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公开(公告)号：US08541099B2
公开(公告)日：2013-09-24
申请号：US12350764
申请日：2009-01-08
申请人： Hirofumi Fujii , Yoshio Terada , Kazumasa Igarashi
发明人： Hirofumi Fujii , Yoshio Terada , Kazumasa Igarashi
IPC分类号： B32B27/06
CPC分类号： C08G73/1025 , C08G73/10 , C08K3/04 , C08K5/3432 , C08L79/08 , G03F7/0387 , Y10T428/254 , Y10T428/2822 , Y10T428/31663
摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。
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公开(公告)号：US20070293597A1
公开(公告)日：2007-12-20
申请号：US11665772
申请日：2005-10-19
申请人： Hirofumi Fujii , Yoshio Terada , Kazumasa Igarashi
发明人： Hirofumi Fujii , Yoshio Terada , Kazumasa Igarashi
CPC分类号： C08G73/1025 , C08G73/10 , C08K3/04 , C08K5/3432 , C08L79/08 , G03F7/0387 , Y10T428/254 , Y10T428/2822 , Y10T428/31663
摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。
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公开(公告)号：US20090130432A1
公开(公告)日：2009-05-21
申请号：US12350764
申请日：2009-01-08
申请人： Hirofumi FUJII , Yoshio Terada , Kazumasa Igarashi
发明人： Hirofumi FUJII , Yoshio Terada , Kazumasa Igarashi
IPC分类号： B32B27/06
CPC分类号： C08G73/1025 , C08G73/10 , C08K3/04 , C08K5/3432 , C08L79/08 , G03F7/0387 , Y10T428/254 , Y10T428/2822 , Y10T428/31663
摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials.The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。
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4.发明授权Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法公开(公告)号：US07793668B2
公开(公告)日：2010-09-14
申请号：US11014779
申请日：2004-12-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： B08B3/00
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。
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5.发明申请Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法公开(公告)号：US20050244632A1
公开(公告)日：2005-11-03
申请号：US11014779
申请日：2004-12-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。
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6.发明申请CLEANING SHEET, CONVEYING MEMBER USING THE SAME, AND SUBSTRATE PROCESSING EQUIPMENT CLEANING METHOD USING THEM 审中-公开使用它们的清洁片，输送构件和使用它们的基板处理设备清洁方法公开(公告)号：US20100319151A1
公开(公告)日：2010-12-23
申请号：US12851797
申请日：2010-08-06
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： A47L25/00
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。
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7.发明授权公开(公告)号：US07575812B2
公开(公告)日：2009-08-18
申请号：US11252800
申请日：2005-10-19
CPC分类号： B32B27/28 , B32B27/06 , B32B27/34 , B32B27/36 , B32B2307/31 , B32B2307/54 , B32B2432/00 , Y10T428/28 , Y10T428/2896 , Y10T428/31504 , Y10T428/31721
摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
摘要翻译： 本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。
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8.发明申请公开(公告)号：US20060141258A1
公开(公告)日：2006-06-29
申请号：US11252800
申请日：2005-10-19
IPC分类号： B32B27/00
CPC分类号： B32B27/28 , B32B27/06 , B32B27/34 , B32B27/36 , B32B2307/31 , B32B2307/54 , B32B2432/00 , Y10T428/28 , Y10T428/2896 , Y10T428/31504 , Y10T428/31721
摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
摘要翻译： 本发明提供一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 / 在衬底的至少一个面上的SUP> Pa至1×10 9 Pa; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。
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9.发明申请Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 审中-公开清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法公开(公告)号：US20060105164A1
公开(公告)日：2006-05-18
申请号：US11229586
申请日：2005-09-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , C08G73/12 , C08G73/16 , C08J7/047 , C08J2409/00 , C08J2479/00 , G11B5/41 , Y10T428/28 , Y10T442/2738
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。
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公开(公告)号：US08822058B2
公开(公告)日：2014-09-02
申请号：US13944591
申请日：2013-07-17
申请人： Yoshio Terada , Akira Shouji , Kouki Tomioka , Kenji Furuta , Midori Tojo , Kazunori Hayashi , Shoujirou Moriki
发明人： Yoshio Terada , Akira Shouji , Kouki Tomioka , Kenji Furuta , Midori Tojo , Kazunori Hayashi , Shoujirou Moriki
摘要： An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.
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