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公开(公告)号：US6117706A
公开(公告)日：2000-09-12
申请号：US85481
申请日：1998-05-27
CPC分类号： H05K3/0035 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K1/0269 , H05K2201/0394 , H05K2203/025 , H05K2203/049 , H05K2203/0554 , H05K2203/0796 , H05K2203/095 , H05K2203/107 , H05K2203/1121 , H05K2203/163 , H05K3/0055
摘要： The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of which are exposed to the outside to provide external contacts, and openings 4 respectively formed in the other surface of the substrate 1 for insertion of bonding wires 6 which are used to connect the electronic part 5, which are to be loaded into the part loading portion 3 of the substrate 1, to its associated contact terminals 2. In the printed circuit board, each of the contact terminals 2 is formed of a metal foil 9 directly and closely attached to the substrate 1. This can prevent the lowered heat resistance of a printed circuit board which occurs when the metal foil, which is used to form the contact terminals 2, is bonded to the substrate 1 using an adhesive.
摘要翻译： 印刷电路板包括：基板1，其包括可装载电子部件5的部分装载部分3;多个接触端子2，分别形成在基板1的一个表面上，并且其表面暴露于 外部提供外部触点，以及分别形成在基板1的另一个表面中的开口4，用于插入用于连接待加载到基板1的部件加载部分3中的电子部件5的接合线6 到其相关的接触端子2.在印刷电路板中，每个接触端子2由直接且紧密地附接到基板1的金属箔9形成。这可以防止发生印刷电路板的耐热性降低 当用于形成接触端子2的金属箔使用粘合剂结合到基板1时。
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公开(公告)号：US06671949B2
公开(公告)日：2004-01-06
申请号：US09808086
申请日：2001-03-13
IPC分类号： H01K310
CPC分类号： H05K3/4652 , H05K1/116 , H05K3/0035 , H05K3/0044 , H05K3/0055 , H05K3/421 , H05K3/4644 , H05K2201/0969 , H05K2201/098 , H05K2201/09863 , H05K2203/025 , H05K2203/0554 , H05K2203/0796 , H05K2203/095 , H05K2203/1383 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165
摘要： A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.
摘要翻译： 多层印刷电路板形成有多个导体层，绝缘层整体层叠在一起，绝缘层中设置的非穿透通孔由导体层露出的底部，设置在通孔内部的镀层， 所述导体层之间的电连接，所述通孔形成为在通孔的内周到底面的连续区域的半径在20至100μm的范围内的轴向剖视图中的凹曲面的通孔，由此 在电镀镀层时发生的等电势面沿着连续区域弯曲，以统一电流密度，以使电镀层在厚度上均匀，而不会在连续区域变薄。
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公开(公告)号：US06326559B1
公开(公告)日：2001-12-04
申请号：US09321644
申请日：1999-05-28
IPC分类号： H01R909
CPC分类号： H05K3/4652 , H05K1/116 , H05K3/0035 , H05K3/0044 , H05K3/0055 , H05K3/421 , H05K3/4644 , H05K2201/0969 , H05K2201/098 , H05K2201/09863 , H05K2203/025 , H05K2203/0554 , H05K2203/0796 , H05K2203/095 , H05K2203/1383 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165
摘要： A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.
摘要翻译： 多层印刷电路板形成有多个导体层，绝缘层整体层叠在一起，绝缘层中设置的非穿透通孔由导体层露出的底部，设置在通孔内部的镀层， 所述导体层之间的电连接，所述通孔形成为在通孔的内周到底面的连续区域的半径在20至100μm的范围内的轴向剖视图中的凹曲面的通孔，由此 在电镀镀层时发生的等电势面沿着连续区域弯曲，以统一电流密度，以使电镀层在厚度上均匀，而不会在连续区域变薄。
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公开(公告)号：US20140147328A1
公开(公告)日：2014-05-29
申请号：US14119224
申请日：2012-05-22
申请人： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Isao Fuwa , Yoshikazu Higashi , Yoshiyuki Uchinono , Norio Yoshida
发明人： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Isao Fuwa , Yoshikazu Higashi , Yoshiyuki Uchinono , Norio Yoshida
CPC分类号： B22F3/24 , B22F3/1055 , B22F2003/247 , B29C64/153 , B29C67/0077 , B29L2031/085 , B33Y10/00 , Y02P10/295 , Y02P70/523
摘要： A method for manufacturing a three-dimensional shaped object, comprising: (i) forming a powder layer on a base plate by a sliding movement of a squeegee blade, followed by forming a solidified layer by irradiating a predetermined portion of the powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, steps (i) and (ii) being repeatedly performed, wherein machining is performed at least once on an outer surface of a shaped object precursor obtained during manufacturing, and after machining, at least one solidified layer is formed, and followed by upper face machining to remove a raised solidified portion generated at a peripheral edge of the solidified layer.
