LCD Backlight unit and LCD having the same
    1.
    发明授权
    LCD Backlight unit and LCD having the same 有权
    LCD背光单元和LCD具有相同的功能

    公开(公告)号:US07221416B2

    公开(公告)日:2007-05-22

    申请号:US10997895

    申请日:2004-11-29

    IPC分类号: G02F1/1335

    摘要: An LCD backlight apparatus includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams at a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of the LCD.

    摘要翻译: LCD背光装置包括一个导光板,该导光板放置在LCD的LCD面板的下方,以将光引向LCD面板。 导光板具有均匀的上表面和形成在底面中的散射图案。 多个单色光源在导光板的一侧成直线放置,以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。 光源适于以预定的光束角辐射光束,使得光束仅在已经传播混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

    Side-emission type LED package
    7.
    发明授权
    Side-emission type LED package 有权
    侧面发射型LED封装

    公开(公告)号:US07473937B2

    公开(公告)日:2009-01-06

    申请号:US11318837

    申请日:2005-12-28

    IPC分类号: H01L29/22

    CPC分类号: H01L33/60 F21K9/68 H01L33/54

    摘要: A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译: 提供了侧面发射型LED封装。 LED封装包括LED芯片,下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸,从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部,以将由下部结构向上反射的光反射到径向横向方向。 如上所述,下部结构和上部结构彼此分开设置并组合,从而提高了密封构件的模制效率,并且可以容易地制造侧面发射型LED封装。