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1.发明授权公开(公告)号：US08749015B2
公开(公告)日：2014-06-10
申请号：US13299254
申请日：2011-11-17
申请人： Donald R. Disney , Andrew P. Edwards , Hui Nie , Richard J. Brown , Isik C. Kizilyalli , David P. Bour , Linda Romano , Thomas R. Prunty
发明人： Donald R. Disney , Andrew P. Edwards , Hui Nie , Richard J. Brown , Isik C. Kizilyalli , David P. Bour , Linda Romano , Thomas R. Prunty
IPC分类号： H01L29/06
CPC分类号： H01L21/761 , H01L21/2654 , H01L21/266 , H01L21/765 , H01L29/0619 , H01L29/0642 , H01L29/0692 , H01L29/2003 , H01L29/402 , H01L29/66136 , H01L29/66212 , H01L29/6631 , H01L29/66909 , H01L29/8083 , H01L29/872
摘要： A method for fabricating an edge termination structure includes providing a substrate having a first surface and a second surface and a first conductivity type, forming a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the substrate, and forming a second GaN epitaxial layer of a second conductivity type opposite to the first conductivity type. The second GaN epitaxial layer is coupled to the first GaN epitaxial layer. The method also includes implanting ions into a first region of the second GaN epitaxial layer to electrically isolate a second region of the second GaN epitaxial layer from a third region of the second GaN epitaxial layer. The method further includes forming an active device coupled to the second region of the second GaN epitaxial layer and forming the edge termination structure coupled to the third region of the second GaN epitaxial layer.
摘要翻译： 一种用于制造边缘终端结构的方法包括提供具有第一表面和第二表面和第一导电类型的衬底，形成耦合到衬底的第一表面的第一导电类型的第一GaN外延层，并形成第二 与第一导电类型相反的第二导电类型的GaN外延层。 第二GaN外延层耦合到第一GaN外延层。 该方法还包括将离子注入第二GaN外延层的第一区域以将第二GaN外延层的第二区域与第二GaN外延层的第三区域电隔离。 该方法还包括形成耦合到第二GaN外延层的第二区域并形成耦合到第二GaN外延层的第三区域的边缘端接结构的有源器件。
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公开(公告)号：US20130161780A1
公开(公告)日：2013-06-27
申请号：US13335329
申请日：2011-12-22
IPC分类号： H01L29/868 , H01L21/20
CPC分类号： H01L29/868 , H01L29/0615 , H01L29/0649 , H01L29/2003 , H01L29/66204 , H01L29/66212 , H01L29/6631 , H01L29/66924
摘要： A III-nitride semiconductor device includes an active region for supporting current flow during forward-biased operation of the III-nitride semiconductor device. The active region includes a first III-nitride epitaxial material having a first conductivity type, and a second III-nitride epitaxial material having a second conductivity type. The III-nitride semiconductor device further includes an edge-termination region physically adjacent to the active region and including an implanted region comprising a portion of the first III-nitride epitaxial material. The implanted region of the first III-nitride epitaxial material has a reduced electrical conductivity in relation to portions of the first III-nitride epitaxial material adjacent to the implanted region
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3.发明申请METHOD AND SYSTEM FOR JUNCTION TERMINATION IN GAN MATERIALS USING CONDUCTIVITY MODULATION 有权使用电导率调制的燃料材料中结点终止的方法和系统公开(公告)号：US20130161633A1
公开(公告)日：2013-06-27
申请号：US13334742
申请日：2011-12-22
CPC分类号： H01L21/0254 , H01L21/2654 , H01L21/266 , H01L29/0611 , H01L29/0642 , H01L29/0692 , H01L29/2003 , H01L29/66204 , H01L29/66212 , H01L29/66924 , H01L29/8083 , H01L29/861 , H01L29/872
摘要： A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
