公开(公告)号：US20110159296A1

公开(公告)日：2011-06-30

申请号：US13059395

申请日：2009-03-04

申请人： Hiroshi Maenaka ,  Takuji Aoyama ,  Yasunari Kusaka ,  Isao Higuchi ,  Takashi Watanabe ,  Ryousuke Takahashi ,  Syunsuke Kondou

发明人： Hiroshi Maenaka ,  Takuji Aoyama ,  Yasunari Kusaka ,  Isao Higuchi ,  Takashi Watanabe ,  Ryousuke Takahashi ,  Syunsuke Kondou

IPC分类号： B32B15/092 ,  B32B27/38 ,  E04B1/74

CPC分类号： C08G59/245 ,  B32B15/08 ,  B32B27/38 ,  C08F220/14 ,  C08F220/32 ,  C08G65/18 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/14 ,  C08L2666/22 ,  C09J163/00 ,  C09J171/00 ,  H01B3/427 ,  H05K1/056 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

摘要翻译： 本发明提供一种绝缘片，其在未固化时处理性优异，防止层叠压制中的过度流动，并提供绝缘击穿特性，导热性，耐热性和加工性优异的固化产物。 用于将热导率为10W / m·K以上的导热体与导电层接合的绝缘片，其特征在于，包含：（A）重均分子量为10,000以上的聚合物; （B）具有芳香骨架和重均分子量为600以下的环氧单体（B1）和具有芳香骨架，重均分子量为600以下的氧杂环丁烷单体（B2）中的至少一种; （C）固化剂; 和（D）20〜60体积％的第一无机填料; 和（E）1〜40体积％的与第一无机填料（D）不同的有机填料（E1）和第二无机填料（E2）中的至少一种，并且具有新的莫氏硬度3 或更少，当填料（E）含有有机填料（E1）时，有机填料（E1）为3〜40体积％。

公开(公告)号：US20110135911A1

公开(公告)日：2011-06-09

申请号：US13057303

申请日：2009-08-04

申请人： Hiroshi Maenaka ,  Isao Higuchi ,  Yasunari Kusaka ,  Takuji Aoyama ,  Takashi Watanabe ,  Daisuke Nakajima ,  Ryousuke Takahashi

发明人： Hiroshi Maenaka ,  Isao Higuchi ,  Yasunari Kusaka ,  Takuji Aoyama ,  Takashi Watanabe ,  Daisuke Nakajima ,  Ryousuke Takahashi

IPC分类号： H01B17/56 ,  H01B17/62 ,  B32B15/08 ,  E04B1/74

CPC分类号： H05K7/20472 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B27/42 ,  B32B2264/10 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  H01L23/3737 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/254 ,  Y10T428/258 ,  H01L2924/00

摘要： The present invention provides an insulating sheet which is excellent in handleability when it is uncured, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, acid resistance, and processability, and a multilayer structure produced by the use of the insulating sheet. The insulating sheet comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy resin (B1) having a weight average molecular weight of less than 10,000 and an oxetane resin (B2) having a weight average molecular weight of less than 10,000; (C) a curing agent; and (D) at least one of magnesium carbonate anhydrous (D1) represented by MgCO3 and containing no crystal water and a coated body (D2) obtainable by coating the surface of the magnesium carbonate anhydrous (D1) with an organic resin, a silicone resin, or silica.

摘要翻译： 本发明提供一种绝缘片，其在未固化时的操作性优异，并且提供了绝缘击穿特性，导热性，耐热性，耐酸性和加工性优异的固化产物，以及使用 绝缘片。 绝缘片包括：（A）重均分子量为10,000以上的聚合物; （B）重均分子量小于10,000的环氧树脂（B1）和重均分子量小于10,000的氧杂环丁烷树脂（B2）中的至少一种; （C）固化剂; 和（D）由MgCO3表示的不含结晶水的无水碳酸镁（D1）和通过用有机树脂涂覆无水碳酸镁（D1）的表面而获得的涂布体（D2）中的至少一种，硅树脂 ，或二氧化硅。

公开(公告)号：US20100297453A1

公开(公告)日：2010-11-25

申请号：US12676435

申请日：2008-09-02

申请人： Hiroshi Maenaka ,  Yasunari Kusaka ,  Takuji Aoyama ,  Isao Higuchi ,  Daisuke Nakajima ,  Takashi Watanabe

发明人： Hiroshi Maenaka ,  Yasunari Kusaka ,  Takuji Aoyama ,  Isao Higuchi ,  Daisuke Nakajima ,  Takashi Watanabe

IPC分类号： B32B15/08 ,  B32B27/38 ,  C08L73/00 ,  C08L29/00 ,  C08K7/00 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28

CPC分类号： B32B27/38 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/285 ,  B32B27/302 ,  B32B27/308 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2405/00 ,  B32B2457/00 ,  C08G59/42 ,  C08G59/5086 ,  C08G2650/56 ,  C08K3/013 ,  C08K5/1539 ,  C08L63/00 ,  C08L71/00 ,  H01B3/40 ,  H01B3/427 ,  H01L23/3737 ,  H01L2924/0002 ,  C08L2666/22 ,  H01L2924/00

摘要： The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer comprises: (A) a polymer having an aromatic skeleton and a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride; and (D) a filler. When the insulating sheet is uncured, the insulating sheet has a glass transition temperature Tg of 25° C. or lower.

