摘要:
A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system.
摘要:
A latency control circuit includes a FIFO controller and a register unit. The FIFO controller may generate an increase signal according to an external command, and generate a decrease signal according to an internal command. The FIFO controller may also enable a depth point signal responsive to the increase signal and the decrease signal. The register unit may include n registers. The value n (rounded off) may be obtained by dividing a larger value of a maximum number of additive latencies and a maximum number of write latencies by a column cycle delay time (tCCD). The registers may store an address received with the external command responsive to the increase signal and a clock signal, and may shift either the address or a previous address to a neighboring register. The latency control circuit transmits an address stored in a register as a column address corresponding to the enabled depth point signal.
摘要:
A system, device and related method are used to communicate data via a plurality of data lanes including a selected data lane. In a first mode of operation, payload data and related supplemental data are communicated via the plurality of data lanes including the selected data lane. In a second mode of operation, only payload data is communicated via the plurality of data lanes, except the selected data lane.
摘要:
A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system.
摘要:
A semiconductor device having an electrostatic discharge (ESD) protection circuit and a method of testing the same may provided. The semiconductor device may include one or more stacked chips, each stacked chip may include a test circuit configured to output a test control signal and a selection control signal in response to a test enable signal, an internal circuit configured to perform an operation and output a plurality of test signals in response to the test control signal, at least one multiplexer (MUX) configured to select and output one of the plurality of test signals based on the selection control signal, at least one test pad configured to receive the selected test signal, and at least one electrostatic discharge (ESD) protection circuit configured to discharge static electricity applied through the test pad externally.
摘要:
A memory system includes at least one memory module, each of which has a pattern data generating circuit for generating a pattern data, which has a plurality of memories to which a command signal is commonly applied and corresponding data is applied respectively; and a memory controller for respectively applying the command signal and the corresponding data to the plurality of memories, applying a pattern data generating command to the memory module during a timing control operation, calculating time differences among data of reaching each of the plurality of memories using the pattern data outputted from each of the memories and receiving and outputting data using the calculated data reaching time difference. Therefore, a stable data transmission is achieved between the memory controller and the memories.
摘要:
A semiconductor memory module and a semiconductor memory device are disclosed. In one embodiment, the invention provides a semiconductor memory module comprising a circuit board, a plurality of semiconductor memory devices adapted to operate during a test mode and a normal operation mode and mounted on the circuit board, a first signal line set comprising a plurality of first signal lines connected to the plurality of semiconductor memory devices, and a plurality of second signal line sets. Each semiconductor memory device comprises first terminals adapted to receive first signals from the first signal lines, second terminals connected to a corresponding one of the second signal line sets, a third terminal adapted to receive an enable signal during the test mode, and a signal transmitting unit adapted to output second signals to the second terminals in response to the enable signal.
摘要:
A memory module, a memory system including a memory controller and a memory module and methods thereof. The example memory module may include a plurality of memory units each having an interface and at least one memory device. An example write operation method may include receiving a packet command at a given one of a plurality of memory units, each of the plurality of memory units including an interface and at least one memory device, extracting a command signal, an address and write data from the received packet command if the received packet command corresponds to a write operation, transferring the extracted write data to at least one memory device via write/read data lines internal to the given one memory unit and writing the transferred write data at the at least one memory device. An example read operation may include receiving a packet command at a given one of a plurality of memory units, each of the plurality of memory units including an interface and at least one memory device, extracting a command signal and an address from the received packet command if the received packet command corresponds to a read operation, transferring the extracted command signal and address to at least one memory device, receiving read data corresponding to the extracted command signal and address from the at least one memory device via write/read data lines internal to the given one memory unit and transmitting the received read data from the interface via read data lines external to the given one memory unit.
摘要:
A semiconductor memory device and a memory system including the same are provided. The semiconductor memory device may include a first memory cell array block generating first data, a second memory cell array block generating second data, and first and second error detection code generators. The first error detection code generator may generate a first error detection code and may combine a portion of bits of the first error detection code with a portion of bits of a second error detection code to generate a first final error detection signal. The second error detection code generator may generate the second error detection code and may combine the remaining bits other than the portion of bits of the second error detection code with the remaining bits other than the portion of bits of the first error detection code to generate a second final error detection signal.
摘要:
A delay locked loop (DLL) circuit for a synchronous semiconductor memory device which can control a delay time of a feedback loop within the DLL circuit according to the magnitude of an external load, and a method of generating information about a load connected to a data pin of a synchronous semiconductor memory device are provided. The DLL circuit includes a replica output driver delaying an internal clock signal by a first delay time to output a first internal clock signal, the first delay time is a delay time of the internal clock signal which is generated by an output driver when a first load of a first magnitude is connected to an output terminal of the output driver, and a transfer/delay circuit transferring the first delay internal clock signal to a phase detector as a second delay internal clock signal when the first load is connected to the output terminal, and outputting the second delay internal clock signal to the phase detector by delaying the first delay internal clock signal by a second delay time, the second delay time is a delay time of the internal clock signal which is generated by the output driver when a second load of a second magnitude, which is larger than the first magnitude, is connected to the output terminal.