摘要翻译： 半导体结构包括具有第一表面和与第一表面相对的第二表面的GaN衬底。 GaN衬底的特征在于第一导电类型和第一掺杂剂浓度。 半导体结构还包括耦合到GaN衬底的第二表面的第一导电类型的第一GaN外延层和耦合到第一GaN外延层的第二导电类型的第二GaN外延层。 第二GaN外延层包括有源器件区，第一结端接区，其特征在于具有第一注入分布的注入区，以及第二结终端区，其特征在于具有第二注入分布的注入区。
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4.发明授权Method and system for junction termination in GaN materials using conductivity modulation 有权使用电导率调制的GaN材料中的结端接方法和系统公开(公告)号：US08716716B2
公开(公告)日：2014-05-06
申请号：US13334742
申请日：2011-12-22
IPC分类号： H01L21/335 , H01L29/20
CPC分类号： H01L21/0254 , H01L21/2654 , H01L21/266 , H01L29/0611 , H01L29/0642 , H01L29/0692 , H01L29/2003 , H01L29/66204 , H01L29/66212 , H01L29/66924 , H01L29/8083 , H01L29/861 , H01L29/872
摘要： A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
摘要翻译： 半导体结构包括具有第一表面和与第一表面相对的第二表面的GaN衬底。 GaN衬底的特征在于第一导电类型和第一掺杂剂浓度。 半导体结构还包括耦合到GaN衬底的第二表面的第一导电类型的第一GaN外延层和耦合到第一GaN外延层的第二导电类型的第二GaN外延层。 第二GaN外延层包括有源器件区，第一结端接区，其特征在于具有第一注入分布的注入区，以及第二结终端区，其特征在于具有第二注入分布的注入区。
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公开(公告)号：US08822311B2
公开(公告)日：2014-09-02
申请号：US13335329
申请日：2011-12-22
CPC分类号： H01L29/868 , H01L29/0615 , H01L29/0649 , H01L29/2003 , H01L29/66204 , H01L29/66212 , H01L29/6631 , H01L29/66924
摘要： A III-nitride semiconductor device includes an active region for supporting current flow during forward-biased operation of the III-nitride semiconductor device. The active region includes a first III-nitride epitaxial material having a first conductivity type, and a second III-nitride epitaxial material having a second conductivity type. The III-nitride semiconductor device further includes an edge-termination region physically adjacent to the active region and including an implanted region comprising a portion of the first III-nitride epitaxial material. The implanted region of the first III-nitride epitaxial material has a reduced electrical conductivity in relation to portions of the first III-nitride epitaxial material adjacent to the implanted region.
摘要翻译： III族氮化物半导体器件包括用于在III族氮化物半导体器件的正向偏置操作期间支持电流的有源区域。 有源区包括具有第一导电类型的第一III族氮化物外延材料和具有第二导电类型的第二III族氮化物外延材料。 III族氮化物半导体器件还包括物理地邻近有源区的边缘终端区，并且包括包含第一III族氮化物外延材料的一部分的注入区。 第一III族氮化物外延材料的注入区域相对于与注入区域相邻的第一III族氮化物外延材料的部分具有降低的导电性。
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公开(公告)号：US08785975B2
公开(公告)日：2014-07-22
申请号：US13529822
申请日：2012-06-21
IPC分类号： H01L27/088 , H01L29/778 , H01L29/06
CPC分类号： H01L21/0254 , H01L21/02664 , H01L21/8252 , H01L27/0605 , H01L29/0657 , H01L29/7786 , Y10S438/978
摘要： A semiconductor device includes a III-nitride substrate of a first conductivity type, a first III-nitride epitaxial layer of the first conductivity type coupled to the III-nitride substrate, and a first III-nitride epitaxial structure coupled to a first portion of a surface of the first III-nitride epitaxial layer. The first III-nitride epitaxial structure has a sidewall. The semiconductor device further includes a second III-nitride epitaxial structure of the first conductivity type coupled to the first III-nitride epitaxial structure, a second III-nitride epitaxial layer of the first conductivity type coupled to the sidewall of the second III-nitride epitaxial layer and a second portion of the surface of the first III-nitride epitaxial layer, and a third III-nitride epitaxial layer of a second conductivity type coupled to the second III-nitride epitaxial layer. The semiconductor device also includes one or more dielectric structures coupled to a surface of the third III-nitride epitaxial layer.
