Semiconductor device and method for fabricating the same
    4.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08313993B2

    公开(公告)日:2012-11-20

    申请号:US12358188

    申请日:2009-01-22

    IPC分类号: H01L21/8238

    摘要: A dual work function semiconductor device and method for fabricating the same are disclosed. In one aspect, a device includes a first and second transistor on a first and second substrate region. The first and second transistors include a first gate stack having a first work function and a second gate stack having a second work function respectively. The first and second gate stack each include a host dielectric, a gate electrode comprising a metal layer, and a second dielectric capping layer therebetween. The second gate stack further has a first dielectric capping layer between the host dielectric and metal layer. The metal layer is selected to determine the first work function. The first dielectric capping layer is selected to determine the second work function.

    摘要翻译: 公开了一种双功能半导体器件及其制造方法。 一方面,一种器件包括在第一和第二衬底区域上的第一和第二晶体管。 第一和第二晶体管包括分别具有第一功函数的第一栅极堆叠和具有第二功函数的第二栅极堆叠。 第一和第二栅极堆叠各自包括主电介质,包括金属层的栅电极和它们之间的第二电介质覆盖层。 第二栅极堆叠还在主介质和金属层之间具有第一介电覆盖层。 选择金属层以确定第一功函数。 选择第一介电覆盖层以确定第二功函数。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20090184376A1

    公开(公告)日:2009-07-23

    申请号:US12358188

    申请日:2009-01-22

    IPC分类号: H01L27/092 H01L21/28

    摘要: A dual work function semiconductor device and method for fabricating the same are disclosed. In one aspect, a device includes a first and second transistor on a first and second substrate region. The first and second transistors include a first gate stack having a first work function and a second gate stack having a second work function respectively. The first and second gate stack each include a host dielectric, a gate electrode comprising a metal layer, and a second dielectric capping layer therebetween. The second gate stack further has a first dielectric capping layer between the host dielectric and metal layer. The metal layer is selected to determine the first work function. The first dielectric capping layer is selected to determine the second work function.

    摘要翻译: 公开了一种双功能半导体器件及其制造方法。 一方面,一种器件包括在第一和第二衬底区域上的第一和第二晶体管。 第一和第二晶体管包括分别具有第一功函数的第一栅极堆叠和具有第二功函数的第二栅极堆叠。 第一和第二栅极堆叠各自包括主电介质,包括金属层的栅电极和它们之间的第二电介质覆盖层。 第二栅极堆叠还在主介质和金属层之间具有第一介电覆盖层。 选择金属层以确定第一功函数。 选择第一介电覆盖层以确定第二功函数。

    METHOD FOR FABRICATING A DUAL WORKFUNCTION SEMICONDUCTOR DEVICE AND THE DEVICE MADE THEREOF
    6.
    发明申请
    METHOD FOR FABRICATING A DUAL WORKFUNCTION SEMICONDUCTOR DEVICE AND THE DEVICE MADE THEREOF 有权
    用于制造双功能半导体器件及其器件的方法

    公开(公告)号:US20090283835A1

    公开(公告)日:2009-11-19

    申请号:US12428341

    申请日:2009-04-22

    IPC分类号: H01L27/092 H01L21/8234

    摘要: A method for manufacturing a dual workfunction semiconductor device and the device made thereof are disclosed. In one aspect, the method includes manufacturing a first transistor in a first region and a second transistor in a second region of a substrate, the first transistor including a first gate stack, the first gate stack having a first gate dielectric capping layer and a first metal gate electrode layer. The second gate stack is similar to the first gate stack. The method includes applying a first thermal budget to the first gate dielectric capping layer and a second thermal budget to the second gate dielectric capping material to tune the workfunction of the first and second gate stack, the first thermal budget being smaller than the second thermal budget such that after the thermal treatment the first and the second gate stack have different work functions.

    摘要翻译: 公开了制造双功能半导体器件的方法及其制造的器件。 在一个方面,所述方法包括在衬底的第二区域中制造第一区域中的第一晶体管和第二晶体管,所述第一晶体管包括第一栅极堆叠,所述第一栅极堆叠层具有第一栅极介电覆盖层和第一栅极电介质覆盖层 金属栅电极层。 第二个栅极堆叠类似于第一个栅极堆叠。 该方法包括将第一热预算应用于第一栅极电介质封盖层,以及将第二热预算应用于第二栅极电介质封盖材料以调节第一和第二栅极堆叠的功函数,第一热预算小于第二热预算 使得在热处理之后,第一和第二栅极堆叠具有不同的功函数。

    Method for fabricating a dual workfunction semiconductor device and the device made thereof
    7.
    发明授权
    Method for fabricating a dual workfunction semiconductor device and the device made thereof 有权
    双功能半导体器件的制造方法及其制造方法

    公开(公告)号:US08012827B2

    公开(公告)日:2011-09-06

    申请号:US12428341

    申请日:2009-04-22

    IPC分类号: H01L27/092

    摘要: A method for manufacturing a dual workfunction semiconductor device and the device made thereof are disclosed. In one aspect, the method includes manufacturing a first transistor in a first region and a second transistor in a second region of a substrate, the first transistor including a first gate stack, the first gate stack having a first gate dielectric capping layer and a first metal gate electrode layer. The second gate stack is similar to the first gate stack. The method includes applying a first thermal budget to the first gate dielectric capping layer and a second thermal budget to the second gate dielectric capping material to tune the workfunction of the first and second gate stack, the first thermal budget being smaller than the second thermal budget such that after the thermal treatment the first and the second gate stack have different work functions.

