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公开(公告)号：US07948760B2
公开(公告)日：2011-05-24
申请号：US10962450
申请日：2004-10-13
IPC分类号： H05K1/00
CPC分类号： G02B6/4246 , G02B6/4292 , H05K1/189 , H05K3/4691 , H05K2201/10121
摘要： A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.
摘要翻译： 发送/接收光学模块具有光传输子组件182，光接收子组件183和电路板1，其中电路板1通过刚性/柔性衬底形成为一个构件。 电路板主体2a，2b和光接收组件固定区域4由刚性区域5A，5b和5P形成。 设置在电路板主体2a和光接收组件4之间的区域由柔性区域6P组成。 电路板主体2的一部分由柔性区域6构成。
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公开(公告)号：US20110267784A1
公开(公告)日：2011-11-03
申请号：US13098774
申请日：2011-05-02
IPC分类号： H05K1/00
CPC分类号： G02B6/4246 , G02B6/4292 , H05K1/189 , H05K3/4691 , H05K2201/10121
摘要： A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.
摘要翻译： 发送/接收光学模块具有光传输子组件182，光接收子组件183和电路板1，其中电路板1通过刚性/柔性衬底形成为一个构件。 电路板主体2a，2b和光接收组件固定区域4由刚性区域5A，5b和5P形成。 设置在电路板主体2a和光接收组件4之间的区域由柔性区域6P组成。 电路板主体2的一部分由柔性区域6构成。
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公开(公告)号：US20050168957A1
公开(公告)日：2005-08-04
申请号：US10962450
申请日：2004-10-13
CPC分类号： G02B6/4246 , G02B6/4292 , H05K1/189 , H05K3/4691 , H05K2201/10121
摘要： A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.
摘要翻译： 发送/接收光学模块具有光传输子组件182，光接收子组件183和电路板1，其中电路板1通过刚性/柔性衬底形成为一个构件。 电路板主体2a，2b和光接收组件固定区域4由刚性区域5A，5B和5P形成。设置在电路板主体2a和光接收组件4之间的区域 由柔性区域6P构成。电路基板主体2的一部分由柔性区域6构成。
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公开(公告)号：US08373992B2
公开(公告)日：2013-02-12
申请号：US13098774
申请日：2011-05-02
IPC分类号： H05K1/00
CPC分类号： G02B6/4246 , G02B6/4292 , H05K1/189 , H05K3/4691 , H05K2201/10121
摘要： A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.
摘要翻译： 发送/接收光学模块具有光传输子组件182，光接收子组件183和电路板1，其中电路板1通过刚性/柔性衬底形成为一个构件。 电路板主体2a，2b和光接收组件固定区域4由刚性区域5A，5b和5P形成。 设置在电路板主体2a和光接收组件4之间的区域由柔性区域6P组成。 电路板主体2的一部分由柔性区域6构成。
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5.发明授权Board assembly, optical transceiver using same and method for mounting same on object 失效板组件，使用相同的光收发器以及将其安装在物体上的方法公开(公告)号：US07290944B2
公开(公告)日：2007-11-06
申请号：US11285004
申请日：2005-11-23
IPC分类号： G02B6/36
CPC分类号： H05K1/189 , G02B6/4201 , G02B6/4246 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K3/4691 , H05K2201/10121 , H05K2201/2009
摘要： A board assembly, an optical transceiver using same, and a method for mounting a board assembly that can relax a stress occurred at a flexible board. A board assembly 1 comprises a flexible board 2, a first rigid board 3, and a second rigid board 4. The first rigid board 3 and the second rigid board 4 are connected with each other by means of the flexible board 2. Since the flexible board 2 is preformed before the attachment, the stress occurred at the flexible board 2 can be relaxed.
摘要翻译： 板组件，使用其的光收发器以及用于安装板组件的方法，该组件可以在柔性板处发生应力放松。 板组件1包括柔性板2，第一刚性板3和第二刚性板4.第一刚性板3和第二刚性板4通过柔性板2彼此连接。由于柔性板 板2在安装之前进行，柔性板2上发生的应力可以放松。
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公开(公告)号：US20050207459A1
公开(公告)日：2005-09-22
申请号：US11032171
申请日：2005-01-11
申请人： Juhyun Yu , Yoshiaki Ishigami , Yoshinori Sunaga , Akihiro Hiruta
发明人： Juhyun Yu , Yoshiaki Ishigami , Yoshinori Sunaga , Akihiro Hiruta
IPC分类号： H01L23/38 , F25B21/02 , H01L23/40 , H01L31/0203 , H01L35/30 , H01S3/04 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/0683
CPC分类号： H01S5/02212 , F25B21/02 , H01L31/0203 , H01L2924/0002 , H01S5/02288 , H01S5/02415 , H01S5/02492 , H01S5/0683 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.
