Abstract:
The purpose of the present invention is to provide a charged particle beam device which suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. Proposed is a charged particle beam device which has an electrostatic chuck mechanism, the charged particle beam device being provided with: a stage (200) which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body (203) which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member (402) which supports the insulating body on the stage; a ring-shaped electrode (400) which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member (405) which supports the ring-shaped electrode.
Abstract:
In order to prevent a sample from thermally expanding and contracting when the sample is placed on a sample stage inside a vacuum chamber, the related art has proposed a coping method of awaiting observation by setting a standby time from when the wafer is conveyed into the vacuum chamber until the wafer and the sample table are brought into thermal equilibrium. In addition, the coping method is configured so as to await the observation until the wafer is cooled down to room temperature when the wafer is heated in the previous step. Consequently, throughput of an apparatus decreases. A temperature control mechanism which can control temperature of the sample is installed inside a mini-environment device. The sample temperature control mechanism controls the temperature of the sample inside the mini-environment device so as to become a setting temperature which is set in view of a lowered temperature of the sample inside a load lock chamber.
Abstract:
The present invention provides a high-throughput scanning electron microscope in which a wafer (9) is held by an electrostatic chuck (10), an image is obtained using an electron beam, and the wafer surface is measured, wherein even in a case where the temperature of the wafer (9) is changed due to the environmental temperature the electron scanning microscope is capable of preventing any loss in resolution or the deterioration of the measurement reproducibility caused by thermal shrinkage accompanied by temperature change of the wafer (9). A drill hole is provided on the rear surface of the electrostatic chuck (10), and a thermometer (34) is secured in place so that the front end is brought into elastic contact with the bottom surface of the drill hole. The output of the thermometer (34) is sent to a computing unit, the computing unit computes a measurement limit time for beginning measurement, based on a predetermined algorithm, from an output value of the thermometer (34), and measuring begins at individual measurement sites after the measurement limit time has elapsed.
Abstract:
An object of the present invention is to provide a charged particle beam apparatus that effectively removes electrical charges from an electrostatic chuck.In order to achieve the above object, the charged particle beam apparatus of the present invention includes a sample chamber that maintains a space containing an electrostatic chuck mechanism (5) in a vacuum state; and in which the charged particle beam apparatus includes an ultraviolet light source (6) to irradiate ultraviolet light within the sample chamber, and a irradiation target member irradiated by the ultraviolet light; and the irradiation target member is placed perpendicular to the adsorption surface of the electrostatic chuck.
Abstract:
In a charged particle beam apparatus that applies a retarding voltage to a sample through a contact terminal and executes measurement or inspection of a surface of the sample, potential variation of the sample when changing the retarding voltage applied to the contact terminal is measured by a surface potential meter, a time constant of the potential variation of the sample is obtained, and it is determined whether execution of measurement or inspection by a charged particle beam continues or stops based on the time constant, or a conduction ensuring process between the sample and the contact terminal is executed.
Abstract:
The present invention explains a charged-particle beam device for the purpose of highly accurately measuring electrostatic charge of a sample in a held state by an electrostatic chuck (105). In order to attain the object, according to the present invention, there is proposed a charged-particle beam device including an electrostatic chuck (105) for holding a sample on which a charged particle beam is irradiated and a sample chamber (102) in which the electrostatic chuck (105) is set. The charged-particle beam device includes a potential measuring device that measures potential on a side of an attraction surface for the sample of the electrostatic chuck (105) and a control device that performs potential measurement by the potential measuring device in a state in which the sample is attracted by the electrostatic chuck (105).
Abstract:
Proposed are an electrostatic chuck mechanism and a charged particle beam apparatus including a first plane that is a plane of a side in which a sample is adsorbed, a first electrode to which a voltage for generating an adsorptive power between the first plane and the sample is applied, and a second electrode that is arranged in a position relatively separated from the sample toward the first plane and through which a virtual line that is perpendicular to the first plane and contacts an edge of the sample passes, wherein the first plane is formed so that a size in a plane direction of the first plane is smaller than that of the sample.
Abstract:
An object of the present invention is to provide a charged particle beam apparatus that effectively removes electrical charges from an electrostatic chuck.In order to achieve the above object, the charged particle beam apparatus of the present invention includes a sample chamber that maintains a space containing an electrostatic chuck mechanism (5) in a vacuum state; and in which the charged particle beam apparatus includes an ultraviolet light source (6) to irradiate ultraviolet light within the sample chamber, and a irradiation target member irradiated by the ultraviolet light; and the irradiation target member is placed perpendicular to the adsorption surface of the electrostatic chuck.