公开(公告)号：US20160131678A1

公开(公告)日：2016-05-12

申请号：US14901358

申请日：2014-02-05

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Akihiro YAGUCHI ,  Masahide HAYASHI ,  Kazunori OHTA ,  Akihiro OKAMOTO

IPC: G01P15/02 ,  H01L23/00 ,  H01L23/495 ,  G01C19/04 ,  H01L23/31

CPC classification number: G01P15/02 ,  G01C19/04 ,  G01C19/5783 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/562 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

Abstract translation: 为了提供一种高可靠性的传送模型型传感器装置，其中包括具有检测物理量的功能的多个传感器的组合传感器，基板处理来自组合传感器的信号并且用外部设备控制信号输入/输出， 安装有组合传感器和基板的芯片垫，并且引线框架用模制树脂密封并形成封装，组合的传感器被配置为比衬底和芯片衬垫更厚，主表面侧 组合传感器被模具树脂覆盖，其背面侧通过接头材料接触基板，并且组合的传感器布置在包括组合传感器的包装的厚度方向的横截面中的包装中性表面上， 基板和芯片垫。

公开(公告)号：US20180275159A1

公开(公告)日：2018-09-27

申请号：US15763212

申请日：2016-08-03

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Masatoshi KANAMARU ,  Daisuke MAEDA ,  Masahide HAYASHI ,  Masashi YURA ,  Akihiro OKAMOTO

IPC: G01P15/08 ,  G01P15/125 ,  B81B7/00

CPC classification number: G01P15/08 ,  B81B3/0051 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2203/056 ,  B81B2207/012 ,  G01P15/125 ,  G01P2015/0862 ,  G01P2015/0882 ,  H01L29/84

Abstract: To provide a physical quantity sensor having excellent reliability by reducing the influence of a force applied from the outside. Disclosed is a physical quantity sensor, which has a weight or a movable electrode formed on a device substrate, and an outer peripheral section that is disposed to surround the weight or the movable electrode, said weight or movable electrode being displaceable in the rotation direction in a plane. When the weight or the movable electrode is displaced in the rotation direction in the plane, the physical quantity sensor is provided with a rotation space at the outer peripheral section of an end portion of the weight or the movable electrode, said end portion being in the direction viewed from the center position of the weight or the movable electrode.

公开(公告)号：US20180002164A1

公开(公告)日：2018-01-04

申请号：US15545922

申请日：2016-01-08

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Munenori DEGAWA ,  Hiroshi KIKUCHI ,  Akihiro OKAMOTO ,  Masashi YURA ,  Masahide HAYASHI

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0041 ,  B81B3/00 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0285 ,  G01C19/5747 ,  G01C19/5769 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18 ,  H01L29/84 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.