公开(公告)号：US06529714B1

公开(公告)日：2003-03-04

申请号：US09314148

申请日：1999-05-19

申请人： Yutaka Nakamura ,  Noboru Koike

发明人： Yutaka Nakamura ,  Noboru Koike

IPC分类号： H04B138

CPC分类号： H04M1/0262 ,  H01M2/1066 ,  H01M2/20 ,  H01R12/716 ,  H01R13/6315 ,  H04B1/3883

摘要： A radio communication equipment including a housing and a battery pack to be attached to said housing, said radio communication equipment having a male connector of a floating connector provided on said housing, and a female connector the floating connector provided on said battery pack to engage with said male connector.

摘要翻译： 一种无线电通信设备，包括外壳和要附接到所述外壳的电池组，所述无线电通信设备具有设置在所述外壳上的浮动连接器的公连接器，以及阴连接器，设置在所述电池组上的浮动连接器与 所述公连接器。

公开(公告)号：US06465894B2

公开(公告)日：2002-10-15

申请号：US09907659

申请日：2001-07-19

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01L2941

CPC分类号： H01L24/05 ,  H01L21/76229 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/13099 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/05042

摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.

摘要翻译： 半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。 此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。 根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤 的半导体器件。

公开(公告)号：US5557507A

公开(公告)日：1996-09-17

申请号：US265027

申请日：1994-06-24

申请人： Noboru Koike ,  Hirokazu Seraku

发明人： Noboru Koike ,  Hirokazu Seraku

IPC分类号： H01R4/64 ,  H05K9/00

CPC分类号： H05K9/0037 ,  H05K9/0016

摘要： An electronic apparatus includes first and second circuitry blocks mounted on opposite surfaces of a double-sided circuit board. A first shield case is attached to the circuit board so that the first shield case covers the first circuitry block. A second circuitry block is attached to the circuit board so that the second shield case covers the second circuitry block. A conductive component contacts the first and second shield cases and is engaged with the edge of the circuit board for enabling the circuit board to be electrically connected to the first and second shield cases.

摘要翻译： 电子设备包括安装在双面电路板的相对表面上的第一和第二电路块。 第一屏蔽壳附接到电路板，使得第一屏蔽壳覆盖第一电路块。 第二电路块连接到电路板，使得第二屏蔽壳覆盖第二电路块。 导电部件接触第一和第二屏蔽壳体并与电路板的边缘接合，以使得电路板能够电连接到第一和第二屏蔽壳体。

公开(公告)号：US5032964A

公开(公告)日：1991-07-16

申请号：US605295

申请日：1990-10-30

申请人： Masayasu Endo ,  Noboru Koike

发明人： Masayasu Endo ,  Noboru Koike

IPC分类号： G01C9/00 ,  B60Q1/068 ,  F21S8/10 ,  F21V14/04

CPC分类号： B60Q1/0686

摘要： A vehicular headlight which does not require a large amount of equipment to properly adjust the angle of the azimuthal direction of emission of light from the headlight. A reflector within the body of the headlight is adjustable relative to a vertical axis and horizontal axis to control the direction in which light is emitted from the headlight. The headlight further includes aiming devices for measuring the aiming angle relative to the vertical axis and horizontal axis.

摘要翻译： 一种车头灯，其不需要大量设备来适当地调节来自头灯的光发射的方位角的角度。 头灯主体内的反射器可相对于垂直轴和水平轴线调节，以控制从头灯发出光线的方向。 头灯还包括用于测量相对于垂直轴和水平轴线的瞄准角度的瞄准装置。

公开(公告)号：US20130244089A1

公开(公告)日：2013-09-19

申请号：US13797375

申请日：2013-03-12

申请人： Hideo Shimizu ,  Noboru Koike ,  Takashi Murai ,  Yasuyuki Nagase ,  Tadashi Shudo ,  Satoru Nawa ,  Takashi Kobayashi ,  Kazuyuki Kuroda

发明人： Hideo Shimizu ,  Noboru Koike ,  Takashi Murai ,  Yasuyuki Nagase ,  Tadashi Shudo ,  Satoru Nawa ,  Takashi Kobayashi ,  Kazuyuki Kuroda

IPC分类号： H01M2/10

CPC分类号： H01M2/1016 ,  H01M2/1077 ,  H01M2/1094

摘要： According to one embodiment, a secondary battery device includes a secondary battery cell, a case configured to accommodate the secondary battery cell, and foam coating layers sandwiched between an outer surface of the secondary battery cell and an inner surface of the case and configured to hold the secondary battery cell.

摘要翻译： 根据一个实施例，二次电池装置包括二次电池单元，被配置为容纳二次电池单元的壳体和夹在二次电池单元的外表面和壳体的内表面之间的泡沫涂层，并且被配置为保持 二次电池。

公开(公告)号：US06294454B1

公开(公告)日：2001-09-25

申请号：US09414632

申请日：1999-10-08

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01L2144

CPC分类号： H01L24/05 ,  H01L21/76229 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/13099 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/05042

摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.