摘要翻译： 具有冷却功能的光电转换模块具有用于发送/接收光信号的半导体元件，用于固定半导体元件的杆，覆盖半导体元件的帽，以及向半导体元件施加电信号的引线 传输来自半导体元件的电信号，其中在杆上设置有分别形成有散热元件的热释放装置和用于吸热的热传导部件和用于散热的热传导部件， 并且半导体元件直接设置在热传导构件上用于吸热。
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公开(公告)号：US07352010B2
公开(公告)日：2008-04-01
申请号：US11032171
申请日：2005-01-11
申请人： Juhyun Yu , Yoshiaki Ishigami , Yoshinori Sunaga , Akihiro Hiruta
发明人： Juhyun Yu , Yoshiaki Ishigami , Yoshinori Sunaga , Akihiro Hiruta
CPC分类号： H01S5/02212 , F25B21/02 , H01L31/0203 , H01L2924/0002 , H01S5/02288 , H01S5/02415 , H01S5/02492 , H01S5/0683 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.
摘要翻译： 具有冷却功能的光电转换模块具有用于发送/接收光信号的半导体元件，用于固定半导体元件的杆，覆盖半导体元件的帽，以及向半导体元件施加电信号的引线 传输来自半导体元件的电信号，其中在杆上设置有分别形成有散热元件的热释放装置和用于吸热的热传导部件和用于散热的热传导部件， 并且半导体元件直接设置在热传导构件上用于吸热。
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8.发明申请Board assembly, optical transceiver using same and method for mounting same on object 失效板组件，使用相同的光收发器以及将其安装在物体上的方法公开(公告)号：US20060257081A1
公开(公告)日：2006-11-16
申请号：US11285004
申请日：2005-11-23
IPC分类号： G02B6/36
CPC分类号： H05K1/189 , G02B6/4201 , G02B6/4246 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K3/4691 , H05K2201/10121 , H05K2201/2009
摘要： A board assembly, an optical transceiver using same, and a method for mounting a board assembly that can relax a stress occurred at a flexible board. A board assembly 1 comprises a flexible board 2, a first rigid board 3, and a second rigid board 4. The first rigid board 3 and the second rigid board 4 are connected with each other by means of the flexible board 2. Since the flexible board 2 is preformed before the attachment, the stress occurred at the flexible board 2 can be relaxed.
摘要翻译： 板组件，使用其的光收发器以及用于安装板组件的方法，该组件可以在柔性板处发生应力放松。 板组件1包括柔性板2，第一刚性板3和第二刚性板4.第一刚性板3和第二刚性板4通过柔性板2彼此连接。由于柔性板 板2在安装之前进行，柔性板2上发生的应力可以放松。
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公开(公告)号：US07348497B2
公开(公告)日：2008-03-25
申请号：US11178490
申请日：2005-07-12
申请人： Hidetaka Kawauchi , Yoshiaki Ishigami , Kinya Yamazaki , Juhyun Yu , Tenpei Inoue , Hiroki Katayama
发明人： Hidetaka Kawauchi , Yoshiaki Ishigami , Kinya Yamazaki , Juhyun Yu , Tenpei Inoue , Hiroki Katayama
IPC分类号： H05K1/16
CPC分类号： H05K1/182 , H05K1/117 , H05K1/189 , H05K3/4691 , H05K2201/09845 , H05K2201/10121 , H05K2201/10446
摘要： A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
摘要翻译： 电子部件的安装结构设置有电路板，该电路板在其一个端部形成台阶部。 台阶部分被电子部件的引线夹在中间，以将引线固定到台阶部分。 台阶部通过对电路板的一个表面上的区域进行穿孔而形成，然后剥离对应于穿孔区域的电路板的一部分，以便减小该区域的电路板的厚度。
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公开(公告)号：US20060065432A1
公开(公告)日：2006-03-30
申请号：US11178490
申请日：2005-07-12
申请人： Hidetaka Kawauchi , Yoshiaki Ishigami , Kinya Yamazaki , Juhyun Yu , Tenpei Inoue , Hiroki Katayama
发明人： Hidetaka Kawauchi , Yoshiaki Ishigami , Kinya Yamazaki , Juhyun Yu , Tenpei Inoue , Hiroki Katayama
IPC分类号： H05K7/06
CPC分类号： H05K1/182 , H05K1/117 , H05K1/189 , H05K3/4691 , H05K2201/09845 , H05K2201/10121 , H05K2201/10446
摘要： A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
摘要翻译： 电子部件的安装结构设置有电路板，该电路板在其一个端部形成台阶部。 台阶部分被电子部件的引线夹在中间，以将引线固定到台阶部分。 台阶部通过对电路板的一个表面上的区域进行穿孔而形成，然后剥离对应于穿孔区域的电路板的一部分，以便减小该区域的电路板的厚度。
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