公开(公告)号：US20130244089A1

公开(公告)日：2013-09-19

申请号：US13797375

申请日：2013-03-12

申请人： Hideo Shimizu ,  Noboru Koike ,  Takashi Murai ,  Yasuyuki Nagase ,  Tadashi Shudo ,  Satoru Nawa ,  Takashi Kobayashi ,  Kazuyuki Kuroda

发明人： Hideo Shimizu ,  Noboru Koike ,  Takashi Murai ,  Yasuyuki Nagase ,  Tadashi Shudo ,  Satoru Nawa ,  Takashi Kobayashi ,  Kazuyuki Kuroda

IPC分类号： H01M2/10

CPC分类号： H01M2/1016 ,  H01M2/1077 ,  H01M2/1094

摘要： According to one embodiment, a secondary battery device includes a secondary battery cell, a case configured to accommodate the secondary battery cell, and foam coating layers sandwiched between an outer surface of the secondary battery cell and an inner surface of the case and configured to hold the secondary battery cell.

摘要翻译： 根据一个实施例，二次电池装置包括二次电池单元，被配置为容纳二次电池单元的壳体和夹在二次电池单元的外表面和壳体的内表面之间的泡沫涂层，并且被配置为保持 二次电池。

公开(公告)号：US06529714B1

公开(公告)日：2003-03-04

申请号：US09314148

申请日：1999-05-19

申请人： Yutaka Nakamura ,  Noboru Koike

发明人： Yutaka Nakamura ,  Noboru Koike

IPC分类号： H04B138

CPC分类号： H04M1/0262 ,  H01M2/1066 ,  H01M2/20 ,  H01R12/716 ,  H01R13/6315 ,  H04B1/3883

摘要： A radio communication equipment including a housing and a battery pack to be attached to said housing, said radio communication equipment having a male connector of a floating connector provided on said housing, and a female connector the floating connector provided on said battery pack to engage with said male connector.

摘要翻译： 一种无线电通信设备，包括外壳和要附接到所述外壳的电池组，所述无线电通信设备具有设置在所述外壳上的浮动连接器的公连接器，以及阴连接器，设置在所述电池组上的浮动连接器与 所述公连接器。

公开(公告)号：US06465894B2

公开(公告)日：2002-10-15

申请号：US09907659

申请日：2001-07-19

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01L2941

CPC分类号： H01L24/05 ,  H01L21/76229 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/13099 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/05042

摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.

摘要翻译： 半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。 此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。 根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤 的半导体器件。

公开(公告)号：US5557507A

公开(公告)日：1996-09-17

申请号：US265027

申请日：1994-06-24

申请人： Noboru Koike ,  Hirokazu Seraku

发明人： Noboru Koike ,  Hirokazu Seraku

IPC分类号： H01R4/64 ,  H05K9/00

CPC分类号： H05K9/0037 ,  H05K9/0016

摘要： An electronic apparatus includes first and second circuitry blocks mounted on opposite surfaces of a double-sided circuit board. A first shield case is attached to the circuit board so that the first shield case covers the first circuitry block. A second circuitry block is attached to the circuit board so that the second shield case covers the second circuitry block. A conductive component contacts the first and second shield cases and is engaged with the edge of the circuit board for enabling the circuit board to be electrically connected to the first and second shield cases.

摘要翻译： 电子设备包括安装在双面电路板的相对表面上的第一和第二电路块。 第一屏蔽壳附接到电路板，使得第一屏蔽壳覆盖第一电路块。 第二电路块连接到电路板，使得第二屏蔽壳覆盖第二电路块。 导电部件接触第一和第二屏蔽壳体并与电路板的边缘接合，以使得电路板能够电连接到第一和第二屏蔽壳体。

公开(公告)号：US5032964A

公开(公告)日：1991-07-16

申请号：US605295

申请日：1990-10-30

申请人： Masayasu Endo ,  Noboru Koike

发明人： Masayasu Endo ,  Noboru Koike

IPC分类号： G01C9/00 ,  B60Q1/068 ,  F21S8/10 ,  F21V14/04

CPC分类号： B60Q1/0686

摘要： A vehicular headlight which does not require a large amount of equipment to properly adjust the angle of the azimuthal direction of emission of light from the headlight. A reflector within the body of the headlight is adjustable relative to a vertical axis and horizontal axis to control the direction in which light is emitted from the headlight. The headlight further includes aiming devices for measuring the aiming angle relative to the vertical axis and horizontal axis.

摘要翻译： 一种车头灯，其不需要大量设备来适当地调节来自头灯的光发射的方位角的角度。 头灯主体内的反射器可相对于垂直轴和水平轴线调节，以控制从头灯发出光线的方向。 头灯还包括用于测量相对于垂直轴和水平轴线的瞄准角度的瞄准装置。

公开(公告)号：US08235696B2

公开(公告)日：2012-08-07

申请号：US11251826

申请日：2005-10-18

申请人： Yoshinori Kairiku ,  Noboru Koike

发明人： Yoshinori Kairiku ,  Noboru Koike

IPC分类号： B29C35/12

CPC分类号： B03C3/017 ,  B08B6/00 ,  B29C45/14016 ,  B29C45/14827 ,  B29C45/1701

摘要： An in-mold forming apparatus including a first mold and a second mold for injection molding and a film feeding mechanism for feeding in-mold foil between the first mold and the second mold. A transfer foil is formed on the in-mold foil. The in-mold forming apparatus further includes a mold closing mechanism for closing the first mold and the second mold, thereby to fix the in-mold foil inside a cavity formed between the first mold and the second mold, a resin injection forming mechanism for injecting fused resin into the cavity, thereby to unit the transfer foil formed on the in-mold foil with the resin, and a charger arranged in the neighborhood of at least one of the first mold, the second mold, and the in-mold foil. The charger includes a charging unit for freeing ions and charging particles in the neighborhood of the in-mold foil, and an electrode for adsorbing the particles charged by the ions.

