公开(公告)号：US20090130432A1

公开(公告)日：2009-05-21

申请号：US12350764

申请日：2009-01-08

申请人： Hirofumi FUJII ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi FUJII ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： B32B27/06

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials.The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US20070293597A1

公开(公告)日：2007-12-20

申请号：US11665772

申请日：2005-10-19

申请人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： C08G73/10 ,  C08L79/08

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US08541099B2

公开(公告)日：2013-09-24

申请号：US12350764

申请日：2009-01-08

申请人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： B32B27/06

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US10025432B2

公开(公告)日：2018-07-17

申请号：US14128442

申请日：2012-06-20

申请人： Hiroaki Kishioka ,  Mayumi Kishioka ,  Tomohide Banba ,  Mitsuru Honjo ,  Naoki Nagaoka ,  Kazumasa Igarashi ,  Yuki Hasegawa ,  Hiroshi Wada ,  Yuki Tsubaki ,  Tomotake Nashiki

发明人： Hiroaki Kishioka ,  Tomohide Banba ,  Mitsuru Honjo ,  Naoki Nagaoka ,  Kazumasa Igarashi ,  Yuki Hasegawa ,  Hiroshi Wada ,  Yuki Tsubaki ,  Tomotake Nashiki

IPC分类号： G06F3/044 ,  C09J133/08 ,  G02F1/1333 ,  H03K17/96 ,  B32B7/12 ,  B23B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  C09J7/24 ,  H01L27/32

摘要： Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.

公开(公告)号：US20100059113A1

公开(公告)日：2010-03-11

申请号：US12514122

申请日：2007-10-26

申请人： Yuki Hasegawa ,  Kazumasa Igarashi ,  Kenichi Hiwatashi ,  Naoto Masuyama

发明人： Yuki Hasegawa ,  Kazumasa Igarashi ,  Kenichi Hiwatashi ,  Naoto Masuyama

IPC分类号： H01L31/042

CPC分类号： H01G9/2077 ,  H01G9/2031 ,  H01G9/2059 ,  H01M14/005 ,  Y02E10/542

摘要： A dye-sensitized solar cell is provided, which includes glass substrates (1, 1′) each formed with an electrically conductive transparent electrode film and bonded to each other in opposed relation with a seal member (7), and an electrolyte solution filled in a space between the glass substrates. The seal member (7) is composed of a material cured by photopolymerizing a photopolymerizable composition essentially containing a hydrogenated elastomer derivative having at least one (meth)acryloyl group at least one of its opposite molecular terminals, and the glass substrates (1, 1′) each have a portion coated with a silane coupling agent of a (meth)acryloxyalkylsilane in contact with the seal member (7). Therefore, the dye-sensitized solar cell has higher adhesive sealability and excellent durability.

摘要翻译： 提供一种染料敏化太阳能电池，其包括各自形成有导电透明电极膜并且与密封构件（7）相对地彼此结合的玻璃基板（1,1'），并且填充有电解液 玻璃基板之间的空间。 密封构件（7）由通过光聚合组合物固化的材料构成，所述光致聚合组合物基本上含有至少一个（甲基）丙烯酰基基团的氢化弹性体衍生物，其至少一个相对的分子末端，玻璃基板（1,1' ）各自具有涂覆有与密封构件（7）接触的（甲基）丙烯酰氧基烷基硅烷的硅烷偶联剂的部分。 因此，染料敏化太阳能电池具有更高的粘合密封性和优异的耐久性。

公开(公告)号：US5814894A

公开(公告)日：1998-09-29

申请号：US627996

申请日：1996-04-04

申请人： Kazumasa Igarashi ,  Megumu Nagasawa ,  Satoshi Tanigawa ,  Hideyuki Usui ,  Nobuhiko Yoshio ,  Hisataka Ito ,  Tadao Okawa

发明人： Kazumasa Igarashi ,  Megumu Nagasawa ,  Satoshi Tanigawa ,  Hideyuki Usui ,  Nobuhiko Yoshio ,  Hisataka Ito ,  Tadao Okawa

IPC分类号： C08G73/10 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/3121 ,  H01L21/563 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.