摘要翻译： 本发明提供一种用于将导热率为10W / m·K以上的导热体与导电层接合的绝缘片。 当未固化时，绝缘片的可操作性优异，并且绝缘片的固化物具有更高的粘附性，耐热性，介电击穿特性和导热性。 用于将导热率为10W / m·K以上的导热体与导电层接合的绝缘片包含：（A）具有芳香骨架，重均分子量为10,000以上的聚合物; （B）具有芳香骨架和重均分子量为600以下的环氧单体（B1）和具有芳香骨架，重均分子量为600以下的氧杂环丁烷单体（B2）中的至少一种; （C）由酚醛树脂，具有芳香骨架的酸酐或脂环族骨架组成的固化剂，酸酐的氢化物或酸酐的改性物; 和（D）填料。 当绝缘片未固化时，绝缘片的玻璃化转变温度Tg为25℃以下。

公开(公告)号：US20140175505A1

公开(公告)日：2014-06-26

申请号：US14232544

申请日：2012-07-11

申请人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

发明人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/00

摘要： The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more. (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R6SiO3/2)c  Formula (1A) (R1R2R3SiO1/2)a(R4R5SiO1/2)b(R6SiO3/2)c  Formula (1B) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51A) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51B)

摘要翻译： 本发明提供一种能够抑制固化物的表面粘性的光半导体装置用密封剂，能够提高固化物的耐热性和热循环特性。 根据本发明的光学半导体器件的密封剂，其包括：由式（1A）或式（1B）表示并具有与硅原子键合的烯基和甲基的第一有机聚硅氧烷; 由式（51A）或式（51B）表示的具有与硅原子键合的氢原子和与硅原子键合的甲基的第二有机聚硅氧烷; 和用于氢化硅烷化反应的催化剂，并且与第一和第二有机聚硅氧烷中的硅原子键合的甲基的含量比分别为80摩尔％以上。 （R1R2R3SiO1 / 2）a（R4R5SiO2 / 2）b（R6SiO3 / 2）c式（1A）（R1R2R3SiO1 / 2）a（R4R5SiO1 / 2）b（R6SiO3 / 2）c式（1B）（R51R52R53SiO1 / 2） （R54R55SiO2 / 2）q（R56SiO3 / 2）r式（51A）（R51R52R53SiO1 / 2）p（R54R55SiO2 / 2）q（R56SiO3 / 2）

公开(公告)号：US20090206328A1

公开(公告)日：2009-08-20

申请号：US11794624

申请日：2005-12-28

申请人： Kimihiro Matsukawa ,  Yukihito Matsuura ,  Kenichi Azuma ,  Shigeru Nakamura ,  Yasunari Kusaka

发明人： Kimihiro Matsukawa ,  Yukihito Matsuura ,  Kenichi Azuma ,  Shigeru Nakamura ,  Yasunari Kusaka

IPC分类号： H01L51/10 ,  G03F7/075 ,  G03F7/20 ,  C08G77/12 ,  H01L51/30

CPC分类号： H01L21/02126 ,  G03F7/0007 ,  G03F7/0045 ,  G03F7/0382 ,  G03F7/0757 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/3124 ,  H01L29/4908 ,  H01L29/66765

摘要： Disclosed is a photosensitive composition having photosensitivity which is alkaline developable without containing a crosslinking agent. Specifically disclosed is a silicon-containing photosensitive composition characterized by containing a silicon-containing polymer including at least one polymer (A1) represented by the general formula (1) below, wherein at least one of R11-R1n is an H and the rest of them are organic groups, or at least one polymer (A1) and one polymer (A2) represented by the general formula (2) below, and a compound (B) which generates an acid or a base when irradiated with an active ray or radiation ray. (In the formula, at least one of R11-R1n represents an H, and n represents an integer of 1 or more.) (In the formula, R21-R2n represent atoms other than H or functional groups, and n represents an integer of 1 or more.)

摘要翻译： 公开了具有光敏性的感光性组合物，该光敏组合物在不含有交联剂的情况下为碱显影剂。 具体公开的是含硅光敏组合物，其特征在于含有含有至少一种下述通式（1）表示的聚合物（A1）的含硅聚合物，其中R11-R1n中的至少一个为H，其余的 它们是有机基团，或由以下通式（2）表示的至少一种聚合物（A1）和一种聚合物（A2）和当用活性射线或辐射照射时产生酸或碱的化合物（B） 射线。 （式中，R 11 -R 11 n中的至少1个表示H，n表示1以上的整数。）（式中，R 21〜R 20表示H以外的原子或官能团，n表示 1个或更多）