公开(公告)号：US07180183B2

公开(公告)日：2007-02-20

申请号：US10441677

申请日：2003-05-19

申请人： Ho-Yi Tsai ,  Chin-Ming Shih ,  Ying-Ren Lin

发明人： Ho-Yi Tsai ,  Chin-Ming Shih ,  Ying-Ren Lin

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device with reinforced under-support structure and a method for fabricating the semiconductor device are provided, which can be used in the packaging of an MPBGA/TFBGA (Multi-Package Ball Grid Array & Thin Fine-pitch Ball Grid Array) module to help reinforce the TFBGA under-support structure therein. The proposed chip-packaging method is characterized by the provision of large-area solder pads at the corners of a solder-pad array used for TFBGA attaching application, in order to form solder bumps of a large cross section and volume during reflow process to help reinforce the TFBGA under-package structure. This feature can reinforce the TFBGA under-package structure without having to use flip-chip underfill technology, and without having to use extra large type solder balls and arrange pads into different pitches as in the prior art.

摘要翻译： 提供了一种具有加强的支撑下结构的半导体器件和一种制造该半导体器件的方法，可用于将MPBGA / TFBGA（多封装球栅阵列和薄型细间距球栅阵列）模块封装 有助于加强其中的TFBGA欠支撑结构。 所提出的芯片封装方法的特征在于在用于TFBGA连接应用的焊盘阵列的拐角处提供大面积焊盘，以便在回流过程中形成具有大横截面和体积的焊料凸块以帮助 加强TFBGA封装外结构。 该特征可以增强TFBGA欠包装结构，而不必使用倒装芯片底部填充技术，并且不必像现有技术那样使用额外的大型焊球和将焊盘排列成不同的间距。

公开(公告)号：US20130140078A1

公开(公告)日：2013-06-06

申请号：US13366273

申请日：2012-02-04

申请人： Chin-Ming Shih ,  Jun-Chun Wong

发明人： Chin-Ming Shih ,  Jun-Chun Wong

IPC分类号： H05K7/14 ,  H02G15/32

CPC分类号： F21V27/02 ,  F21V31/03 ,  F21W2131/10 ,  F21Y2115/10 ,  H05K5/0213

摘要： An electronic device and a joint are provided. The electronic device includes a casing, an electronic element and the joint. The casing has a cable hole. The electronic element is disposed inside the casing. The joint includes a body, a waterproof and breathable film and a fastener. The body is fixed to the cable hole and has a breathable channel. The waterproof and breathable film is disposed at the breathable channel. The fastener is used for fastening a power cable to the body. The power cable passes through the fastener and the body and electrically connects the electronic element. The joint, a power cable and the casing form a waterproof and breathable chamber.

摘要翻译： 提供电子设备和接头。 电子装置包括壳体，电子元件和接头。 外壳有一个电缆孔。 电子元件设置在壳体内。 接头包括身体，防水透气膜和紧固件。 身体固定在电缆孔上，并具有透气通道。 防水透气膜设置在透气通道上。 紧固件用于将电力电缆固定到主体上。 电力电缆通过紧固件和主体并电连接电子元件。 接头，电源线和外壳形成防水透气室。

公开(公告)号：US08456768B2

公开(公告)日：2013-06-04

申请号：US13010651

申请日：2011-01-20

申请人： Chin-Ming Shih ,  Yeu-Torng Yau

发明人： Chin-Ming Shih ,  Yeu-Torng Yau

IPC分类号： G02B7/02

CPC分类号： F21V5/04 ,  F21V17/005 ,  F21V17/16 ,  F21V19/003 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A lens-holding-and-aligning seat and an LED light panel thereof are presented. The light panel includes a substrate, an LED, a lens and a holding-and-aligning seat. The LED is disposed on the substrate in corresponding to a soldering pad of the substrate, and the holding-and-aligning seat has a holding portion and an aligning element. The lens is fixed on the holding-and-aligning seat by the holding portion, and the aligning element is bonded on the soldering pad corresponding to the soldering pad by a reflow process. Therefore, the lens is aligned with the LED by a soldering self-alignment mechanism, such that the light shape and light intensity distribution of the light emitted by the LED may be adjusted by the lens.

