold release a polyoxyalkylene glycol mono-C.sub.4 -C.sub.1, alkyl ether and/or as a polyamine component a reaction product between a primary aromatic polyamine and a polyglycidyl ether.
摘要翻译： 用于RIM或涂料用途的聚脲树脂组合物包括（a）聚氧亚烷基多胺，（b）芳族多胺和/或苯二甲胺和（c）多元醇化合物与组分（a）和（b）中的一种或两种已经被 通过与具有吸电子基团的乙烯基单体的迈克尔反应进行改性，将其伯氨基转化为仲氨基。 组合物还含有作为内部脱模剂的聚氧亚烷基二醇单C4-C1，烷基醚和/或作为多胺组分的初级芳族多胺和多缩水甘油醚之间的反应产物。
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公开(公告)号：US07214424B2
公开(公告)日：2007-05-08
申请号：US10123113
申请日：2002-04-17
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2433/00 , C09J2467/006 , H01L2221/68327 , Y10S428/901 , Y10T428/249987 , Y10T428/249991 , Y10T428/249992 , Y10T428/28 , Y10T428/2817 , Y10T428/2852
摘要： A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.
摘要翻译： 公开了一种可降低粘合力的热处理引起的污染程度小的可热剥离的粘合片。 可热剥离的压敏粘合片包括含有热膨胀性微球并在加热时膨胀的热膨胀层，以及在其至少一侧上形成的不可热膨胀的压敏粘合剂层。 可热剥离的粘合片可以达到所需的粘合性能，例如加热前的优异的粘合力，并且还显示加热时粘合力的快速降低。 此外，由于用于降低粘合力的处理，显示出小的污染程度的增加。 由于这些特征，可热剥离的粘合片实际上可应用于例如制造由较薄的半导体晶片制成的电子部件。
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公开(公告)号：US07163597B2
公开(公告)日：2007-01-16
申请号：US10404861
申请日：2003-04-02
IPC分类号： B32B37/14 , H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6836 , C09J7/385 , C09J2201/36 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , Y10T156/1082 , Y10T156/1142 , Y10T428/28 , Y10T428/2839 , Y10T428/2848
摘要： A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 μm or less.
摘要翻译： 即使在粘附被粘物的面积减小的情况下也能够确保有效的接触面积的热剥离性粘合片，因此能够避免诸如芯片散射或碎裂的粘合破坏。 可热剥离的压敏粘合片包括基材和形成在基材的至少一侧的含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂的表面 加热前的层的中心线平均粗糙度为0.4μm以下。
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7.发明授权公开(公告)号：US07029550B2
公开(公告)日：2006-04-18
申请号：US10399476
申请日：2001-10-17
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2205/11 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2924/19041 , Y10T156/1052 , Y10T428/1405 , Y10T428/1476 , Y10T428/1495 , Y10T428/24843 , Y10T428/2486 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2852 , Y10T428/2883
摘要： An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 μm or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.
摘要翻译： 能量束可固化的可热释放的压敏粘合片在基材的至少一侧上具有能量束可固化的粘弹性层和包含热膨胀性微球的热可膨胀压敏粘合剂层 按此顺序 能量束固化型粘弹性层例如由有机粘弹性体和能量束固化性化合物或能量束固化性树脂的组合物构成。 能量束固化型粘弹性层的厚度为约5〜300μm，或者不大于热膨胀性微球的最大粒径。 根据本发明的能量束固化型热剥离性压敏粘合剂层具有足够的粘合力以承受被粘物的携带步骤，在切割时既不会卷起粘合剂也不会碎裂，并且有利于在切割之后的剥离和收集切割片 切割。
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公开(公告)号：US20050186419A1
公开(公告)日：2005-08-25
申请号：US11108648
申请日：2005-04-19
IPC分类号： B32B5/18 , C09J7/02 , C09J11/00 , C09J201/00 , H01L21/68 , B65D1/00 , F16L1/00 , B32B1/08 , B29D22/00 , B29D23/00 , B32B7/12 , B32B15/04
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/26 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2400/243 , C09J2421/006 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01L21/6836 , H01L2221/68327 , H01L2221/68331 , H01L2924/19041 , Y10T156/1064 , Y10T156/1082 , Y10T156/1153 , Y10T428/249984 , Y10T428/28 , Y10T428/2839 , Y10T428/2848 , Y10T428/2861
摘要： A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.
摘要翻译： 一种可热剥离的粘合片，其包含基材，并且在其至少一侧上形成包含热膨胀性微球的热膨胀层和包含粘合物质的粘合剂层，并且其中基材具有耐热性和拉伸性， 用于切割被粘物，以形成并确保所得切割片之间的足够的空间，并且可以经受用于膨胀热膨胀层的热处理。 因此，粘合片可以在分离和回收切割件的步骤中提高操作效率和工作效率。
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9.发明申请公开(公告)号：US20070111392A1
公开(公告)日：2007-05-17
申请号：US11650449
申请日：2007-01-08
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , H01L2221/68327 , H01L2924/19041 , Y10T428/28
摘要： A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.
摘要翻译： 从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法 设置在基材表面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放 切片切片。 用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。 以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。
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公开(公告)号：US06998175B2
公开(公告)日：2006-02-14
申请号：US09853787
申请日：2001-05-14
CPC分类号： C09J7/22 , C09J7/38 , C09J2205/11 , Y10S428/922 , Y10T428/14 , Y10T428/28 , Y10T428/2813 , Y10T428/2848 , Y10T428/2852 , Y10T428/2857 , Y10T428/2878 , Y10T428/2891
摘要： A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
摘要翻译： 即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保 其加热前的粘合性和加热后的剥离性的功能。 热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。 在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。 粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。
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