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    Atomic layer deposition of metal oxides for memory applications
    5.
    发明授权
    Atomic layer deposition of metal oxides for memory applications 有权
    用于记忆应用的金属氧化物的原子层沉积

    公开(公告)号：US08846443B2

    公开(公告)日：2014-09-30

    申请号：US13198837

    申请日：2011-08-05

    申请人： Zhendong Hong ,  Hieu Pham ,  Randall Higuchi ,  Vidyut Gopal ,  Imran Hashim ,  Tim Minvielle ,  Takeshi Yamaguchi

    发明人： Zhendong Hong ,  Hieu Pham ,  Randall Higuchi ,  Vidyut Gopal ,  Imran Hashim ,  Tim Minvielle ,  Takeshi Yamaguchi

    IPC分类号： H01L21/00 ,  H01L21/8222 ,  H01L45/00 ,  H01L27/24

    CPC分类号： H01L45/146 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/1616

    摘要： Embodiments of the invention generally relate to nonvolatile memory devices and methods for manufacturing such memory devices. The methods for forming improved memory devices, such as a ReRAM cells, provide optimized, atomic layer deposition (ALD) processes for forming a metal oxide film stack which contains at least one hard metal oxide film (e.g., metal is completely oxidized or substantially oxidized) and at least one soft metal oxide film (e.g., metal is less oxidized than hard metal oxide). The soft metal oxide film is less electrically resistive than the hard metal oxide film since the soft metal oxide film is less oxidized or more metallic than the hard metal oxide film. In one example, the hard metal oxide film is formed by an ALD process utilizing ozone as the oxidizing agent while the soft metal oxide film is formed by another ALD process utilizing water vapor as the oxidizing agent.

    摘要翻译： 本发明的实施例一般涉及用于制造这种存储器件的非易失性存储器件和方法。 用于形成改进的存储器件（例如ReRAM单元）的方法提供优化的原子层沉积（ALD）工艺，用于形成金属氧化物膜堆叠，其包含至少一个硬金属氧化物膜（例如，金属被完全氧化或基本上被氧化 ）和至少一种软金属氧化物膜（例如，金属比硬金属氧化物氧化较少）。 由于软金属氧化物膜比硬金属氧化物膜氧化得更少或更金属，所以软金属氧化物膜的电阻小于硬金属氧化物膜。 在一个实例中，通过利用臭氧作为氧化剂的ALD工艺形成硬质金属氧化物膜，而通过利用水蒸汽作为氧化剂的另一ALD工艺形成软金属氧化物膜。

    ATOMIC LAYER DEPOSITION OF METAL OXIDES FOR MEMORY APPLICATIONS
    6.
    发明申请
    ATOMIC LAYER DEPOSITION OF METAL OXIDES FOR MEMORY APPLICATIONS 有权
    原子层沉积金属氧化物存储器应用

    公开(公告)号：US20130034947A1

    公开(公告)日：2013-02-07

    申请号：US13198837

    申请日：2011-08-05

    申请人： Zhendong Hong ,  Hieu Pham ,  Randall Higuchi ,  Vidyut Gopal ,  Imran Hashim

    发明人： Zhendong Hong ,  Hieu Pham ,  Randall Higuchi ,  Vidyut Gopal ,  Imran Hashim

    IPC分类号： H01L21/20 ,  B82Y40/00

    CPC分类号： H01L45/146 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/1616

    摘要： Embodiments of the invention generally relate to nonvolatile memory devices and methods for manufacturing such memory devices. The methods for forming improved memory devices, such as a ReRAM cells, provide optimized, atomic layer deposition (ALD) processes for forming a metal oxide film stack which contains at least one hard metal oxide film (e.g., metal is completely oxidized or substantially oxidized) and at least one soft metal oxide film (e.g., metal is less oxidized than hard metal oxide). The soft metal oxide film is less electrically resistive than the hard metal oxide film since the soft metal oxide film is less oxidized or more metallic than the hard metal oxide film. In one example, the hard metal oxide film is formed by an ALD process utilizing ozone as the oxidizing agent while the soft metal oxide film is formed by another ALD process utilizing water vapor as the oxidizing agent.

    摘要翻译： 本发明的实施例一般涉及用于制造这种存储器件的非易失性存储器件和方法。 用于形成改进的存储器件（例如ReRAM单元）的方法提供优化的原子层沉积（ALD）工艺，用于形成金属氧化物膜堆叠，其含有至少一个硬金属氧化物膜（例如，金属被完全氧化或基本上被氧化 ）和至少一种软金属氧化物膜（例如，金属比硬金属氧化物氧化较少）。 由于软金属氧化物膜比硬金属氧化物膜氧化得更少或更金属，所以软金属氧化物膜的电阻小于硬金属氧化物膜。 在一个实例中，通过利用臭氧作为氧化剂的ALD工艺形成硬质金属氧化物膜，而通过利用水蒸汽作为氧化剂的另一ALD工艺形成软金属氧化物膜。

