摘要:
A method for forming a resist mask pattern by light exposure providing the steps of forming a resist layer on a semiconductor substrate, forming a phase shifter pattern for inverting a phase of exposed light in an upper portion of the resist layer itself or over the surface of the resist layer, exposing the surface of the semiconductor substrate including the phase shifter pattern, and forming a fine mask pattern below the edge of the phase shifter pattern.
摘要:
In the system according to the present invention detects defects by projecting illumination light for exposure having a certain wavelength perpendicularly onto a phase shift mask to be examined; picking up, by means of an image acquisition section, two pattern images which are formed from the irradiated light having passed through two neighboring dies on the phase shift mask and image-formed individually through respective magnifying projection optical systems, and superposing the image patterns of two dies through an alignment to compare therebetween.
摘要:
A method for forming a fine resist pattern by exposing comprising the steps of: (i) forming a resist layer on a semiconductor substrate; (ii) forming a phase shifting pattern in an upper portion of the resist layer, the phase-sifting pattern having a tapered edge corresponding to a portion to which formation of an objective fine resist pattern is not desired; (iii) exposing the entire surface of the semiconductor substrate including the phase-shifting pattern; and (iv) forming a fine resist pattern below an outline except for the tapered edge of the phase-shifting pattern.
摘要:
A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.
摘要:
An electrical component holder contains an electrical component to be connected to an internal circuit of a vehicle-installed electrical junction box. The holder has a casing main body and a lid to be mounted on an upper surface of the casing main body. The casing main body has a box-like configuration that is open at a lower end so that the casing main body can be placed on an electrical component mounting section of the electrical junction box. The casing main body has an upper wall that defines a through-hole that receives and holds a support portion of a terminal member of the electrical component. The support portion of the terminal member is inserted into and secured to the through-hole so that the terminal member projects into a hollow interior of the casing main body. The terminal member is inserted into and secured to a terminal aperture in the electrical component mounting section, under the condition that the casing main body is attached to the electrical component mounting section.
摘要:
An electrical component holder contains an electrical component to be connected to an internal circuit of a vehicle-installed electrical junction box. The holder has a casing main body and a lid to be mounted on an upper surface of the casing main body. The casing main body has a box-like configuration that is open at a lower end so that the casing main body can be placed on an electrical component mounting section of the electrical junction box. The casing main body has an upper wall that defines a through-hole that receives and holds a support portion of a terminal member of the electrical component. The support portion of the terminal member is inserted into and secured to the through-hole so that the terminal member projects into a hollow interior of the casing main body. The terminal member is inserted into and secured to a terminal aperture in the electrical component mounting section, under the condition that the casing main body is attached to the electrical component mounting section.
摘要:
In a signal processing apparatus, a speech coder includes, as three sections for coding speech data by different algorithm, an Algorithm-A coding section, an Algorithm-B coding section and an Algorithm-C coding section. A noise suppressor includes, as three sections for suppressing background noise by different algorithm, an Algorithm-X noise suppress section, an Algorithm-Y noise suppress section and an Algorithm-Z noise suppress section. A suppress algorithm switching control section controls switching on the basis of information from a coding algorithm switching control section such that an optimal one of the noise suppress sections may function in association with the coding section activated in the speech coder.
摘要:
In a signal processing apparatus, a speech coder includes, as three sections for coding speech data by different algorithm, an Algorithm-A coding section, an Algorithm-B coding section and an Algorithm-C coding section. A noise suppressor includes, as three sections for suppressing background noise by different algorithm, an Algorithm-X noise suppress section, an Algorithm-Y noise suppress section and an Algorithm-Z noise suppress section. A suppress algorithm switching control section controls switching on the basis of information from a coding algorithm switching control section such that an optimal one of the noise suppress sections may function in association with the coding section activated in the speech coder.
摘要:
A fixing structure for an electrical junction box and a cassette, the fixing structure being adapted to fix the cassette on a side wall outer surface of the electrical junction box. A locking portion is provided on an outer surface of the cassette. A rib plate that extends in a vertical direction and projects downward adjacent to the locking portion to come into contact with the side wall outer surface. A counterpart locking portion to be locked on the locking portion is provided on the side wall outer surface. An engaging stepped-portion receives a lower end of the rib plate. When the locking portion and the counterpart locking portion are coupled to and locked on one another, the rib plate comes into contact with the side wall outer surface, and a lower end of the rib plate comes into contact with the engaging stepped-portion to restrict rotation of the cassette.
摘要:
A semiconductor memory device comprises a memory cell array including memory cells arranged in matrix each having a selective transistor and a variable resistance element having an electric resistance changed from a first state to a second state by applying a first write voltage and from the second state to the first state by applying a second write voltage. A first write current for a first writing operation to change the electric resistance from the first state to the second state is larger than a second write current for a second writing operation to change it from the second state to the first state. A second memory cell number of memory cells subjected to the second writing operation at a time is greater than a first memory cell number of memory cells subjected to the first writing operation at a time. At least the second memory cell number is plural.