公开(公告)号：US20100229646A1

公开(公告)日：2010-09-16

申请号：US12722707

申请日：2010-03-12

申请人： Hirofumi HIGUCHI ,  Akitoshi Yamanaka ,  Tetsuo Fujii

发明人： Hirofumi HIGUCHI ,  Akitoshi Yamanaka ,  Tetsuo Fujii

IPC分类号： G01C19/56

CPC分类号： G01C19/5719

摘要： An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.

摘要翻译： 振动角速度传感器包括检测器，驱动部分和分离部分。 当检测器被驱动部分驱动振荡时产生角速度时，将科里奥利力施加到检测器。 因此，根据检测器的可动电极和固定电极之间的间隔的变化，基于电容变化来检测角速度。 分离部分远离检测器和驱动部分，并且被配置为分离容纳检测器的第一空间和容纳驱动部分的第二空间。

公开(公告)号：US08210040B2

公开(公告)日：2012-07-03

申请号：US12722707

申请日：2010-03-12

申请人： Hirofumi Higuchi ,  Akitoshi Yamanaka ,  Tetsuo Fujii

发明人： Hirofumi Higuchi ,  Akitoshi Yamanaka ,  Tetsuo Fujii

IPC分类号： G01C19/56 ,  G01P9/04 ,  G01P1/02

CPC分类号： G01C19/5719

摘要： An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.

摘要翻译： 振动角速度传感器包括检测器，驱动部分和分离部分。 当检测器被驱动部分驱动振荡时产生角速度时，将科里奥利力施加到检测器。 因此，根据检测器的可动电极和固定电极之间的间隔的变化，基于电容变化来检测角速度。 分离部分远离检测器和驱动部分，并且被配置为分离容纳检测器的第一空间和容纳驱动部分的第二空间。

公开(公告)号：US08169082B2

公开(公告)日：2012-05-01

申请号：US13287188

申请日：2011-11-02

申请人： Tetsuo Fujii ,  Akitoshi Yamanaka ,  Hisanori Yokura

发明人： Tetsuo Fujii ,  Akitoshi Yamanaka ,  Hisanori Yokura

IPC分类号： H01L23/48

CPC分类号： G01P15/125 ,  B81B7/007 ,  B81B2207/097 ,  G01C19/5719 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0814 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13009 ,  H01L2224/13011 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2518 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48463 ,  H01L2224/80001 ,  H01L2224/81805 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

公开(公告)号：US20120049381A1

公开(公告)日：2012-03-01

申请号：US13287188

申请日：2011-11-02

申请人： Tetsuo FUJII ,  Akitoshi Yamanaka ,  Hisanori Yokura

发明人： Tetsuo FUJII ,  Akitoshi Yamanaka ,  Hisanori Yokura

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： G01P15/125 ,  B81B7/007 ,  B81B2207/097 ,  G01C19/5719 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0814 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13009 ,  H01L2224/13011 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2518 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48463 ,  H01L2224/80001 ,  H01L2224/81805 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

摘要翻译： 半导体器件包括：传感器，包括在传感器的第一侧上的传感器结构和围绕传感器结构的外围元件; 以及盖，其覆盖所述传感器结构并具有结合到所述传感器的第一侧的第二侧。 盖包括在盖的第二面上的第一布线层。 第一布线层跨越周边元件。 传感器还包括传感器侧连接部分，盖子还包括帽侧连接部分。 传感器侧连接部分接合到盖侧连接部分。 传感器侧连接部和盖侧连接部中的至少一方提供共晶合金，使得传感器侧连接部和盖侧连接部彼此接合。

公开(公告)号：US08089144B2

公开(公告)日：2012-01-03

申请号：US12654087

申请日：2009-12-10

申请人： Tetsuo Fujii ,  Akitoshi Yamanaka ,  Hisanori Yokura

发明人： Tetsuo Fujii ,  Akitoshi Yamanaka ,  Hisanori Yokura

IPC分类号： H01L23/48

CPC分类号： G01P15/125 ,  B81B7/007 ,  B81B2207/097 ,  G01C19/5719 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0814 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13009 ,  H01L2224/13011 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2518 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48463 ,  H01L2224/80001 ,  H01L2224/81805 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

