摘要:
A non-volatile semiconductor storage device includes a substrate, a first insulating layer formed on the substrate, a semiconductor layer formed of polysilicon on the first insulating layer, a pair of conductor regions formed on the first insulating layer to pass through the semiconductor layer and to sandwich a part of the semiconductor layer, and formed of a metal or a silicide, a tunnel layer formed on the part of the semiconductor layer sandwiched between the pair of conductor regions, a charge storage layer formed on the tunnel layer, a second insulating layer formed on the charge storage layer, and a control gate formed on the second insulating layer.
摘要:
It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
摘要:
A NAND cell unit is formed with an advanced gate forming process on a semiconductor layer of a first conductivity type, which is formed on a semiconductor substrate of the first conductivity type with an insulating film interposed therebetween. First impurity-doped layers of a second conductivity type are formed on the semiconductor layer, which serve as channel regions of the select gate transistors Bit line contact- and source line contact-use second impurity-doped layers of the first conductivity type are formed at bit line and source line contact portions, sidewalls of which are covered with an insulating film.
摘要:
A NAND cell unit is formed with an advanced gate forming process on a semiconductor layer of a first conductivity type, which is formed on a semiconductor substrate of the first conductivity type with an insulating film interposed therebetween. First impurity-doped layers of a second conductivity type are formed on the semiconductor layer, which serve as channel regions of the select gate transistors Bit line contact- and source line contact-use second impurity-doped layers of the first conductivity type are formed at bit line and source line contact portions, sidewalls of which are covered with an insulating film.
摘要:
It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
摘要:
It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
摘要:
It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
摘要:
A non-volatile semiconductor storage device includes a substrate, a first insulating layer formed on the substrate, a semiconductor layer formed of polysilicon on the first insulating layer, a pair of conductor regions formed on the first insulating layer to pass through the semiconductor layer and to sandwich a part of the semiconductor layer, and formed of a metal or a silicide, a tunnel layer formed on the part of the semiconductor layer sandwiched between the pair of conductor regions, a charge storage layer formed on the tunnel layer, a second insulating layer formed on the charge storage layer, and a control gate formed on the second insulating layer.
摘要:
A method of using a chip identification device is jointly performed by a chip mass-produced by a semiconductor manufacturing process, a first chip manufacturer making the chip, and a chip user assembling a product by using the chip. The method includes inputting a first published passcode, published by the first chip manufacturer, inputting a second published passcode published by a second chip manufacturer, inputting the first published passcode to the chip by the chip user, reading an aggregate of electronic output signals as a read code, sending the read code to the first chip manufacturer to compare the first output code and the read code. The chip is regarded as a counterfeit if the comparison is consistent.
摘要:
A technology precluding attacks through peripheral devices thefts to a network of electronic appliance, by utilizing physical chip identification devices, is disclosed. The electronic appliance in the network are divided into the peripheral devices and stem servers managing registration information of the peripheral devices, wherein the stem servers serve as central control using software, and the peripheral devices are managed at device-level by having physical chip identification devices, thus the security of the whole network is efficiently reinforced.