Semiconductor device and method of manufacturing the same
    2.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体器件及其制造方法

    公开(公告)号:US5100814A

    公开(公告)日:1992-03-31

    申请号:US628007

    申请日:1990-12-17

    摘要: First and second semiconductor elements are formed in first and second semiconductor element forming regions which have the same thickness, include first and second semiconductor layers and are separated with dielectric isolation from each other. The thickness of the first semiconductor layer is made different between the first and second semiconductor element forming regions, so that the thickness of the second semiconductor layer becomes different between the first and second semiconductor element forming regions. Thus, the semiconductor device may have the semiconductor elements which have second semiconductor layers with different thicknesses in accordance with desired electrical characteristics for each of the semiconductor elements formed in the first and second semiconductor element forming regions, to complement a semiconductor device having the semiconductor elements each of which has independent optimum electrical characteristics.

    摘要翻译: 第一和第二半导体元件形成在具有相同厚度的第一和第二半导体元件形成区域中,包括第一和第二半导体层并且彼此隔开隔离。 在第一和第二半导体元件形成区域之间使第一半导体层的厚度不同,使得第一半导体元件形成区域和第二半导体元件形成区域之间的第二半导体层的厚度变得不同。 因此,半导体器件可以具有根据形成在第一和第二半导体元件形成区域中的每个半导体元件的所需电特性而具有不同厚度的第二半导体层的半导体元件,以补充具有半导体元件的半导体器件 每个都具有独立的最佳电气特性。

    Semiconductor integrated circuit device having high breakdown-voltage to
applied voltage
    8.
    发明授权
    Semiconductor integrated circuit device having high breakdown-voltage to applied voltage 失效
    具有高电压应变电压的半导体集成电路器件

    公开(公告)号:US5109266A

    公开(公告)日:1992-04-28

    申请号:US650569

    申请日:1991-02-05

    CPC分类号: H01L29/402 H01L29/7813

    摘要: A semiconductor integrated circuit device according to the present invention has a field plate disposed between the element isolation region which surrounds a semiconductor active element and an electrode wiring which is disposed to traverse the element isolation region while being electrically connected with the semiconductor active element, and a predetermined voltage is applied to the field plate. Accordingly, a concentration of the electric field is relieved not only at the boundary region between the element isolating region and the surface of the semiconductor active element which the electrode wiring traverses, but also at the surface of the semiconductor active element under the edge of the field plate, which eventually makes it possible to raise the breakdown-voltage of the semiconductor integrated circuit device.

    摘要翻译: 根据本发明的半导体集成电路器件具有设置在元件隔离区域之间的场板,该区域围绕半导体有源元件和与半导体有源元件电连接而被设置为穿过元件隔离区域的电极布线;以及 向场板施加预定的电压。 因此,不仅在元件隔离区域和电极布线横越的半导体有源元件的表面之间的边界区域,而且在半导体有源元件的边缘部分 场板,其最终可以提高半导体集成电路器件的击穿电压。