摘要翻译： 一种三维成形体的制造方法，包括：（i）通过刮板的滑动运动在基板上形成粉末层，然后通过用粉末层的规定部分照射形成固化层 光束，从而允许烧结预定部分的粉末或熔化并随后固化; 和（ii）通过在所得固化层上新形成粉末层形成另一固化层，然后用光束照射新粉末层的另一预定部分，重复执行步骤（i）和（ii），其中机械加工 在制造过程中获得的成形体前体的外表面上至少进行一次，在机械加工后形成至少一个固化层，然后进行上表面加工，除去在固化后的周边部分产生的升高的凝固部分 层。
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公开(公告)号：US08486490B2
公开(公告)日：2013-07-16
申请号：US12461311
申请日：2009-08-07
申请人： Isao Fuwa , Norio Yoshida , Satoshi Abe
发明人： Isao Fuwa , Norio Yoshida , Satoshi Abe
CPC分类号： B22F3/1055 , B29C64/153 , B33Y10/00 , B33Y30/00 , Y02P10/295
摘要： In a method for producing a three-dimensionally shaped object, a powder layer is formed by feeding a powdery material to a substrate and a solidified layer is formed by irradiating a light beam on a specified portion of the powder layer to sinter or melt the specified portion of the powder layer. A three-dimensionally shaped object having a plurality of solidified layers laminated one above another is obtained by repeating the powder layer formation and the solidified layer formation. In the method, a stress is preliminarily applied to the substrate to reduce the amount of deformation of the substrate after production of the shaped object prior to the powder layer forming step.
摘要翻译： 在制造三维成形物体的方法中，通过将粉末状材料供给到基板而形成粉末层，并且通过在粉末层的特定部分上照射光束来形成凝固层，以烧结或熔化指定的 粉末层的一部分。 通过重复粉末层的形成和凝固层的形成，得到具有层压在其上的多个固化层的三维形状的物体。 在该方法中，预先对基板施加应力，以在粉末形成步骤之前减小成形体的生成后的基板的变形量。
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6.发明申请公开(公告)号：US20130075575A1
公开(公告)日：2013-03-28
申请号：US13702210
申请日：2011-06-09
申请人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
发明人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
IPC分类号： B29C33/02
CPC分类号： B29C33/02 , B22F3/1055 , B22F2003/1056 , B23P15/00 , B29C35/0272 , B29C35/0805 , B29C64/153 , B29C64/40 , B33Y10/00 , B33Y50/02 , Y02P10/295
摘要： There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a heater element is disposed on the solidified layer during the repeated steps (i) and (ii), and thereby the heater element is situated within the three-dimensional shaped object.
摘要翻译： 提供了一种制造三维成形物体的方法，该方法包括以下重复步骤：（i）通过用光束照射粉末层的预定部分来形成固化层，从而允许粉末的烧结 在预定部分或其熔融和随后的固化中; 和（ii）通过在所得到的固化层上新形成粉末层，然后用光束照射粉末层的预定部分，形成另一个固化层，其中在重复的过程中将加热元件设置在固化层上 步骤（i）和（ii），从而加热器元件位于三维成形物体内。
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公开(公告)号：US08272865B2
公开(公告)日：2012-09-25
申请号：US12934463
申请日：2009-03-23
申请人： Yoshikazu Higashi , Satoshi Abe , Isao Fuwa , Masataka Takenami , Norio Yoshida
发明人： Yoshikazu Higashi , Satoshi Abe , Isao Fuwa , Masataka Takenami , Norio Yoshida
IPC分类号： B29C45/73
CPC分类号： B29C45/7312 , B22F5/007 , B22F2999/00 , B29C33/3814 , B29C33/565 , B29C45/7207 , B29C45/7306 , B29C2045/735 , B33Y30/00 , B33Y70/00 , B33Y80/00 , Y02P10/292 , Y02P10/295 , B22F3/1055 , B22F2207/17
摘要： Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold includes a cavity mold and a core mold and is produced on a base plate by metal photofabrication. The cavity mold is provided with a cavity warm water circuit for allowing warm water for heating to flow and a cavity cold water circuit for allowing cold water for cooling to flow. The core mold is also provided with a core warm water circuit and a core cold water circuit. The core mold includes an air blowing passage for feeding warm air or cold air into a resin molding part and a suction passage (36) for sucking a gas within the resin molding part. The resin molding part side of the air blowing passage and the suction passage is formed of a low-density shaping part that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part, whereby rapid heating or cooling of the resin injection molding mold can be realized.