摘要翻译： 半导体器件包括：传感器，包括在传感器的第一侧上的传感器结构和围绕传感器结构的外围元件; 以及盖，其覆盖所述传感器结构并具有结合到所述传感器的第一侧的第二侧。 盖包括在盖的第二面上的第一布线层。 第一布线层跨越周边元件。 传感器还包括传感器侧连接部分，盖子还包括帽侧连接部分。 传感器侧连接部分接合到盖侧连接部分。 传感器侧连接部和盖侧连接部中的至少一方提供共晶合金，使得传感器侧连接部和盖侧连接部彼此接合。

公开(公告)号：US20100148341A1

公开(公告)日：2010-06-17

申请号：US12654087

申请日：2009-12-10

申请人： Tetsuo Fuji ,  Akitoshi Yamanaka ,  Hisanori Yokura

发明人： Tetsuo Fuji ,  Akitoshi Yamanaka ,  Hisanori Yokura

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/522 ,  H01L21/60 ,  H01L21/768 ,  H01L21/822

CPC分类号： G01P15/125 ,  B81B7/007 ,  B81B2207/097 ,  G01C19/5719 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0814 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13009 ,  H01L2224/13011 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2518 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48463 ,  H01L2224/80001 ,  H01L2224/81805 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

摘要翻译： 半导体器件包括：传感器，包括在传感器的第一侧上的传感器结构和围绕传感器结构的外围元件; 以及盖，其覆盖所述传感器结构并具有结合到所述传感器的第一侧的第二侧。 盖包括在盖的第二面上的第一布线层。 第一布线层跨越周边元件。 传感器还包括传感器侧连接部分，盖子还包括帽侧连接部分。 传感器侧连接部分接合到盖侧连接部分。 传感器侧连接部和盖侧连接部中的至少一方提供共晶合金，使得传感器侧连接部和盖侧连接部彼此接合。

公开(公告)号：US20090168603A1

公开(公告)日：2009-07-02

申请号：US12318187

申请日：2008-12-23

申请人： Yasuyuki Okuda ,  Kiyonari Kojima ,  Teruo Oda ,  Akitoshi Yamanaka ,  Takaaki Kawai ,  Makiko Sugiura ,  Takayuki Ishikawa

发明人： Yasuyuki Okuda ,  Kiyonari Kojima ,  Teruo Oda ,  Akitoshi Yamanaka ,  Takaaki Kawai ,  Makiko Sugiura ,  Takayuki Ishikawa

IPC分类号： G01S3/80 ,  B06B1/00

CPC分类号： G01S7/521 ,  B06B1/0629 ,  G01S3/808 ,  G01S7/52004 ,  G01S15/42 ,  G01S15/931

摘要： An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.

摘要翻译： 超声波传感器包括发送装置，排列成阵列的接收装置和电路装置。 一个接收设备被配置为参考接收设备。 电路装置包括参考信号发生器和第一和第二同步检测器。 参考信号发生器通过使用参考接收装置的接收信号产生参考信号。 第一同步检测器基于参考信号执行接收装置之一的接收信号的同步检测，以检测到对象的距离。 第二同步检测器基于参考信号执行除基准接收装置之外的接收装置的接收信号的同步检测，以检测对象的方向。

公开(公告)号：US08009518B2

公开(公告)日：2011-08-30

申请号：US12318187

申请日：2008-12-23

申请人： Yasuyuki Okuda ,  Kiyonari Kojima ,  Teruo Oda ,  Akitoshi Yamanaka

发明人： Yasuyuki Okuda ,  Kiyonari Kojima ,  Teruo Oda ,  Akitoshi Yamanaka

IPC分类号： H04R17/00

CPC分类号： G01S7/521 ,  B06B1/0629 ,  G01S3/808 ,  G01S7/52004 ,  G01S15/42 ,  G01S15/931

摘要： An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.