摘要翻译： 半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。 此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。 根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤 的半导体器件。

公开(公告)号：US6031732A

公开(公告)日：2000-02-29

申请号：US563591

申请日：1995-11-28

申请人： Noboru Koike ,  Yutaka Nakamura

发明人： Noboru Koike ,  Yutaka Nakamura

IPC分类号： H04B1/38 ,  H05K9/00

CPC分类号： H05K9/0039 ,  H04B1/3833

摘要： A shield case for use in a electronic apparatus enclosed in a housing, includes a groove mating with a protruding portion of the housing. When the shield case is clamped between a PC board and the housing, the shield case is urged toward the PC board, and thereby contacts a ground pattern of the PC board.

摘要翻译： 一种用于封闭在壳体中的电子设备中的屏蔽盒，包括与壳体的突出部分配合的凹槽。 当屏蔽盒夹在PC板和壳体之间时，屏蔽盒被推向PC板，从而接触PC板的接地图案。

公开(公告)号：US5659888A

公开(公告)日：1997-08-19

申请号：US325403

申请日：1994-11-01

申请人： Syozi Kato ,  Noboru Koike

发明人： Syozi Kato ,  Noboru Koike

IPC分类号： H01Q1/24 ,  H01Q1/32 ,  H01Q1/50 ,  H01Q3/24 ,  H04B1/38 ,  H04B7/26 ,  H04M1/00 ,  H04M1/10 ,  H04Q7/32 ,  H04Q7/38

CPC分类号： H01Q1/242 ,  H01Q1/32 ,  H01Q3/24 ,  H04B1/3827 ,  H04B1/3877 ,  H04M1/10

摘要： A radio telephone device (1) is provided with a reed switch (13) arranged between a radio section (12) and a rod antenna (15) in a telephone set main body (10), which connects the radio section (12) and the rod antenna (15) with each other when the telephone set main body (10) is separated from a car kit (20). The car kit is provided with a magnet (27) which magnetically energizes the reed switch (13) when the telephone set main body (10) is placed on the car kit (20) so that the reed switch (13) is turned into a mode where the radio section (12) and an external antenna (26) are connected to each other. Hence it is possible to execute switching the antenna line between the rod antenna (15) of the telephone set main body (10) and the external antenna (26) of the car kit (20) without inviting any increase in the consumption of electric current and without making the circuits more complicated.

摘要翻译： PCT No.PCT / JP93 / 00579 Sec。 371日期：1994年11月4日 102（e）日期1994年11月4日PCT提交1993年4月30日PCT公布。 公开号WO93 / 22846 日期：1993年11月11日无线电话装置（1）设置有布置在电话机主体（10）中的无线电部分（12）和杆状天线（15）之间的舌簧开关（13），其连接无线电 当电话机主体（10）与汽车套件（20）分离时，该部分（12）和杆状天线（15）彼此相连。 汽车套件设置有当电话机主体（10）被放置在汽车套件（20）上时使舌簧开关（13）发电的磁体（27），使得簧片开关（13）变为 无线电部分（12）和外部天线（26）彼此连接的模式。 因此，可以在电话机主体（10）的棒状天线（15）与汽车用具（20）的外部天线（26）之间切换天线，而不会增加电流消耗 并且不会使电路更复杂。

公开(公告)号：US5438482A

公开(公告)日：1995-08-01

申请号：US254057

申请日：1994-06-03

申请人： Yutaka Nakamura ,  Noboru Koike

发明人： Yutaka Nakamura ,  Noboru Koike

IPC分类号： H05K1/02 ,  H04B1/38 ,  H05K1/14 ,  H05K7/14 ,  H05K9/00

CPC分类号： H04B1/3838 ,  H04B1/3816 ,  H04B1/3833 ,  H05K7/1417 ,  H05K9/0037

摘要： A shield structure for use in an electronic apparatus includes a shield case for covering a first and second circuitry block and for isolating each other. In order to enhance the electrical connection of the shield case to a first ground on a first circuit board and a second ground on a second circuit board, a conductive component is fastened to the shield case. The conductive component includes a fastening portion, a first contact portion contacting the first ground, and a second contact portion contacting the second ground.

摘要翻译： 用于电子设备的屏蔽结构包括用于覆盖第一和第二电路块并彼此隔离的屏蔽壳。 为了增强屏蔽壳体与第一电路板上的第一接地和第二电路板上的第二接地的电连接，导电部件被紧固到屏蔽壳体上。 导电部件包括紧固部分，接触第一接地的第一接触部分和接触第二接地的第二接触部分。

公开(公告)号：US5079558A

公开(公告)日：1992-01-07

申请号：US432842

申请日：1989-11-07

申请人： Noboru Koike

发明人： Noboru Koike

IPC分类号： H01Q1/10 ,  H01Q1/24

CPC分类号： H01Q1/084 ,  H01Q1/10 ,  H01Q1/244

摘要： An extendable antenna device which is reducible in length when accommodated and ensures enough elasticity at an area of junction to a housing of a radio device. A first elongated flexible antenna section is connected slidably with a second antenna section. A hold mechanism is provided which holds the first antenna section against the housing of the radio device, and which accommodates and holds the first and second antenna sections in the housing of the radio device.