摘要翻译： 半导体器件包括第一导电类型的III族氮化物衬底，耦合到III族氮化物衬底的第一导电类型的第一III族氮化物外延层和耦合到第一III族氮化物外延结构的第一部分 第一III族氮化物外延层的表面。 第一III族氮化物外延结构具有侧壁。 半导体器件还包括耦合到第一III族氮化物外延结构的第一导电类型的第二III族氮化物外延结构，第一导电类型的第二III族氮化物外延层耦合到第二III族氮化物外延的侧壁 层和第一III族氮化物外延层的表面的第二部分，以及耦合到第二III族氮化物外延层的第二导电类型的第三III族氮化物外延层。 半导体器件还包括耦合到第三III族氮化物外延层的表面的一个或多个电介质结构。
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公开(公告)号：US20130341677A1
公开(公告)日：2013-12-26
申请号：US13529822
申请日：2012-06-21
IPC分类号： H01L27/088 , H01L21/8234
CPC分类号： H01L21/0254 , H01L21/02664 , H01L21/8252 , H01L27/0605 , H01L29/0657 , H01L29/7786 , Y10S438/978
摘要： A semiconductor device includes a III-nitride substrate of a first conductivity type, a first III-nitride epitaxial layer of the first conductivity type coupled to the III-nitride substrate, and a first III-nitride epitaxial structure coupled to a first portion of a surface of the first III-nitride epitaxial layer. The first III-nitride epitaxial structure has a sidewall. The semiconductor device further includes a second III-nitride epitaxial structure of the first conductivity type coupled to the first III-nitride epitaxial structure, a second III-nitride epitaxial layer of the first conductivity type coupled to the sidewall of the second III-nitride epitaxial layer and a second portion of the surface of the first III-nitride epitaxial layer, and a third III-nitride epitaxial layer of a second conductivity type coupled to the second III-nitride epitaxial layer. The semiconductor device also includes one or more dielectric structures coupled to a surface of the third III-nitride epitaxial layer.
摘要翻译： 半导体器件包括第一导电类型的III族氮化物衬底，耦合到III族氮化物衬底的第一导电类型的第一III族氮化物外延层和耦合到第一III族氮化物外延结构的第一部分 第一III族氮化物外延层的表面。 第一III族氮化物外延结构具有侧壁。 半导体器件还包括耦合到第一III族氮化物外延结构的第一导电类型的第二III族氮化物外延结构，第一导电类型的第二III族氮化物外延层耦合到第二III族氮化物外延的侧壁 层和第一III族氮化物外延层的表面的第二部分，以及耦合到第二III族氮化物外延层的第二导电类型的第三III族氮化物外延层。 半导体器件还包括耦合到第三III族氮化物外延层的表面的一个或多个电介质结构。
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8.发明申请公开(公告)号：US20130126885A1
公开(公告)日：2013-05-23
申请号：US13299254
申请日：2011-11-17
申请人： Donald R. Disney , Andrew P. Edwards , Hui Nie , Richard J. Brown , Isik C. Kizilyalli , David P. Bour , Linda Romano , Thomas R. Prunty
发明人： Donald R. Disney , Andrew P. Edwards , Hui Nie , Richard J. Brown , Isik C. Kizilyalli , David P. Bour , Linda Romano , Thomas R. Prunty
CPC分类号： H01L21/761 , H01L21/2654 , H01L21/266 , H01L21/765 , H01L29/0619 , H01L29/0642 , H01L29/0692 , H01L29/2003 , H01L29/402 , H01L29/66136 , H01L29/66212 , H01L29/6631 , H01L29/66909 , H01L29/8083 , H01L29/872
摘要： A method for fabricating an edge termination structure includes providing a substrate having a first surface and a second surface and a first conductivity type, forming a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the substrate, and forming a second GaN epitaxial layer of a second conductivity type opposite to the first conductivity type. The second GaN epitaxial layer is coupled to the first GaN epitaxial layer. The method also includes implanting ions into a first region of the second GaN epitaxial layer to electrically isolate a second region of the second GaN epitaxial layer from a third region of the second GaN epitaxial layer. The method further includes forming an active device coupled to the second region of the second GaN epitaxial layer and forming the edge termination structure coupled to the third region of the second GaN epitaxial layer.
