INSULATING SHEET AND LAMINATED STRUCTURE
    8.
    发明申请
    INSULATING SHEET AND LAMINATED STRUCTURE 审中-公开
    绝缘片和层压结构

    公开(公告)号:US20110159296A1

    公开(公告)日:2011-06-30

    申请号:US13059395

    申请日:2009-03-04

    IPC分类号: B32B15/092 B32B27/38 E04B1/74

    摘要: The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

    摘要翻译: 本发明提供一种绝缘片,其在未固化时处理性优异,防止层叠压制中的过度流动,并提供绝缘击穿特性,导热性,耐热性和加工性优异的固化产物。 用于将热导率为10W / m·K以上的导热体与导电层接合的绝缘片,其特征在于,包含:(A)重均分子量为10,000以上的聚合物; (B)具有芳香骨架和重均分子量为600以下的环氧单体(B1)和具有芳香骨架,重均分子量为600以下的氧杂环丁烷单体(B2)中的至少一种; (C)固化剂; 和(D)20〜60体积%的第一无机填料; 和(E)1〜40体积%的与第一无机填料(D)不同的有机填料(E1)和第二无机填料(E2)中的至少一种,并且具有新的莫氏硬度3 或更少,当填料(E)含有有机填料(E1)时,有机填料(E1)为3〜40体积%。