摘要翻译： 本发明提供一种保持镜片座椅及其LED灯板。 光板包括基板，LED，透镜和保持对准座。 LED对应于基板的焊盘设置在基板上，并且保持对准座具有保持部和对准元件。 通过保持部将透镜固定在保持对准座上，并且通过回流工艺将对准元件接合到对应于焊盘的焊盘上。 因此，透镜通过焊接自对准机构与LED对准，使得由LED发射的光的光形状和光强度分布可以由透镜调节。

公开(公告)号：US20120127730A1

公开(公告)日：2012-05-24

申请号：US13010651

申请日：2011-01-20

申请人： Chin-Ming Shih ,  Yeu-Torng Yau

发明人： Chin-Ming Shih ,  Yeu-Torng Yau

IPC分类号： F21V5/00 ,  G02B7/02

CPC分类号： F21V5/04 ,  F21V17/005 ,  F21V17/16 ,  F21V19/003 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A lens-holding-and-aligning seat and an LED light panel thereof are presented. The light panel includes a substrate, an LED, a lens and a holding-and-aligning seat. The LED is disposed on the substrate in corresponding to a soldering pad of the substrate, and the holding-and-aligning seat has a holding portion and an aligning element. The lens is fixed on the holding-and-aligning seat by the holding portion, and the aligning element is bonded on the soldering pad corresponding to the soldering pad by a reflow process. Therefore, the lens is aligned with the LED by a soldering self-alignment mechanism, such that the light shape and light intensity distribution of the light emitted by the LED may be adjusted by the lens.

摘要翻译： 本发明提供一种保持镜片座椅及其LED灯板。 光板包括基板，LED，透镜和保持对准座。 LED对应于基板的焊盘设置在基板上，并且保持对准座具有保持部和对准元件。 通过保持部将透镜固定在保持对准座上，并且通过回流工艺将对准元件接合到对应于焊盘的焊盘上。 因此，透镜通过焊接自对准机构与LED对准，使得由LED发射的光的光形状和光强度分布可以由透镜调节。

公开(公告)号：US20070069899A1

公开(公告)日：2007-03-29

申请号：US11311293

申请日：2005-12-20

申请人： Chin-Ming Shih ,  Pin-Chao Hsu ,  Ya-Ping Chen ,  John Mai

发明人： Chin-Ming Shih ,  Pin-Chao Hsu ,  Ya-Ping Chen ,  John Mai

IPC分类号： G06K7/08 ,  G08B13/14 ,  B29D22/00 ,  H01Q1/36

CPC分类号： H01Q1/22 ,  B29D22/00 ,  B32B37/185 ,  B32B2305/342 ,  B32B2519/02 ,  G06K19/07749 ,  H01Q1/2208 ,  H01Q1/38 ,  Y10T156/103

摘要： A flexible radio frequency identification label and a method for fabricating the same are proposed. A first flexible protection layer is attached to a second flexible protection layer to form a closed space for receiving a radio frequency identification circuit. By such arrangement, a good flexibility can be provided by the flexible protection layers, and the closed space also enables the radio frequency identification circuit to be protected and isolated from the moisture in the outside environment, such that the circuit can be prevented from being oxidized and the service life of the product can be extended.

摘要翻译： 提出了一种灵活的射频识别标签及其制造方法。 第一柔性保护层附接到第二柔性保护层以形成用于接收射频识别电路的封闭空间。 通过这种布置，可以通过柔性保护层提供良好的灵活性，并且封闭空间还使得射频识别电路能够被保护并与外部环境中的水分隔离，使得可以防止电路被氧化 可延长产品的使用寿命。

公开(公告)号：US07385512B2

公开(公告)日：2008-06-10

申请号：US11311293

申请日：2005-12-20

申请人： Chin-Ming Shih ,  Pin-Chao Hsu ,  Ya-Ping Chen ,  John D. H. Mai

发明人： Chin-Ming Shih ,  Pin-Chao Hsu ,  Ya-Ping Chen ,  John D. H. Mai

IPC分类号： G08B13/14 ,  G06K19/06

CPC分类号： H01Q1/22 ,  B29D22/00 ,  B32B37/185 ,  B32B2305/342 ,  B32B2519/02 ,  G06K19/07749 ,  H01Q1/2208 ,  H01Q1/38 ,  Y10T156/103

摘要： A flexible radio frequency identification label and a method for fabricating the same are proposed. A first flexible protection layer is attached to a second flexible protection layer to form a closed space for receiving a radio frequency identification circuit. By such arrangement, a good flexibility can be provided by the flexible protection layers, and the closed space also enables the radio frequency identification circuit to be protected and isolated from the moisture in the outside environment, such that the circuit can be prevented from being oxidized and the service life of the product can be extended.

摘要翻译： 提出了一种灵活的射频识别标签及其制造方法。 第一柔性保护层附接到第二柔性保护层以形成用于接收射频识别电路的封闭空间。 通过这种布置，可以通过柔性保护层提供良好的灵活性，并且封闭空间还使得射频识别电路能够被保护并与外部环境中的水分隔离，使得可以防止电路被氧化 可延长产品的使用寿命。