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10 条记录 (耗时 0.018 秒)

    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
    1.
    发明申请
    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages 有权
    集成式散热器，适用于线栅球栅阵列半导体封装

    公开(公告)号：US20060055029A1

    公开(公告)日：2006-03-16

    申请号：US10939082

    申请日：2004-09-10

    申请人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    发明人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat spreader mounted on the substrate. An IC die is mounted to the heat spreader such that the heat spreader lies in between the die and the substrate. The invention is also directed to a heat spreader plate useable in a semiconductor package. The heat spreader plate comprises a plate comprised of thermally conductive material suitable for attachment to a packaging substrate wherein the plate includes openings for exposing electrical bonding surfaces of a packaging substrate when the heater spreader plate is mounted on the packaging substrate. Such openings enable wirebonding between the exposed electrical bonding surfaces of the substrate and an integrated circuit die to complete construction of a package including the heatspreader.

    摘要翻译： 本发明涉及用于在这种包装和系统中提供改进的热性能的系统，包装和方法。 本发明的实施例包括具有安装在基板上的散热器的基板的半导体集成电路（IC）封装。 IC散热器安装在散热器上，使得散热器位于模具和基板之间。 本发明还涉及可用于半导体封装的散热板。 散热板包括由适于附接到包装基板的导热材料构成的板，其中，当加热器散布板安装在包装基板上时，该板包括用于暴露包装基板的电接合表面的开口。 这种开口使得能够在基板的暴露的电接合表面和集成电路管芯之间进行引线接合，以完成包括散热器的封装的构造。

    Two layer substrate ball grid array design
    4.
    发明申请
    Two layer substrate ball grid array design 有权
    双层底板球栅阵列设计

    公开(公告)号：US20070040284A1

    公开(公告)日：2007-02-22

    申请号：US11205364

    申请日：2005-08-17

    申请人： Chok Chia ,  Allen Lim ,  Maurice Othieno

    发明人： Chok Chia ,  Allen Lim ,  Maurice Othieno

    IPC分类号： H01L23/52

    CPC分类号： H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

    摘要： A routing pattern for high speed signals for a package substrate. Electrically conductive bond fingers are disposed on a first surface of the package substrate. The first surface is adapted to receive an integrated circuit in an attachment zone, and the bond fingers are disposed in at least two substantially concentric rings around the attachment zone. The bond fingers of the innermost ring of bond fingers are all routed to electrically conductive first traces disposed on a first layer of the package substrate. The bond fingers other that those on the innermost ring of bond fingers are all routed to electrically conductive second traces disposed on a separate second layer of the package substrate. The package substrate has electrically conductive traces on only the first layer and the second layer. Electrically conductive contacts are disposed on a substantially opposing second surface. The first traces are all routed to a first set of the contacts that are all disposed within an innermost portion of the second surface, and the second traces are all routed to a second set of the contacts that are all disposed within an outermost portion of the second surface.

    摘要翻译： 用于封装衬底的高速信号的布线图案。 导电接合指状物设置在封装衬底的第一表面上。 第一表面适于在附接区域中接收集成电路，并且接合指状物设置在围绕附接区域的至少两个基本上同心的环中。 结合指状物的最内环的键合指状物都被引导到设置在封装衬底的第一层上的导电的第一迹线。 粘结指状物之间的键指，其中位于结合指状物的最内环上的那些键都指向设置在封装衬底的单独第二层上的导电第二迹线。 封装衬底仅在第一层和第二层上具有导电迹线。 导电触点设置在基本相对的第二表面上。 第一迹线都被布线到第一组触点，所述第一组触点都设置在第二表面的最内部分内，并且第二迹线都被布线到第二组触点，所述第二组触点都设置在第二组触点的最外部分内 第二面。

    Semiconductor package having a thermally and electrically connected heatspreader
    5.
    发明授权
    Semiconductor package having a thermally and electrically connected heatspreader 有权
    具有热和电连接的散热器的半导体封装

    公开(公告)号：US06933602B1

    公开(公告)日：2005-08-23

    申请号：US10620074

    申请日：2003-07-14

    申请人： Pradip Patel ,  Maurice Othieno ,  Manickam Thavarajah ,  Severino A. Legaspi, Jr.

