摘要:
A light emitting device (1) includes a glass substrate (4) having a recess (2) in a front surface, and a lead frame (5a). A copper material (7) is embedded so that the copper material (7) passes through the lead frame (5a). A light emitting element (6) is mounted on the copper material (7). The glass substrate (4) and the lead frame (5a) are bonded to each other so that the light emitting element (6) is exposed from the recess of the glass substrate (4). Thus, the copper material is embedded in a pass-through manner directly under a region of the lead frame where the light emitting element is disposed. Therefore, adhesion between the glass substrate and the lead frame is ensured, and heat generated by the light emitting element may be efficiently radiated from the rear surface of the glass substrate.
摘要:
On a through-electrode (7) formed by filling a conductive material into a though hole of a substrate, nano-metal particles are adhered to form a connection electrode (9). An LED element (3) is electrically connected to the through-electrode (7) via the connection electrode (9). The nano-metal particles can be applied into a desired shape by an inkjet method or a dispenser method, and hence a light emitting device (1) having high electrical connection reliability is realized at low cost.
摘要:
Provided is a method of manufacturing an optical filter for an illuminance sensor, which has spectral characteristics close to human luminosity characteristics, has high detection accuracy, and can be manufactured at low cost. The method includes the steps of: (a) punching a glass; (b) feeding a small piece of glass (7) having a filter effect; (c) softening the small piece of glass (7); and (d) abrading.
摘要:
A lighting device has a glass substrate and a lead frame embedded in the glass substrate. The glass substrate has a front surface, a side surface and a rear surface, the front surface having a recess portion with a bottom surface. The lead frame has a portion exposed on the side surface of the glass substrate and a portion exposed on the bottom surface of the recess portion. A line width of a region of the portion of the lead frame exposed on the bottom surface of the recess portion is narrower than a line width of a region of the portion of the lead frame exposed on the side surface of the glass substrate. A light emitting element is mounted in the recess portion of the glass substrate and is electrically connected with the portion of the lead frame exposed on the bottom surface of the recess portion. A sealing material covers the light emitting element.
摘要:
A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.
摘要:
Provided is a low-cost, compact, high-reliability optical sensor device serving to correspond to the visibility. In the optical sensor device, an optical sensor element is mounted in a package formed by a light shielding glass lid substrate (1) having a filter function in part and a light shielding glass substrate (2) including a cavity. In the light shielding glass lid substrate having the filter function, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded in part. The light shielding glass substrate is made of glass having light shielding property as its own property.
摘要:
Provided is a lighting device which includes a lead frame embedded in a glass material and has high reliability. The lighting device has a structure in which a light emitting element is mounted in a recess portion formed on a surface of a glass substrate and a sealing material is provided to cover the light emitting element. The lead frame is embedded in the glass substrate so as to be exposed on a side surface of the glass substrate and a bottom surface of the recess portion. A portion of the lead frame which is exposed in the recess portion is electrically connected with the light emitting element. With the structure as described above, the durability of the lighting device is improved.
摘要:
A light emitting device includes: a glass package (2) having a recess (5) in its center; a through-hole electrode (4) formed by filling a through hole (3), which is formed at a bottom of the recess (5), with a conductive material; a light emitting diode element (6) received in the recess (5) and mounted on the through-hole electrode (4); an insulating multilayer interference film (7) formed on an inner wall surface and a bottom surface of the recess (5); and a sealing material for sealing the light emitting diode element. With this structure, the light emitting device is improved in reliability.
摘要:
Bonding between a light-emitting element and electrodes of a substrate is ensured to enhance reliability of a lighting device. In the lighting device of the present invention, a material made of metal alkoxide or polymetalloxane generated from metal alkoxide is used as a coating material covering the light-emitting element. This may enhance reliability of the bonding between the substrate and the light-emitting element while keeping a high light-emission efficiency. Further, when a liquid material made of metal alkoxide is heat-cured by a sol-gel method, the liquid material changes from a liquid, a sol, a gel, to a solid successively to shrink, thereby generating glass being a solid material . With the use of a shrinking force obtained when the gel changes to the solid in the production method, the bonding between the light-emitting element and the electrodes of the substrate can be performed simultaneously with the curing of the coating material.
摘要:
Bonding between a light-emitting element and electrodes of a substrate is ensured to enhance reliability of a lighting device. In the lighting device of the present invention, a material made of metal alkoxide or polymetalloxane generated from metal alkoxide is used as a coating material covering the light-emitting element. This may enhance reliability of the bonding between the substrate and the light-emitting element while keeping a high light-emission efficiency. Further, when a liquid material made of metal alkoxide is heat-cured by a sol-gel method, the liquid material changes from a liquid, a sol, a gel, to a solid successively to shrink, thereby generating glass being a solid material. With the use of a shrinking force obtained when the gel changes to the solid in the production method, the bonding between the light-emitting element and the electrodes of the substrate can be performed simultaneously with the curing of the coating material.