Polishing apparatus and polishing method
    1.
    发明申请
    Polishing apparatus and polishing method 有权
    抛光设备和抛光方法

    公开(公告)号:US20090111358A1

    公开(公告)日:2009-04-30

    申请号:US12289507

    申请日:2008-10-29

    IPC分类号: B24B49/00 B24B49/16 B24B7/20

    CPC分类号: B24B37/013 B24B49/16

    摘要: The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.

    摘要翻译: 本发明提供一种用于在基板上研磨诸如膜的物体材料的装置。 该设备包括:用于保持具有抛光表面的抛光垫的抛光台,构造成驱动抛光台的电机;保持机构,其构造成保持具有待抛光物体的基板,并将基板压靠在抛光表面上; 修整器,其被配置为修整抛光表面;以及监视单元,被配置为监视对象材料的移除量。 监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量,以及表示修整器的累积操作时间的变量。

    Polishing apparatus and polishing method
    2.
    发明授权
    Polishing apparatus and polishing method 有权
    抛光设备和抛光方法

    公开(公告)号:US08078306B2

    公开(公告)日:2011-12-13

    申请号:US12289507

    申请日:2008-10-29

    IPC分类号: G06F19/00

    CPC分类号: B24B37/013 B24B49/16

    摘要: An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.

    摘要翻译: 一种装置在基板上抛光诸如膜之类的物体材料。 该设备包括:用于保持具有抛光表面的抛光垫的抛光台,构造成驱动抛光台的电机;保持机构,其构造成保持具有待抛光物体的基板,并将基板压靠在抛光表面上; 修整器,其被配置为修整抛光表面;以及监视单元,被配置为监视对象材料的移除量。 监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量,以及表示修整器的累积操作时间的变量。

    Fastening device
    6.
    发明授权
    Fastening device 失效
    紧固装置

    公开(公告)号:US5516247A

    公开(公告)日:1996-05-14

    申请号:US292282

    申请日:1994-08-18

    摘要: The invention is a fastening device for fastening a plurality of structures using a bolt and a nut. At least two bolts are provided each having a screw portion at one end. At least one nut is provided for each of the bolts. The nut has a flange having a diameter greater than a distance between axes of the bolts with relative rotation of the nuts being restricted by fixing mutually overlapping portions of the flanges of the nuts threaded on the bolts to each other.

    摘要翻译: 本发明是用于使用螺栓和螺母紧固多个结构的紧固装置。 至少提供两个螺栓,每个螺栓在一端具有螺钉部分。 为每个螺栓提供至少一个螺母。 螺母具有直径大于螺栓轴线之间的距离的凸缘,螺母的相对旋转通过将螺栓螺纹连接的螺母的凸缘的相互重叠的部分彼此固定而受到限制。

    POLISHING METHOD
    9.
    发明申请
    POLISHING METHOD 有权
    抛光方法

    公开(公告)号:US20090286332A1

    公开(公告)日:2009-11-19

    申请号:US12465024

    申请日:2009-05-13

    IPC分类号: H01L21/66

    摘要: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.

    摘要翻译: 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括:进行第一抛光处理后的第一抛光处理,在第一抛光处理之后,在第二抛光处理之后执行去除阻挡膜的第二抛光工艺,进行抛光绝缘膜的第三抛光处理 第二抛光工艺和第三抛光工艺,用涡流传感器监测衬底的抛光状态,并且当涡流传感器的输出信号达到预定阈值时终止第三抛光处理。