摘要翻译： 一种能够防止导电性缺陷发生的半导体器件，其中，在与电极11侧的表面相对的状态下，在辅助布线板2上安装有配备有电极11的半导体芯片1，将导体23设置在 在辅助配线板2的内部，每个引导导体23的一端形成从辅助布线板2的表面在安装半导体芯片1侧突出的内部电极21，引出导体23的另一端形成 从辅助配线板的与安装半导体芯片1的一侧相反的表面突出的外部电极22，并且每个内部电极21连接到半导体芯片1的每个电极11，至少在 半导体芯片1和辅助布线板2用热焊接聚酰亚胺树脂层封装。

公开(公告)号：US5053314A

公开(公告)日：1991-10-01

申请号：US462243

申请日：1990-01-09

申请人： Tsuguo Yamaoka ,  Amane Mochizuki ,  Kazumasa Igarashi ,  Toshihiko Omote

发明人： Tsuguo Yamaoka ,  Amane Mochizuki ,  Kazumasa Igarashi ,  Toshihiko Omote

IPC分类号： G03F7/039

CPC分类号： G03F7/039

摘要： A positively photosensitive polyimide composition is disclosed, which composition comprises polyimide having repeating unit represented by formula (I): ##STR1## wherein Ar.sup.1 represents a tetravalent aromatic hydrocarbon group; Ar.sup.2 represents a divalent aromatic hydrocarbon group having an acyloxy group at the ortho-position and/or the meta-position of the aromatic ring; Ar.sup.3 represents a divalent aromatic hydrocarbon group; and the subunit having an amount ratio of m in the repeating unit is present in an amount of at least 20% by weight based on the polyimide. The composition exhibits high photosensitivity in reproduction of a fine pattern and excellent dimensional stability.

公开(公告)号：US20070040206A1

公开(公告)日：2007-02-22

申请号：US10550625

申请日：2004-03-22

申请人： Shinji Hirai ,  Toshiyuki Nishimura ,  Yoichiro Uemura ,  Shigenori Morita ,  Michihiro Ohta ,  Kazumasa Igarashi

发明人： Shinji Hirai ,  Toshiyuki Nishimura ,  Yoichiro Uemura ,  Shigenori Morita ,  Michihiro Ohta ,  Kazumasa Igarashi

IPC分类号： H01L29/94

CPC分类号： C04B35/547 ,  C04B35/64 ,  C04B35/645 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/408 ,  C04B2235/446 ,  C04B2235/5436 ,  C04B2235/666 ,  C04B2235/762 ,  C04B2235/765 ,  H01G4/1209

摘要： A high-dielectric material which is especially useful as a material for a high-capacitance capacitor and which has a high dielectric constant is provided. The high-dielectric material is composed of a sintered body of a rare-earth sulfide, the high-dielectric material having a crystal structure of tetragonal β type, a chemical composition represented by Ln2S3 (where Ln represents a rare-earth metal), a frequency domain within the range of 0.5 kHz to 1,000 kHz, and a value of relative dielectric constant of more than 1,000 at room temperature.

摘要翻译： 提供了特别可用作高容量电容器材料并具有高介电常数的高介电材料。 高电介质材料由稀土类硫化物的烧结体构成，具有四方β型晶体结构的高电介质材料，Ln 2 S 2表示的化学成分， 3（其中Ln表示稀土金属），频域在0.5kHz至1,000kHz范围内，相对介电常数在室温下大于1000。

公开(公告)号：US06333139B1

公开(公告)日：2001-12-25

申请号：US09365786

申请日：1999-08-03

申请人： Toshihiko Omote ,  Yasuhito Funada ,  Hideyuki Usui ,  Masanori Ueno ,  Kazumasa Igarashi

发明人： Toshihiko Omote ,  Yasuhito Funada ,  Hideyuki Usui ,  Masanori Ueno ,  Kazumasa Igarashi

IPC分类号： G03C500

CPC分类号： B32B15/08 ,  G03F7/037 ,  H05K1/056 ,  Y10T428/12229 ,  Y10T428/1241 ,  Y10T428/12431 ,  Y10T428/12806 ,  Y10T428/12903 ,  Y10T428/24917 ,  Y10T428/31681

摘要： There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.

摘要翻译： 提供了一种电路形成基板，其包括长整个或不表面的聚酰亚胺树脂层的一个表面或两个表面上形成的长的不锈钢箔，以及通过使用电路形成基板形成的电路基板，其中导体层是细的 在电路形成衬底上图案化。 电路形成基板充分满足低成本，高密度和高可靠性，几乎不引起基板本身翘曲，并且具有优异的可加工性。

公开(公告)号：US5120573A

公开(公告)日：1992-06-09

申请号：US416280

申请日：1989-09-27

申请人： Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Yukio Ookoshi ,  Toshio Miyamoto ,  Mikio Aizawa ,  Kazumasa Igarashi ,  Amane Mochizuki

发明人： Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Yukio Ookoshi ,  Toshio Miyamoto ,  Mikio Aizawa ,  Kazumasa Igarashi ,  Amane Mochizuki

IPC分类号： C08G73/10 ,  H01B1/22 ,  H01B3/30 ,  H01L21/48 ,  H05K1/03

CPC分类号： H01B1/22 ,  C08G73/1007 ,  H01B3/306 ,  H01L21/481 ,  H05K1/0346 ,  H01L2224/16225

摘要： The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.