    Embedded Nonvolatile Memory Elements Having Resistive Switching Characteristics
    7.
    发明申请
    Embedded Nonvolatile Memory Elements Having Resistive Switching Characteristics 有权
    具有电阻开关特性的嵌入式非易失性存储器元件

    公开(公告)号：US20140078808A1

    公开(公告)日：2014-03-20

    申请号：US13621371

    申请日：2012-09-17

    申请人： Imran Hashim ,  Tony Chiang ,  Vidyut Gopal ,  Yun Wang

    发明人： Imran Hashim ,  Tony Chiang ,  Vidyut Gopal ,  Yun Wang

    IPC分类号： H01L27/24 ,  G11C11/21

    CPC分类号： H01L45/1608 ,  G11C13/0007 ,  G11C13/0069 ,  G11C2213/32 ,  G11C2213/51 ,  G11C2213/52 ,  G11C2213/74 ,  G11C2213/79 ,  H01L27/2436 ,  H01L45/08 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/1253 ,  H01L45/146

    摘要： Provided are nonvolatile memory assemblies each including a resistive switching layer and current steering element. The steering element may be a transistor connected in series with the switching layer. Resistance control provided by the steering element allows using switching layers requiring low switching voltages and currents. Memory assemblies including such switching layers are easier to embed into integrated circuit chips having other low voltage components, such as logic and digital signal processing components, than, for example, flash memory requiring much higher switching voltages. In some embodiments, provided nonvolatile memory assemblies operate at switching voltages less than about 3.0V and corresponding currents less than 50 microamperes. A memory element may include a metal rich hafnium oxide disposed between a titanium nitride electrode and doped polysilicon electrode. One electrode may be connected to a drain or source of the transistor, while another electrode is connected to a signal line.

    摘要翻译： 提供了各自包括电阻式开关层和电流控制元件的非易失性存储器组件。 转向元件可以是与开关层串联连接的晶体管。 由转向元件提供的电阻控制允许使用需要低开关电压和电流的开关层。 包括这种开关层的存储器组件比例如需要高得多的开关电压的闪速存储器更容易嵌入到具有其它低电压组件（例如逻辑和数字信号处理组件）的集成电路芯片中。 在一些实施例中，所提供的非易失性存储器组件在小于约3.0V的开关电压和小于50微安的相应电流下工作。 存储元件可以包括设置在氮化钛电极和掺杂多晶硅电极之间的富含金属的氧化铪。 一个电极可以连接到晶体管的漏极或源极，而另一个电极连接到信号线。

    Embedded nonvolatile memory elements having resistive switching characteristics
    10.
    发明授权
    Embedded nonvolatile memory elements having resistive switching characteristics 有权
    具有电阻开关特性的嵌入式非易失性存储元件

    公开(公告)号：US09129894B2

    公开(公告)日：2015-09-08

    申请号：US13621371

    申请日：2012-09-17

    申请人： Imran Hashim ,  Tony Chiang ,  Vidyut Gopal ,  Yun Wang

    发明人： Imran Hashim ,  Tony Chiang ,  Vidyut Gopal ,  Yun Wang

    IPC分类号： G11C11/21 ,  H01L27/24 ,  G11C13/00 ,  H01L45/00

    CPC分类号： H01L45/1608 ,  G11C13/0007 ,  G11C13/0069 ,  G11C2213/32 ,  G11C2213/51 ,  G11C2213/52 ,  G11C2213/74 ,  G11C2213/79 ,  H01L27/2436 ,  H01L45/08 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/1253 ,  H01L45/146

    摘要： Provided are nonvolatile memory assemblies each including a resistive switching layer and current steering element. The steering element may be a transistor connected in series with the switching layer. Resistance control provided by the steering element allows using switching layers requiring low switching voltages and currents. Memory assemblies including such switching layers are easier to embed into integrated circuit chips having other low voltage components, such as logic and digital signal processing components, than, for example, flash memory requiring much higher switching voltages. In some embodiments, provided nonvolatile memory assemblies operate at switching voltages less than about 3.0V and corresponding currents less than 50 microamperes. A memory element may include a metal rich hafnium oxide disposed between a titanium nitride electrode and doped polysilicon electrode. One electrode may be connected to a drain or source of the transistor, while another electrode is connected to a signal line.

    摘要翻译： 提供了各自包括电阻式开关层和电流控制元件的非易失性存储器组件。 转向元件可以是与开关层串联连接的晶体管。 由转向元件提供的电阻控制允许使用需要低开关电压和电流的开关层。 包括这种开关层的存储器组件比例如需要高得多的开关电压的闪速存储器更容易嵌入到具有其它低电压组件（例如逻辑和数字信号处理组件）的集成电路芯片中。 在一些实施例中，所提供的非易失性存储器组件在小于约3.0V的开关电压和小于50微安的相应电流下工作。 存储元件可以包括设置在氮化钛电极和掺杂多晶硅电极之间的富含金属的氧化铪。 一个电极可以连接到晶体管的漏极或源极，而另一个电极连接到信号线。