摘要翻译： 一种模内成型装置，包括第一模具和用于注射成型的第二模具，以及用于在第一模具和第二模具之间进给模内箔片的薄膜进给机构。 在模内箔上形成转印箔。 模内成型装置还包括用于封闭第一模具和第二模具的模具闭合机构，从而将模内箔固定在形成在第一模具和第二模具之间的空腔内;树脂注入成型机构，用于注入 熔融树脂进入空腔中，从而将形成在模内箔上的转印箔与树脂单元化，并将充电器设置在第一模具，第二模具和模内箔中的至少一个附近。 充电器包括用于释放离子并在模内箔附近充电颗粒的充电单元和用于吸附由离子加载的颗粒的电极。

公开(公告)号：US06677623B2

公开(公告)日：2004-01-13

申请号：US10217455

申请日：2002-08-14

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01L2974

CPC分类号： H01L24/05 ,  H01L21/76229 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/13099 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/05042

摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.

摘要翻译： 半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。 此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。 根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤 的半导体器件。

公开(公告)号：US6049135A

公开(公告)日：2000-04-11

申请号：US863423

申请日：1997-05-27

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01L21/60 ,  H01L21/762 ,  H01L23/485 ,  H01L29/41

CPC分类号： H01L24/05 ,  H01L21/76229 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/13099 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/05042

摘要： A semiconductor device has: a substantially flat surface which is formed on a semiconductor substrate and has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the surface, the interlayer insulator film having a protective layer for protecting the semiconductor substrate; and formed on the interlayer insulator film and adapted for bonding a wire thereto. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.

摘要翻译： 半导体器件具有：基本上平坦的表面，其形成在半导体衬底上并且具有嵌入绝缘层的预定图案; 形成在所述表面上的层间绝缘膜，所述层间绝缘膜具有用于保护半导体衬底的保护层; 并且形成在层间绝缘膜上并适用于将导线接合到其上。 此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。 根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤 的半导体器件。

公开(公告)号：US5067054A

公开(公告)日：1991-11-19

申请号：US594572

申请日：1990-10-09

申请人： Hirohiko Oshio ,  Noboru Koike ,  Takasi Ochiai

发明人： Hirohiko Oshio ,  Noboru Koike ,  Takasi Ochiai

IPC分类号： F21V11/16 ,  F21V17/00

CPC分类号： F21S48/145 ,  F21S48/142 ,  F21V17/12

摘要： A beam-forming shade for use in a vehicular headlamp comprising a cylindrical shade body disposed horizontally in surrounding relation to a bulb of the vehicular headlamp so as to interrupt some parts of light emitted from a light source and a connecting member extending downwardly from the shade body and having a single mounting hole to be attached to a reflector by a single screw. The shade of the present invention is obtained by bending a single thin metal plate which is previously cut to form a predetermined contour, which plate having a continuous developed form of the cylindrical shade body and the connecting member, thereby obtaining an integral shade.

摘要翻译： 一种用于车辆前照灯的波束形成用遮光罩，其特征在于，具有圆筒状的荫罩体，该圆筒状遮光体与所述车辆用前照灯的灯泡相对地水平地配置，以中断从光源射出的一部分光和从所述荫罩向下延伸的连接部件 并且具有通过单个螺钉连接到反射器的单个安装孔。 通过弯曲预先切割以形成预定轮廓的单个薄金属板，该板具有连续显影形式的圆筒形遮光体和连接构件，从而获得整体遮蔽物来获得本发明的阴影。

公开(公告)号：US5583519A

公开(公告)日：1996-12-10

申请号：US49420

申请日：1993-04-20

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01Q1/24 ,  H01Q1/10 ,  H01Q9/32

CPC分类号： H01Q1/244

摘要： This extendable antenna is related to an extendable antenna for a portable radio transceiver. The antenna has a first antenna portion and a second antenna portion connected with a connecting portion of the first antenna portion. The first antenna has a loading coil which is enclosed in a top end cap. When the second antenna portion is retracted into a housing, the connecting portion is held by a holding member disposed in the top of the housing, and the connecting portion is ellectrically connected with the circuitry of the transceiver via the holding member. Furthermore, the electrical length of the loading coil is a quarter wavelength, while the physical length of the loading coil is much less than a quarter wavelength. Accordingly, even if the top end cap is only located out of the housing, the first antenna portion detects a radio frequency signal. Furthermore it is unnecessary for the radio transceiver to have an inner antenna and a rod antenna, and switching means for switching from the rod antenna to the inner antenna. And it is unnecessary for the housing to have space for the the inner antenna.

摘要翻译： 该可延伸天线与用于便携式无线电收发器的可扩展天线有关。 天线具有与第一天线部分的连接部分连接的第一天线部分和第二天线部分。 第一天线具有封闭在顶端盖中的加载线圈。 当第二天线部分缩回到壳体中时，连接部分由设置在壳体顶部的保持构件保持，并且连接部分经由保持构件与收发器的电路电连接。 此外，负载线圈的电长度是四分之一波长，而负载线圈的物理长度远小于四分之一波长。 因此，即使顶端盖仅位于壳体外，第一天线部分检测射频信号。 此外，无线电收发器不需要具有内部天线和杆状天线，以及用于从杆状天线切换到内部天线的切换装置。 而且，外壳不需要内置天线的空间。