摘要:
An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: ##STR1## where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, and from 5 to 300 parts by weight of a compound having a polymerizable double bond.
摘要:
A thermosetting resin composition, consists essentially of:(a) 100 parts by weight of a mixture of liquid acid anhydride and an imide ring-containing epoxy compound obtained from reaction of an epoxy compound having in one molecule thereof at least two epoxy groups and either one or both of imide ring-containing dicarboxylic acid compounds represented by the following general formulae (I) and (II): ##STR1## (where: R.sub.1 is a divalent organic radical) ##STR2## (where: R.sub.2 is a divalent organic radical): (b) 5 to 200 parts by weight of a tri-functional vinyl monomer; and(c) 0.1 to 10 parts by weight of phenoxy resin.
摘要:
A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.
摘要:
A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.
摘要:
A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.
摘要:
On a pivot bolt which rotatably and pivotally supports a side stand bar on a vehicle-body-side bracket, a switch unit which is constituted of a base and a rotary made of a resin and detects a rotational position of the side stand bar is mounted. A first engaging mechanism which is constituted of a groove and a projection is arranged between a cylindrical portion formed on the rotary and an engaging shaft and, at the same time, a second engaging mechanism which is constituted of a groove and a projection is arranged between the base and the cylindrical portion. The rotary on which a movable contact formed of a leaf spring is mounted allows a positioning pin which is formed on one end portion thereof to be engaged with a pin hole formed in a pivot portion and hence, the rotary is integrally rotated with the side stand bar.
摘要:
When a master circuit is in an inactive state, a slave circuit assigned to the master circuit is not used. Accordingly, the use efficiency of system recourses is decreased. To solve the above problem, a semiconductor integrated circuit reassigns a M2 region of a slave circuit, previously assigned to a first master circuit, to a second master circuit. That is to say, the M2 region of the slave circuit previously assigned to the first master circuit is reassigned to the second master circuit based on the operational status of the first master circuit. This improves the use efficiency of system resources of the semiconductor integrated circuit.
摘要:
A method for designing a system LSI includes the step of defining, for each of instructions of the processor, a behavior function description and an instruction description specifying the behavior function description, and the step of synthesizing the instructions by behavior synthesis to define the processor. The behavior function description and the instruction description are separately stored in a database as design resources for the next design of a system LSI. The instruction description is retrieved as accompanied by the associated behavior function description from the database.
摘要:
A method for detecting a misfire by fluctuation in crankshaft rotation in which the occurrence of a misfire can be detected exactly by eliminating the effect of detection error in detecting the fluctuation in crankshaft rotation, caused by the error in the construction of a crank angle sensor. By succeedingly receiving pulses from the crank angle sensor, a processor detects a time interval taken from the entering into a crankshaft rotation angle region, relating to a cylinder corresponding to both pulses, to the leaving therefrom (S2), calculates the crankshaft angular acceleration D.omega..sub.n by using the correction factor calculated on the basis of the above detected time interval, and the time interval determined by dividing the time taken for one rotation of the crankshaft by the number of cylinders (S3, S4), the latter interval being free from sensor error, and detects the occurrence of a misfire when the calculated value D.omega..sub.n is less than the decision value (S5 through S7).
摘要:
A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.