Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
    2.
    发明申请
    Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper 有权
    水溶液,酸浴和电解沉积铜的方法

    公开(公告)号:US20110011746A1

    公开(公告)日:2011-01-20

    申请号:US12921817

    申请日:2009-04-27

    IPC分类号: C25D5/02 C25D3/38 C25D7/12

    摘要: To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids.

    摘要翻译: 为了产生特别是在盲微孔(BMV)和沟槽中的非常均匀的铜沉积物,提供了用于电解沉积铜的水性酸浴,所述浴含有至少一种铜离子源,至少一种酸性离子源, 至少一种增白剂化合物和至少一种矫味剂化合物,其中至少一种矫味剂化合物选自合成产生的非官能化肽和合成产生的官能化肽和合成产生的官能化氨基酸。

    METHOD FOR COPPER PLATING
    5.
    发明申请
    METHOD FOR COPPER PLATING 有权
    铜镀层方法

    公开(公告)号:US20140102910A1

    公开(公告)日:2014-04-17

    申请号:US14124268

    申请日:2012-05-07

    IPC分类号: C25D3/38

    摘要: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

    摘要翻译: 公开了一种在电镀浴中镀铜的方法,其中使衬底与包含具有硫醇基的杂环核心和通过间隔物连接到所述杂环核心上的氨基的矫味添加剂接触。 所述方法特别适用于在印刷电路板,IC基板和半导体基板的制造中填充凹陷结构。

    Method for producing a mask arrangement and use of the mask arrangement
    6.
    发明申请
    Method for producing a mask arrangement and use of the mask arrangement 审中-公开
    用于制造掩模装置的方法和所述掩模装置的使用

    公开(公告)号:US20060183029A1

    公开(公告)日:2006-08-17

    申请号:US11346572

    申请日:2006-02-03

    IPC分类号: G03C5/00 G03F1/00

    摘要: A method is provided for producing a mask arrangement that is used for additive forming of organic semiconductor material regions on a substrate. The mask arrangement is formed by applying a photocrosslinkable polymer material to a mask carrier region, exposing it in a controlled and selective and thereby patterned manner and subsequently developing it. The developing process facilitates the removal of polymer material regions that are not exposed, and have not been photocrosslinked, from surface regions of the mask carrier region such that the desired mask arrangement is produced.

    摘要翻译: 提供了一种制造用于在基板上添加形成有机半导体材料区域的掩模布置的方法。 通过将光可交联聚合物材料施加到掩模载体区域,以受控和选择性的方式将其曝光以形成掩模布置并随后显影。 显影方法有助于从掩模载体区域的表面区域除去未被曝光并且未被光致交联的聚合物材料区域,使得产生所需的掩模装置。

    Aqueous, acid bath and method for the electrolytic deposition of copper
    7.
    发明授权
    Aqueous, acid bath and method for the electrolytic deposition of copper 有权
    水,酸浴和铜的电解沉积方法

    公开(公告)号:US08679316B2

    公开(公告)日:2014-03-25

    申请号:US12921817

    申请日:2009-04-27

    IPC分类号: C25D5/02 C25D3/38

    摘要: An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

    摘要翻译: 用于铜的电解沉积的含水酸浴包含至少一种铜离子源,至少一种酸离子源,至少一种增白剂化合物和至少一种整理剂化合物,并且特别是在盲人中产生非常均匀的铜沉积物 微通道(BMV)和沟槽。 整平剂化合物选自合成产生的非官能化肽,合成产生的官能化肽和合成产生的官能化氨基酸。