公开(公告)号：US09807877B1

公开(公告)日：2017-10-31

申请号：US15285593

申请日：2016-10-05

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

发明人： Li-Kun Liu ,  Yan-Lu Li

IPC分类号： H05K3/20 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/4611 ,  H05K3/4655 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09218 ,  H05K2203/063 ,  Y10T29/49128

摘要： A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.

公开(公告)号：US10653015B2

公开(公告)日：2020-05-12

申请号：US16255236

申请日：2019-01-23

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Xian-Qin Hu ,  Li-Kun Liu ,  Yan-Lu Li ,  Ming-Jaan Ho

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/42 ,  H05K3/28 ,  H05K3/06

摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

公开(公告)号：US10660218B2

公开(公告)日：2020-05-19

申请号：US15957875

申请日：2018-04-19

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Xian-Qin Hu ,  Li-Kun Liu ,  Yan-Lu Li ,  Ming-Jaan Ho

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/42 ,  H01L23/498 ,  H05K1/18 ,  H01L21/48 ,  H05K1/11 ,  H05K3/28 ,  H05K3/06

摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

公开(公告)号：US10349533B1

公开(公告)日：2019-07-09

申请号：US16236358

申请日：2018-12-29

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Li-Kun Liu ,  Yan-Lu Li

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K3/06 ,  H05K1/09 ,  H05K3/40

摘要： A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.

公开(公告)号：US11582859B2

公开(公告)日：2023-02-14

申请号：US17467373

申请日：2021-09-06

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Bao-Jun Li ,  Yang Li ,  Yan-Lu Li ,  Li-Kun Liu

IPC分类号： H05K3/38 ,  H05K1/02

摘要： A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

公开(公告)号：US11140769B1

公开(公告)日：2021-10-05

申请号：US16916067

申请日：2020-06-29

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Bao-Jun Li ,  Yang Li ,  Yan-Lu Li ,  Li-Kun Liu

IPC分类号： H05K1/02

摘要： A flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes two outer wiring boards enclosing an inner wiring board. The inner wiring board includes a first conductive wiring layer and a first substrate layer. The first conductive wiring layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductive wiring layer and defines first through holes which expose the signal line. Each of the two outer wiring boards includes a second substrate layer and a second conductive wiring layer. The second substrate layer abuts the inner wiring board and defines second through holes aligning with the first through holes, to partially surround the signal line with air of very low dielectric constant. A method for manufacturing the flexible circuit board is also disclosed.

公开(公告)号：US11985764B2

公开(公告)日：2024-05-14

申请号：US17727935

申请日：2022-04-25

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Yang Li ,  Yan-Lu Li ,  Li-Kun Liu

IPC分类号： H05K1/14 ,  H05K3/38 ,  H05K9/00

CPC分类号： H05K1/147 ,  H05K3/388 ,  H05K9/0088

摘要： A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.