    摘要翻译: 公开了制造双功能半导体器件的方法及其制造的器件。 在一个方面,所述方法包括在衬底的第二区域中制造第一区域中的第一晶体管和第二晶体管,所述第一晶体管包括第一栅极堆叠,所述第一栅极堆叠层具有第一栅极介电覆盖层和第一栅极电介质覆盖层 金属栅电极层。 第二个栅极堆叠类似于第一个栅极堆叠。 该方法包括将第一热预算应用于第一栅极电介质封盖层,以及将第二热预算应用于第二栅极电介质封盖材料以调节第一和第二栅极堆叠的功函数,第一热预算小于第二热预算 使得在热处理之后,第一和第二栅极堆叠具有不同的功函数。

    Method for fabricating a dual workfunction semiconductor device and the device made thereof
    8.
    发明授权
    Method for fabricating a dual workfunction semiconductor device and the device made thereof 有权
    双功能半导体器件的制造方法及其制造方法

    公开(公告)号:US07989898B2

    公开(公告)日:2011-08-02

    申请号:US12428054

    申请日:2009-04-22

    IPC分类号: H01L27/088

    摘要: A dual workfunction semiconductor device and a device made thereof is disclosed. In one aspect, the device includes a first gate stack in a first region and a second gate stack in a second region. The first gate stack has a first effective workfunction, and the second gate stack has a second effective workfunction different from the first effective workfunction. The first gate stack includes a first gate dielectric capping layer, a gate dielectric host layer, a first metal gate electrode layer, a barrier metal gate electrode, a second gate dielectric capping layer, and a second metal gate electrode. The second gate stack includes a gate dielectric host layer, a first metal gate electrode, a second gate dielectric capping layer, and a second metal gate electrode.

    摘要翻译: 公开了一种双功能半导体器件及其制造的器件。 在一个方面,该器件包括在第一区域中的第一栅极堆叠和在第二区域中的第二栅极堆叠。 第一栅极堆叠具有第一有效功函数,并且第二栅极堆叠具有与第一有效功函数不同的第二有效功函数。 第一栅极堆叠包括第一栅极介电覆盖层,栅极电介质主体层,第一金属栅极电极层,势​​垒金属栅电极,第二栅极介电覆盖层和第二金属栅极电极。 第二栅极堆叠包括栅极电介质主体层,第一金属栅极电极,第二栅极介电覆盖层和第二金属栅电极。

    METHOD FOR FABRICATING A DUAL WORKFUNCTION SEMICONDUCTOR DEVICE AND THE DEVICE MADE THEREOF
    9.
    发明申请
    METHOD FOR FABRICATING A DUAL WORKFUNCTION SEMICONDUCTOR DEVICE AND THE DEVICE MADE THEREOF 有权
    用于制造双功能半导体器件及其器件的方法

    公开(公告)号:US20090261424A1

    公开(公告)日:2009-10-22

    申请号:US12428054

    申请日:2009-04-22

    IPC分类号: H01L27/088 H01L21/8236

    摘要: A dual workfunction semiconductor device and a device made thereof is disclosed. In one aspect, the device includes a first gate stack in a first region and a second gate stack in a second region. The first gate stack has a first effective workfunction, and the second gate stack has a second effective workfunction different from the first effective workfunction. The first gate stack includes a first gate dielectric capping layer, a gate dielectric host layer, a first metal gate electrode layer, a barrier metal gate electrode, a second gate dielectric capping layer, and a second metal gate electrode. The second gate stack includes a gate dielectric host layer, a first metal gate electrode, a second gate dielectric capping layer, and a second metal gate electrode.

    摘要翻译: 公开了一种双功能半导体器件及其制造的器件。 在一个方面,该器件包括在第一区域中的第一栅极堆叠和在第二区域中的第二栅极堆叠。 第一栅极堆叠具有第一有效功函数,并且第二栅极堆叠具有与第一有效功函数不同的第二有效功函数。 第一栅极堆叠包括第一栅极介电覆盖层,栅极电介质主体层,第一金属栅极电极层,势​​垒金属栅电极,第二栅极介电覆盖层和第二金属栅极电极。 第二栅极堆叠包括栅极电介质主体层,第一金属栅极电极,第二栅极介电覆盖层和第二金属栅电极。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20090206417A1

    公开(公告)日:2009-08-20

    申请号:US12389315

    申请日:2009-02-19

    IPC分类号: H01L27/092 H01L21/8238

    摘要: A method for manufacturing a dual work function semiconductor device is disclosed. In one aspect, a method starts by forming a host dielectric layer over a first and second region of a substrate. A first dielectric capping layer is formed overlying the host dielectric layer on the first and second region and later selectively removed to expose an underlying layer on the first region. A Hf-based dielectric capping layer is formed overlying the underlying layer on the first region and the first dielectric capping layer on the second region. The Hf-based dielectric capping layer is selected to have a healing effect on the exposed surface of the underlying layer on the first region. A control electrode is formed overlaying the Hf-based dielectric capping layer on the first region and on the second region.

    摘要翻译: 公开了一种用于制造双功能半导体器件的方法。 在一个方面,一种方法通过在衬底的第一和第二区域上形成主电介质层开始。 形成第一介电覆盖层,覆盖第一和第二区域上的主介电层,然后选择性地去除以暴露第一区域上的下层。 形成Hf基电介质覆盖层,覆盖第一区域上的下层和第二区域上的第一介电覆盖层。 选择Hf基介电覆盖层以对第一区域上的下层的暴露表面具有愈合效果。 在第一区域和第二区域上形成覆盖Hf基电介质覆盖层的控制电极。