公开(公告)号：US20110135911A1

公开(公告)日：2011-06-09

申请号：US13057303

申请日：2009-08-04

申请人： Hiroshi Maenaka ,  Isao Higuchi ,  Yasunari Kusaka ,  Takuji Aoyama ,  Takashi Watanabe ,  Daisuke Nakajima ,  Ryousuke Takahashi

发明人： Hiroshi Maenaka ,  Isao Higuchi ,  Yasunari Kusaka ,  Takuji Aoyama ,  Takashi Watanabe ,  Daisuke Nakajima ,  Ryousuke Takahashi

IPC分类号： H01B17/56 ,  H01B17/62 ,  B32B15/08 ,  E04B1/74

CPC分类号： H05K7/20472 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B27/42 ,  B32B2264/10 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  H01L23/3737 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/254 ,  Y10T428/258 ,  H01L2924/00

摘要： The present invention provides an insulating sheet which is excellent in handleability when it is uncured, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, acid resistance, and processability, and a multilayer structure produced by the use of the insulating sheet. The insulating sheet comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy resin (B1) having a weight average molecular weight of less than 10,000 and an oxetane resin (B2) having a weight average molecular weight of less than 10,000; (C) a curing agent; and (D) at least one of magnesium carbonate anhydrous (D1) represented by MgCO3 and containing no crystal water and a coated body (D2) obtainable by coating the surface of the magnesium carbonate anhydrous (D1) with an organic resin, a silicone resin, or silica.

摘要翻译： 本发明提供一种绝缘片，其在未固化时的操作性优异，并且提供了绝缘击穿特性，导热性，耐热性，耐酸性和加工性优异的固化产物，以及使用 绝缘片。 绝缘片包括：（A）重均分子量为10,000以上的聚合物; （B）重均分子量小于10,000的环氧树脂（B1）和重均分子量小于10,000的氧杂环丁烷树脂（B2）中的至少一种; （C）固化剂; 和（D）由MgCO3表示的不含结晶水的无水碳酸镁（D1）和通过用有机树脂涂覆无水碳酸镁（D1）的表面而获得的涂布体（D2）中的至少一种，硅树脂 ，或二氧化硅。

公开(公告)号：US20110159296A1

公开(公告)日：2011-06-30

申请号：US13059395

申请日：2009-03-04

申请人： Hiroshi Maenaka ,  Takuji Aoyama ,  Yasunari Kusaka ,  Isao Higuchi ,  Takashi Watanabe ,  Ryousuke Takahashi ,  Syunsuke Kondou

发明人： Hiroshi Maenaka ,  Takuji Aoyama ,  Yasunari Kusaka ,  Isao Higuchi ,  Takashi Watanabe ,  Ryousuke Takahashi ,  Syunsuke Kondou

IPC分类号： B32B15/092 ,  B32B27/38 ,  E04B1/74

CPC分类号： C08G59/245 ,  B32B15/08 ,  B32B27/38 ,  C08F220/14 ,  C08F220/32 ,  C08G65/18 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/14 ,  C08L2666/22 ,  C09J163/00 ,  C09J171/00 ,  H01B3/427 ,  H05K1/056 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

摘要翻译： 本发明提供一种绝缘片，其在未固化时处理性优异，防止层叠压制中的过度流动，并提供绝缘击穿特性，导热性，耐热性和加工性优异的固化产物。 用于将热导率为10W / m·K以上的导热体与导电层接合的绝缘片，其特征在于，包含：（A）重均分子量为10,000以上的聚合物; （B）具有芳香骨架和重均分子量为600以下的环氧单体（B1）和具有芳香骨架，重均分子量为600以下的氧杂环丁烷单体（B2）中的至少一种; （C）固化剂; 和（D）20〜60体积％的第一无机填料; 和（E）1〜40体积％的与第一无机填料（D）不同的有机填料（E1）和第二无机填料（E2）中的至少一种，并且具有新的莫氏硬度3 或更少，当填料（E）含有有机填料（E1）时，有机填料（E1）为3〜40体积％。

公开(公告)号：US20100297453A1

公开(公告)日：2010-11-25

申请号：US12676435

申请日：2008-09-02

申请人： Hiroshi Maenaka ,  Yasunari Kusaka ,  Takuji Aoyama ,  Isao Higuchi ,  Daisuke Nakajima ,  Takashi Watanabe

发明人： Hiroshi Maenaka ,  Yasunari Kusaka ,  Takuji Aoyama ,  Isao Higuchi ,  Daisuke Nakajima ,  Takashi Watanabe

IPC分类号： B32B15/08 ,  B32B27/38 ,  C08L73/00 ,  C08L29/00 ,  C08K7/00 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28

CPC分类号： B32B27/38 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/285 ,  B32B27/302 ,  B32B27/308 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2405/00 ,  B32B2457/00 ,  C08G59/42 ,  C08G59/5086 ,  C08G2650/56 ,  C08K3/013 ,  C08K5/1539 ,  C08L63/00 ,  C08L71/00 ,  H01B3/40 ,  H01B3/427 ,  H01L23/3737 ,  H01L2924/0002 ,  C08L2666/22 ,  H01L2924/00

摘要： The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer comprises: (A) a polymer having an aromatic skeleton and a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride; and (D) a filler. When the insulating sheet is uncured, the insulating sheet has a glass transition temperature Tg of 25° C. or lower.

摘要翻译： 本发明提供一种用于将导热率为10W / m·K以上的导热体与导电层接合的绝缘片。 当未固化时，绝缘片的可操作性优异，并且绝缘片的固化物具有更高的粘附性，耐热性，介电击穿特性和导热性。 用于将导热率为10W / m·K以上的导热体与导电层接合的绝缘片包含：（A）具有芳香骨架，重均分子量为10,000以上的聚合物; （B）具有芳香骨架和重均分子量为600以下的环氧单体（B1）和具有芳香骨架，重均分子量为600以下的氧杂环丁烷单体（B2）中的至少一种; （C）由酚醛树脂，具有芳香骨架的酸酐或脂环族骨架组成的固化剂，酸酐的氢化物或酸酐的改性物; 和（D）填料。 当绝缘片未固化时，绝缘片的玻璃化转变温度Tg为25℃以下。