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    Light emitting device
    2.
    发明申请
    Light emitting device 审中-公开
    发光装置

    公开(公告)号：US20110215366A1

    公开(公告)日：2011-09-08

    申请号：US12932121

    申请日：2011-02-17

    申请人： Koji Tsukagoshi ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    发明人： Koji Tsukagoshi ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A light emitting device (1) includes a glass substrate (4) having a recess (2) in a front surface, and a lead frame (5a). A copper material (7) is embedded so that the copper material (7) passes through the lead frame (5a). A light emitting element (6) is mounted on the copper material (7). The glass substrate (4) and the lead frame (5a) are bonded to each other so that the light emitting element (6) is exposed from the recess of the glass substrate (4). Thus, the copper material is embedded in a pass-through manner directly under a region of the lead frame where the light emitting element is disposed. Therefore, adhesion between the glass substrate and the lead frame is ensured, and heat generated by the light emitting element may be efficiently radiated from the rear surface of the glass substrate.

    摘要翻译： 发光装置（1）包括在前表面具有凹部（2）的玻璃基板（4）和引线框架（5a）。 嵌入铜材料（7），使得铜材料（7）穿过引线框架（5a）。 发光元件（6）安装在铜材料（7）上。 玻璃基板（4）和引线框架（5a）彼此接合，使得发光元件（6）从玻璃基板（4）的凹部露出。 因此，铜材料以直通方式嵌入在引线框架的设置有发光元件的区域的下方。 因此，确保了玻璃基板与引线框架之间的粘接性，能够从玻璃基板的后表面有效地照射由发光元件产生的热量。

    OPTICAL SENSOR DEVICE
    5.
    发明申请
    OPTICAL SENSOR DEVICE 有权
    光传感器设备

    公开(公告)号：US20130001409A1

    公开(公告)日：2013-01-03

    申请号：US13471602

    申请日：2012-05-15

    申请人： Koji TSUKAGOSHI ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    发明人： Koji TSUKAGOSHI ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    IPC分类号： G01J1/04 ,  G01J1/42

    CPC分类号： H01L31/0203 ,  H01L31/02162 ,  H01L2224/16225 ,  H01L2924/15151

    摘要： Provided is a low-cost, compact, high-reliability optical sensor device serving to correspond to the visibility. In the optical sensor device, an optical sensor element is mounted in a package formed by a light shielding glass lid substrate (1) having a filter function in part and a light shielding glass substrate (2) including a cavity. In the light shielding glass lid substrate having the filter function, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded in part. The light shielding glass substrate is made of glass having light shielding property as its own property.

    摘要翻译： 提供了一种低成本，紧凑，高可靠性的光学传感器装置，用于对应于可视性。 在光传感器装置中，光传感器元件安装在由具有滤光器功能的遮光玻璃盖基板（1）和包括空腔的遮光玻璃基板（2）形成的封装中。 在具有滤光器功能的遮光玻璃盖基板中，部分嵌入具有吸收红外光并通过其自身特性透射可见光的功能的玻璃。 遮光玻璃基板由具有遮光性的玻璃作为其本身的特性制成。

    Lighting device
    6.
    发明申请
    Lighting device 失效
    照明设备

    公开(公告)号：US20100163919A1

    公开(公告)日：2010-07-01

    申请号：US12653537

    申请日：2009-12-15

    申请人： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    发明人： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Provided is a lighting device which includes a lead frame embedded in a glass material and has high reliability. The lighting device has a structure in which a light emitting element is mounted in a recess portion formed on a surface of a glass substrate and a sealing material is provided to cover the light emitting element. The lead frame is embedded in the glass substrate so as to be exposed on a side surface of the glass substrate and a bottom surface of the recess portion. A portion of the lead frame which is exposed in the recess portion is electrically connected with the light emitting element. With the structure as described above, the durability of the lighting device is improved.

    摘要翻译： 提供一种照明装置，其包括嵌入玻璃材料中的引线框架并且具有高可靠性。 照明装置具有将发光元件安装在形成在玻璃基板的表面上的凹部中的结构，并且设置密封材料以覆盖发光元件。 引线框架嵌入玻璃基板中，露出在玻璃基板的侧面和凹部的底面上。 引线框架中露出在凹部中的部分与发光元件电连接。 利用如上所述的结构，提高了照明装置的耐久性。

    Lighting device having light emitting element mounted in glass substrate
    7.
    发明授权
    Lighting device having light emitting element mounted in glass substrate 失效
    具有安装在玻璃基板上的发光元件的照明装置

    公开(公告)号：US08134173B2

    公开(公告)日：2012-03-13

    申请号：US12653537

    申请日：2009-12-15

    申请人： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    发明人： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

    IPC分类号： H01L33/62

    CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A lighting device has a glass substrate and a lead frame embedded in the glass substrate. The glass substrate has a front surface, a side surface and a rear surface, the front surface having a recess portion with a bottom surface. The lead frame has a portion exposed on the side surface of the glass substrate and a portion exposed on the bottom surface of the recess portion. A line width of a region of the portion of the lead frame exposed on the bottom surface of the recess portion is narrower than a line width of a region of the portion of the lead frame exposed on the side surface of the glass substrate. A light emitting element is mounted in the recess portion of the glass substrate and is electrically connected with the portion of the lead frame exposed on the bottom surface of the recess portion. A sealing material covers the light emitting element.

    摘要翻译： 照明装置具有玻璃基板和嵌入玻璃基板的引线框架。 玻璃基板具有前表面，侧表面和后表面，前表面具有具有底表面的凹部。 引线框架具有暴露在玻璃基板的侧表面上的部分和暴露在凹部的底表面上的部分。 在凹部的底面露出的引线框架的部分的区域的线宽比在玻璃基板的侧面露出的引线框架的部分的区域的线宽窄。 发光元件安装在玻璃基板的凹部中，并与引线框架的露出在凹部的底面上的部分电连接。 密封材料覆盖发光元件。

    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards
    8.
    发明授权
    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards 失效
    具有符合不兼容通信标准的无线通信功能的无线通信装置

    公开(公告)号：US08005504B2

    公开(公告)日：2011-08-23

    申请号：US11560170

    申请日：2006-11-15

    申请人： Eiichi Sano ,  Hiroyuki Fujita

    发明人： Eiichi Sano ,  Hiroyuki Fujita

    IPC分类号： H04M1/00

    CPC分类号： H04W52/42 ,  H04B7/0602 ,  H04B7/0805 ,  H04B7/0825 ,  H04M2250/02 ,  H04M2250/06

    摘要： A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.

    摘要翻译： 提供一种无线通信装置。 无线通信装置包括符合不兼容的第一和第二通信标准的无线通信功能。 无线通信装置包括执行符合第一通信标准的无线通信操作的第一收发器，并且包括第一发送/接收端口，执行符合第二通信标准的无线通信操作的第二收发器，并且包括第二发送/ 接收端口，由第一和第二收发器共享的共享天线，连接共享天线与第一和第二发送/接收端口的天线连接单元，以及控制单元，其控制第一和第二收发器中的通信操作 收发器