摘要翻译： 一种用于制造边缘终端结构的方法包括提供具有第一表面和第二表面和第一导电类型的衬底，形成耦合到衬底的第一表面的第一导电类型的第一GaN外延层，并形成第二 与第一导电类型相反的第二导电类型的GaN外延层。 第二GaN外延层耦合到第一GaN外延层。 该方法还包括将离子注入第二GaN外延层的第一区域以将第二GaN外延层的第二区域与第二GaN外延层的第三区域电隔离。 该方法还包括形成耦合到第二GaN外延层的第二区域并形成耦合到第二GaN外延层的第三区域的边缘端接结构的有源器件。
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公开(公告)号：US08698164B2
公开(公告)日：2014-04-15
申请号：US13315720
申请日：2011-12-09
IPC分类号： H01L29/808 , H01L21/335
CPC分类号： H01L29/8083 , H01L29/0623 , H01L29/2003 , H01L29/402 , H01L29/66446 , H01L29/66462 , H01L29/66909 , H01L29/66924
摘要： A semiconductor structure includes a GaN substrate with a first surface and a second surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. A first electrode is electrically coupled to the second surface of the GaN substrate. The semiconductor structure further includes a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the GaN substrate and a second GaN layer of a second conductivity type coupled to the first GaN epitaxial layer. The first GaN epitaxial layer comprises a channel region. The second GaN epitaxial layer comprises a gate region and an edge termination structure. A second electrode coupled to the gate region and a third electrode coupled to the channel region are both disposed within the edge termination structure.
摘要翻译： 半导体结构包括具有第一表面和第二表面的GaN衬底。 GaN衬底的特征在于第一导电类型和第一掺杂剂浓度。 第一电极电耦合到GaN衬底的第二表面。 半导体结构还包括耦合到GaN衬底的第一表面的第一导电类型的第一GaN外延层和耦合到第一GaN外延层的第二导电类型的第二GaN层。 第一GaN外延层包括沟道区。 第二GaN外延层包括栅极区域和边缘端接结构。 耦合到栅极区域的第二电极和耦合到沟道区域的第三电极都设置在边缘端接结构内。
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10.发明授权Method and system for a GaN vertical JFET with self-aligned source and gate 有权具有自对准源极和栅极的GaN垂直JFET的方法和系统公开(公告)号：US08829574B2
公开(公告)日：2014-09-09
申请号：US13334514
申请日：2011-12-22
申请人： Donald R. Disney , Isik C. Kizilyalli , Hui Nie , Linda Romano , Richard J. Brown , Madhan Raj
发明人： Donald R. Disney , Isik C. Kizilyalli , Hui Nie , Linda Romano , Richard J. Brown , Madhan Raj
IPC分类号： H01L29/808 , H01L21/335 , H01L29/66 , H01L29/78
CPC分类号： H01L29/66924 , H01L21/027 , H01L21/283 , H01L21/308 , H01L29/1095 , H01L29/2003 , H01L29/402 , H01L29/66446 , H01L29/66893 , H01L29/66909 , H01L29/66916 , H01L29/7832 , H01L29/808 , H01L29/8083 , H01L29/8086
摘要： A semiconductor device includes a III-nitride substrate, a first III-nitride epitaxial layer coupled to the III-nitride substrate and having a mesa, and a second III-nitride epitaxial layer coupled to a top surface of the mesa. The semiconductor device further includes a III-nitride gate structure coupled to a side surface of the mesa, and a spacer configured to provide electrical insulation between the second III-nitride epitaxial layer and the III-nitride gate structure.
摘要翻译： 半导体器件包括III族氮化物衬底，耦合到III族氮化物衬底并具有台面的第一III族氮化物外延层和耦合到台面的顶表面的第二III族氮化物外延层。 半导体器件还包括耦合到台面的侧表面的III族氮化物栅极结构，以及被配置为在第二III族氮化物外延层和III族氮化物栅极结构之间提供电绝缘的间隔物。
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