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    Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil
    1.
    发明授权
    Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil 失效
    环氧树脂，酚醛树脂，丁二烯颗粒和氨基硅油的组成

    公开(公告)号：US06596813B2

    公开(公告)日：2003-07-22

    申请号：US09902584

    申请日：2001-07-12

    申请人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    发明人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    IPC分类号： C08L6300

    CPC分类号： C08L63/04 ,  Y10T428/31511 ,  C08L2666/02

    摘要： An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

    摘要翻译： 一种半导体封装用环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂和（C）二次粒子的平均粒径为100μm以下的具有如下尺寸分布的丁二烯橡胶粒子， 粒径为250μm以下的二次粒子的比例为97重量％以上，粒径为150μm以下的二次粒子的比例为80重量％以上， 和（D）每分子具有至少一个氨基的硅油。 组分（C）均匀分散在组合物中，而不形成粗团块以确保低应力性能。

    Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant
    2.
    发明授权
    Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant 有权
    具有二次粒径的丁二烯橡胶颗粒用于环氧树脂密封剂

    公开(公告)号：US06288169B1

    公开(公告)日：2001-09-11

    申请号：US09296666

    申请日：1999-04-22

    申请人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    发明人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    IPC分类号： C08L6300

    CPC分类号： C08L63/04 ,  Y10T428/31511 ,  C08L2666/02

    摘要： An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

    摘要翻译： 一种半导体封装用环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂和（C）二次粒子的平均粒径为100μm以下的具有如下尺寸分布的丁二烯橡胶粒子， 粒径250μm以下的二次粒子的比例为97重量％以上，粒径为150μm以下的二次粒子的比例为80重量％以上。 组分（C）均匀分散在组合物中，而不形成粗团块以确保低应力性能。

    Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
    3.
    发明授权
    Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device 失效
    用于半导体封装的环氧树脂组合物，其制造方法和半导体器件

    公开(公告)号：US06962957B2

    公开(公告)日：2005-11-08

    申请号：US10421696

    申请日：2003-04-24

    申请人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    发明人： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

    IPC分类号： C08L9/00 ,  C08G59/62 ,  C08L63/00 ,  C08L63/04 ,  C08L83/08 ,  H01L23/29 ,  H01L23/31

    CPC分类号： C08L63/04 ,  Y10T428/31511 ,  C08L2666/02

    摘要： An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

    摘要翻译： 一种半导体封装用环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂和（C）二次粒子的平均粒径为100μm以下的具有如下尺寸分布的丁二烯橡胶粒子， 粒径250μm以下的二次粒子的比例为97重量％以上，粒径为150μm以下的二次粒子的比例为80重量％以上。 组分（C）均匀分散在组合物中，而不形成粗团块以确保低应力性能。

    Waveguide
    4.
    发明申请
    Waveguide 审中-公开
    波导

    公开(公告)号：US20120033931A1

    公开(公告)日：2012-02-09

    申请号：US13271793

    申请日：2011-10-12

    申请人： Hideyuki Usui ,  Takaki Naito

    发明人： Hideyuki Usui ,  Takaki Naito

    IPC分类号： G02B6/00

    CPC分类号： H01P3/12 ,  H01P11/002

    摘要： A waveguide having a main body, an inner housing, and a wave receiving transmission path. The main body includes a body resin member, a concave groove extending in a longitudinal direction and a body metal plating layer over an entire surface of the concave groove. The inner housing has a resin cover member and an inner housing metal plating layer along an inner wall of the inner housing. The wave receiving transmission path is formed when the inner housing covers the concave groove of the main body when the main body and cover are assembled together.

    摘要翻译： 一种具有主体，内壳和波接收传输路径的波导。 主体包括主体树脂构件，在纵向方向上延伸的凹槽和在凹槽的整个表面上的主体金属镀层。 内壳体沿着内壳体的内壁具有树脂盖构件和内壳金属镀层。 当主体和盖组装在一起时，当内壳体覆盖主体的凹槽时，形成波浪接收传输路径。

    Microlens array
    5.
    发明授权
    Microlens array 有权
    微透镜阵列

    公开(公告)号：US08021756B2

    公开(公告)日：2011-09-20

    申请号：US12547136

    申请日：2009-08-25

    申请人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

    发明人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

    IPC分类号： B32B9/04

    CPC分类号： B29D11/00365 ,  G02B1/041 ,  G02B3/0031 ,  Y10T428/31663 ,  C08L83/14

    摘要： The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

    摘要翻译： 本发明提供一种微透镜阵列，其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示 烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

    Process for producing optical waveguide
    6.
    发明授权
    Process for producing optical waveguide 有权
    光波导制造工艺

    公开(公告)号：US07215862B2

    公开(公告)日：2007-05-08

    申请号：US11276590

    申请日：2006-03-07

    申请人： Ryuusuke Naitou ,  Hideyuki Usui ,  Amane Mochizuki

    发明人： Ryuusuke Naitou ,  Hideyuki Usui ,  Amane Mochizuki

    IPC分类号： G02B6/10

    CPC分类号： G02B6/4214 ,  G02B6/125 ,  G02B6/138 ,  G02B6/43

    摘要： The present invention provides a process for producing an optical waveguide which comprises: disposing on an undercladding layer at least one member for forming an optical-path deflection plane; forming a photosensitive resin layer over the undercladding layer so as to at least partly cover the member for forming an optical-path deflection plane; subjecting the photosensitive resin layer to exposure and then development to thereby form at least one core layer; and forming an overcladding layer over the undercladding layer so as to cover the at least one core layer.

    摘要翻译： 本发明提供了一种制造光波导的方法，该方法包括：在下封层上设置至少一个用于形成光路偏转平面的构件; 在所述下包层上形成感光性树脂层，以至少部分地覆盖用于形成光路偏转面的构件; 使感光性树脂层曝光，然后显影，从而形成至少一个芯层; 以及在所述下包层上形成外包层以覆盖所述至少一个芯层。

    Docking-type function-providing apparatus and portable device
    7.
    发明授权
    Docking-type function-providing apparatus and portable device 失效
    对接式功能提供装置和便携式装置

    公开(公告)号：US07038908B2

    公开(公告)日：2006-05-02

    申请号：US10730320

    申请日：2003-12-08

    申请人： Hideyuki Usui ,  Kazuihiko Yamazaki ,  Hisashi Shima

    发明人： Hideyuki Usui ,  Kazuihiko Yamazaki ,  Hisashi Shima

    IPC分类号： G06F1/16

    CPC分类号： G06F1/1632

    摘要： A docking-type function-providing apparatus for providing a predetermined function to a portable device docked with the apparatus via their respective connectors has a coupling face 1 coupled with a device coupling face on the portable device at the time of docking, the connector 2 of the apparatus provided on the coupling face 1 to connect with the connector of the device by the above-mentioned coupling, and a guide face 3 parallel to a plane intersecting the coupling face 1 and capable of guiding a guided face on the portable device at the time of docking. The position of the guide face 3 can be changed in the direction of intersection with the guide face 3.

    摘要翻译： 用于通过其相应的连接器向与设备对接的便携式设备提供预定功能的对接式功能提供设备具有在对接时与便携式设备上的设备耦合面耦合的耦合面1，连接器2 设置在联接面1上的装置通过上述联轴器与装置的连接器连接，以及平行于与联接面1相交的平面的导向面3，并且能够在便携装置上引导导向面 对接时间。 引导面3的位置可以在与引导面3的交叉方向上变化。