    发明人： Pradip Patel ,  Maurice Othieno ,  Manickam Thavarajah ,  Severino A. Legaspi, Jr.

    IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  H01L23/48 ,  H05K7/20

    CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one electrical ground plane and includes a plurality solder balls formed on a surface thereof. The solder balls include a set of “thermal” solder balls that are positioned near the perimeter of the package and electrically connected with a ground plane of the package. The IC die is electrically connected with the ground plane that is connected with the “thermal” solder balls. A heat spreader is mounted on the package with conductive mounting pegs that are electrically connected with the ground plane. The heat spreader is in thermal communication with the die and also in thermal communication with the set of “thermal” solder balls. This configuration enables a portion of the heat generated by the die to be dissipated from the die through the heat spreader into the set of “thermal” solder balls. Additionally, the package can be configured so that the combination of the electrically connected heat spreader, ground plane, and conductive mounting pegs operate together as a electromagnetic shield that reduces the amount of electrical noise of the package.

    摘要翻译： 本发明的实施例包括半导体集成电路封装，其包括具有附接到其上的集成电路管芯的衬底。 基板包括至少一个电接地平面，并且包括在其表面上形成的多个焊球。 焊球包括一组“热”焊球，其位于封装周边附近并与封装的接地平面电连接。 IC芯片与与“热”焊球连接的接地平面电连接。 散热器安装在封装上，导电安装钉与地平面电连接。 散热器与模具热连通，并且还与一组“热”焊球热连通。 这种配置使得由模具产生的热量的一部分能够通过散热器从模具中消散到一组“热”焊球中。 此外，封装可以被配置成使得电连接的散热器，接地平面和导电安装钉的组合作为电磁屏蔽一起工作，这减少了封装的电噪声量。

    Slotted bonding pad
    6.
    发明授权
    Slotted bonding pad 有权
    开槽接合垫

    公开(公告)号：US06825563B1

    公开(公告)日：2004-11-30

    申请号：US10683101

    申请日：2003-10-09

    申请人： Ramaswamy Ranganathan ,  Maurice Othieno ,  Qwai H. Low

    发明人： Ramaswamy Ranganathan ,  Maurice Othieno ,  Qwai H. Low

    IPC分类号： H01L2348

    CPC分类号： H01L24/05 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A bonding pad structure having an electrically conductive capping layer. An electrically conductive first supporting layer having major orthogonal sides is disposed under the electrically conductive capping layer. The electrically conductive first supporting layer is configured as a sheet having slotted voids in a first direction. An electrically conductive second supporting layer having major orthogonal sides is disposed under the electrically conductive first supporting layer. The electrically conductive second supporting layer is configured as a sheet having slotted voids in a second direction. The first direction and the second direction are associated one with another by being disposed at a positive value and a negative value of an angle, where the angle is neither zero nor ninety degrees with respect to the major orthogonal sides of the electrically conductive first supporting layer and the electrically conductive second supporting layer.

    摘要翻译： 一种具有导电覆盖层的焊盘结构。 具有主正交侧面的导电的第一支撑层设置在导电覆盖层的下方。 导电性第一支撑层被构造成在第一方向上具有开槽空隙的片材。 具有主要正交侧面的导电的第二支撑层设置在导电的第一支撑层的下方。 导电的第二支撑层被构造成在第二方向上具有开槽空隙的片材。 第一方向和第二方向通过以相对于导电的第一支撑层的主正交侧的角度不为零也不是九十度的角度的正值和负值设置而彼此相关联 和导电的第二支撑层。