摘要翻译： 超声波传感器包括发送装置，排列成阵列的接收装置和电路装置。 一个接收设备被配置为参考接收设备。 电路装置包括参考信号发生器和第一和第二同步检测器。 参考信号发生器通过使用参考接收装置的接收信号产生参考信号。 第一同步检测器基于参考信号执行接收装置之一的接收信号的同步检测，以检测到对象的距离。 第二同步检测器基于参考信号执行除基准接收装置之外的接收装置的接收信号的同步检测，以检测对象的方向。

公开(公告)号：US07963155B2

公开(公告)日：2011-06-21

申请号：US12412449

申请日：2009-03-27

申请人： Jun Kondo ,  Tooru Taguchi ,  Hideo Naruse ,  Akitoshi Yamanaka

发明人： Jun Kondo ,  Tooru Taguchi ,  Hideo Naruse ,  Akitoshi Yamanaka

IPC分类号： G01M15/04

CPC分类号： F02M55/005 ,  F02M47/027 ,  F02M57/005 ,  F02M61/14 ,  F02M65/003 ,  F02M2200/24 ,  F02M2200/855 ,  G01L23/222

摘要： A fuel pressure sensor/sensor mount assembly in which a fuel pressure sensor is so mounted as to exposed to a high-pressure fuel path through which fuel is supplied to a fuel injector, a fuel injection apparatus equipped with a built-in fuel pressure sensor, and a pressure sensing apparatus working to measure the pressure of fuel in a fuel injector are provided. The fuel pressure sensor/sensor mount assembly is disposed between the high-pressure fuel path and the fuel injector, thus permitting the size of the fuel injector to be minimized without sacrificing the accuracy in measuring the pressure of the fuel. The fuel injection apparatus and the a pressure sensing apparatus are designed to ensure desired accuracy in measuring the pressure of the fuel.

摘要翻译： 一种燃料压力传感器/传感器安装组件，其中燃料压力传感器被安装成暴露于燃料被供应到燃料喷射器的高压燃料路径，配备有内置燃料压力传感器的燃料喷射装置 并且提供了用于测量燃料喷射器中的燃料压力的压力感测装置。 燃料压力传感器/传感器安装组件设置在高压燃料通道和燃料喷射器之间，从而允许燃料喷射器的尺寸最小化，而不会牺牲测量燃料压力的精度。 燃料喷射装置和压力感测装置被设计成确保测量燃料压力所需的精度。

公开(公告)号：US20090241650A1

公开(公告)日：2009-10-01

申请号：US12412449

申请日：2009-03-27

申请人： Jun Kondo ,  Tooru Taguchi ,  Hideo Naruse ,  Akitoshi Yamanaka

发明人： Jun Kondo ,  Tooru Taguchi ,  Hideo Naruse ,  Akitoshi Yamanaka

IPC分类号： G01M15/04

CPC分类号： F02M55/005 ,  F02M47/027 ,  F02M57/005 ,  F02M61/14 ,  F02M65/003 ,  F02M2200/24 ,  F02M2200/855 ,  G01L23/222

摘要： A fuel pressure sensor/sensor mount assembly in which a fuel pressure sensor is so mounted as to exposed to a high-pressure fuel path through which fuel is supplied to a fuel injector, a fuel injection apparatus equipped with a built-in fuel pressure sensor, and a pressure sensing apparatus working to measure the pressure of fuel in a fuel injector are provided. The fuel pressure sensor/sensor mount assembly is disposed between the high-pressure fuel path and the fuel injector, thus permitting the size of the fuel injector to be minimized without sacrificing the accuracy in measuring the pressure of the fuel. The fuel injection apparatus and the a pressure sensing apparatus are designed to ensure desired accuracy in measuring the pressure of the fuel.

摘要翻译： 一种燃料压力传感器/传感器安装组件，其中燃料压力传感器被安装成暴露于燃料被供应到燃料喷射器的高压燃料路径，配备有内置燃料压力传感器的燃料喷射装置 并且提供了用于测量燃料喷射器中的燃料压力的压力感测装置。 燃料压力传感器/传感器安装组件设置在高压燃料通道和燃料喷射器之间，从而允许燃料喷射器的尺寸最小化，而不会牺牲测量燃料压力的精度。 燃料喷射装置和压力感测装置被设计成确保测量燃料压力所需的精度。