摘要翻译： 公开了一种能够实现快速加热或冷却的树脂注射成型用模具。 树脂注射成型模具包括空腔模具和芯模，并且通过金属光加工在基板上制造。 空腔模具设置有用于允许加热流动的温水的腔温水回路和用于允许冷水冷却流动的腔冷水回路。 核心模具还设有核心温水回路和核心冷水回路。 芯模包括用于将热空气或冷空气供给到树脂成型部的空气吹送通道和用于吸入树脂成型部内的气体的吸入通路（36）。 空气吹送通道和吸入通道的树脂成型部分侧由具有低金属粉末烧结密度并且可透气的低密度成形部分形成。 可以通过低密度成形部吹送温暖的空气或冷空气，由此可以实现树脂注射成型模的快速加热或冷却。
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公开(公告)号：US08070474B2
公开(公告)日：2011-12-06
申请号：US12375675
申请日：2008-05-30
申请人： Satoshi Abe , Yoshikazu Higashi , Norio Yoshida , Isao Fuwa
发明人： Satoshi Abe , Yoshikazu Higashi , Norio Yoshida , Isao Fuwa
CPC分类号： B29C64/20 , B22F2003/1056 , B22F2003/1059 , B22F2999/00 , B29C64/153 , B29C2793/009 , B33Y30/00 , Y02P10/295 , B22F3/1055 , B22F3/003
摘要： A lamination shaping apparatus has a powder layer preparing means and an optical unit which irradiates a light beam to an intended portion of a powder layer so as to sinter or melt for solidifying the portion into a cured layer. Preparation of the powder layer and curing of the cured layer are repeated to fabricate a three-dimensional object in which a plurality of the cured layers are laminated and integrated. The apparatus includes a fixed base carrying thereon the powder layer and the cured layer, an elevator frame surrounding a periphery of the fixed base, and driving means for driving the elevator frame to move vertically. The powder layer is formed within a space above the base and surrounded by an interior surface of the elevator fame such that the powder layer (cured layer) can be stacked on the base with the base being kept at a fixed position, thereby facilitating to fabricate a precisely shaped object.
摘要翻译： 层压成型装置具有粉末层制备装置和光学单元，其将光束照射到粉末层的预期部分，以便烧结或熔化以将该部分固化成固化层。 重复制备粉末层并固化固化层，以制造其中多个固化层被层压并整合的三维物体。 该装置包括：承载有粉末层和固化层的固定基座，围绕固定基座的周边的升降架;以及用于驱动电梯架垂直移动的驱动装置。 粉末层形成在基座上方的空间内并被升降机的内表面包围，使得粉末层（固化层）可以堆叠在基座上，基座保持在固定位置，从而有助于制造 精确成形的物体。
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公开(公告)号：US07754135B2
公开(公告)日：2010-07-13
申请号：US10546455
申请日：2004-02-25
申请人： Satoshi Abe , Isao Fuwa , Yoshikazu Higashi , Hirohiko Togeyama , Norio Yoshida , Masataka Takenami , Takashi Shimizu , Shushi Uenaga
发明人： Satoshi Abe , Isao Fuwa , Yoshikazu Higashi , Hirohiko Togeyama , Norio Yoshida , Masataka Takenami , Takashi Shimizu , Shushi Uenaga
CPC分类号： B22F3/1055 , B22F2003/1056 , B29C64/153 , Y02P10/295
摘要： A three-dimensional object is made by repeating a process. An optical beam is irradiated on a predetermined portion of a powdery layer to form a sintered layer. A new powdery layer is formed on a surface of the sintered layer. An optical beam is irradiated on a predetermined portion of the new powdery layer to form a new sintered layer united with the underlying sintered layer. Because a portion of the sintered layer that is higher than a predetermined level is removed as occasion demands, the abnormally sintered portion on the sintered layer can be removed, making it possible to prevent stoppage of the shaping process, which may be caused by the abnormally sintered portion.
摘要翻译： 通过重复一个过程来制作三维物体。 将光束照射在粉末层的预定部分上以形成烧结层。 在烧结层的表面上形成新的粉末层。 将光束照射在新的粉末层的预定部分上以形成与下面的烧结层结合的新的烧结层。 因为根据需要去除烧结层的高于预定水平的部分，所以可以去除烧结层上的异常烧结部分，从而可以防止由异常引起的成形过程的停止 烧结部。
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公开(公告)号：US20100047470A1
公开(公告)日：2010-02-25
申请号：US12461600
申请日：2009-08-18
申请人： Satoshi Abe , Norio Yoshida , Isao Fuwa , Masataka Takenami
发明人： Satoshi Abe , Norio Yoshida , Isao Fuwa , Masataka Takenami
IPC分类号： B05D3/00
CPC分类号： C04B35/64 , B22F2998/00 , C04B2235/6026 , C04B2235/665 , Y02P10/295 , B22F3/1055
摘要： A method for producing a three-dimensionally shaped object, includes a powder layer forming step of supplying a powdery material to form a powder layer; a solidified layer forming step of irradiating a light beam on a specified portion of the powder layer to sinter or melt the powder layer into a solidified layer; and a step of repeating the powder layer forming step and the solidified layer forming step to integrally laminate the solidified layer to produce the three-dimensionally shaped object. The solidified layer is integrally formed on an upper surface of a substrate and the thickness of the substrate is decided by a maximum horizontal cross-sectional area of the shaped object. The substrate is made of a material having the Young's modulus greater than that of the shaped object.
摘要翻译： 一种三维成形体的制造方法，包括：粉末层形成工序，供给粉末状的材料形成粉末层; 固化层形成步骤，用于在粉末层的特定部分上照射光束以将粉末层烧结或熔化成固化层; 以及重复粉末层形成步骤和固化层形成步骤以使固化层整体层压以产生三维成形物体的步骤。 固化层一体地形成在基板的上表面上，基板的厚度由成形体的最大横截面积决定。 衬底由具有大于成形体的杨氏模量的材料制成。
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