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公开(公告)号：US20100099342A1
公开(公告)日：2010-04-22
申请号：US12255442
申请日：2008-10-21
IPC分类号： B24D9/08
CPC分类号： B24B53/017
摘要： A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditioning assembly and loading unused conditioning disks onto the pad conditioning assembly, on or more disk storage stations for storing both used and unused conditioning disks, and a central robot having a range of motion sufficient for transferring both used an unused conditioning disks between the disk load/unload station and the one or more disk storage stations. Embodiments described herein reduce the length of system interruption by eliminating the need to safety lock out the system for the replacement of polishing pad conditioning disks.
摘要翻译： 一种用于更换抛光垫调节盘的方法和装置是提供化学机械抛光系统。 该装置包括用于从衬垫调节组件卸载使用的调节盘并将未使用的调节盘装载到衬垫调节组件上的多个盘装载/卸载站，用于存储使用和未使用的调节盘的两个或多个盘存储站，以及一个中央机器人， 足够的运动范围，用于在盘装载/卸载站和一个或多个盘存储站之间使用未使用的调节盘。 本文所描述的实施例通过消除安全锁定系统来更换抛光垫调节盘来减少系统中断的长度。
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公开(公告)号：US08454413B2
公开(公告)日：2013-06-04
申请号：US11614940
申请日：2006-12-21
申请人： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
发明人： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B41/06 , B29C33/424 , B29C35/02 , B29K2023/00 , B29K2083/00 , B29K2995/0074 , B29L2031/755
摘要： A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
摘要翻译： 用于载体头部的柔性膜具有大致圆形的主要部分，具有下表面，用于连接到基座组件的环形外部部分和从主体部分在与下表面相对的一侧延伸的环形挡片，用于连接到 基座组件。 翼片的至少一个表面具有表面纹理以防止粘附。
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公开(公告)号：US08298047B2
公开(公告)日：2012-10-30
申请号：US12987709
申请日：2011-01-10
申请人： Steven M. Zuniga , Hung Chih Chen
发明人： Steven M. Zuniga , Hung Chih Chen
IPC分类号： B24B5/35
摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
摘要翻译： 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面，基本上圆形的周边。 该装置具有抛光垫，该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面，用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。
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公开(公告)号：US20110104990A1
公开(公告)日：2011-05-05
申请号：US12987709
申请日：2011-01-10
申请人： Steven M. Zuniga , Hung Chih Chen
发明人： Steven M. Zuniga , Hung Chih Chen
摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
摘要翻译： 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面，基本上圆形的周边。 该装置具有抛光垫，该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面，用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。
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公开(公告)号：US07459057B2
公开(公告)日：2008-12-02
申请号：US10199738
申请日：2002-07-18
申请人： Steven M. Zuniga , Hung Chih Chen
发明人： Steven M. Zuniga , Hung Chih Chen
摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
摘要翻译： 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面，基本上圆形的周边。 该装置具有抛光垫，该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面，用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。
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公开(公告)号：US20080196833A1
公开(公告)日：2008-08-21
申请号：US12049650
申请日：2008-03-17
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： H01L21/306 , B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。
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7.发明申请公开(公告)号：US20070289124A1
公开(公告)日：2007-12-20
申请号：US11757069
申请日：2007-06-01
IPC分类号： H05K13/04
CPC分类号： H01L21/6838 , B24B37/30 , H01L21/67005 , Y10T29/5313 , Y10T279/11
摘要： The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
摘要翻译： 本发明涉及一种用于改善和加速基板加载过程的装置和方法。 一个实施例提供了用于真空吸附衬底的方法。 该方法包括将配置用于安装衬底的柔性膜的中心室排出，移动衬底，使得衬底的背面与柔性膜完全接触，并且抽真空中心室以将衬底的背面真空吸附到 柔性膜。
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公开(公告)号：US07207871B1
公开(公告)日：2007-04-24
申请号：US11245867
申请日：2005-10-06
IPC分类号： B24B5/00
摘要： A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.
摘要翻译： 描述了一种用于化学机械抛光的系统，该系统具有可被构造成压力区的具有可加压室的载体头。 该系统包括具有用于在抛光期间接触基底的膜的载体头部。 膜后面的可加压室与压力输入连通。 压力输入可以为可加压室提供不同的压力。 一些可加压室可以与多于一个的压力输入连通。 可以布置压力区域，其中每个区域包括一个或多个可加压室。 这些区域可以通过改变构成每个区域的可加压室来配置。
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公开(公告)号：US07048621B2
公开(公告)日：2006-05-23
申请号：US10975564
申请日：2004-10-27
申请人： Hung Chih Chen , Steven M. Zuniga
发明人： Hung Chih Chen , Steven M. Zuniga
IPC分类号： B24B41/06
CPC分类号： B24B37/005 , B24B37/30
摘要： A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier base. The junction is further configured such that the profile of a bottom surface of the retaining ring is substantially decoupled from flexing and/or expansion of carrier base.
摘要翻译： 用于基材的化学机械抛光的载体珠。 承载头包括载体基座，保持环和将载体基部连接到保持环的接合部。 接合部构造成使得保持环的垂直移动相对于载体基座基本上受到限制。 连接部被进一步构造成使得保持环的底部表面的轮廓与载体基体的弯曲和/或膨胀基本上脱离。
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公开(公告)号：US07001256B2
公开(公告)日：2006-02-21
申请号：US11144245
申请日：2005-06-02
申请人： Steven M. Zuniga , Hung Chih Chen
发明人： Steven M. Zuniga , Hung Chih Chen
IPC分类号： B24B7/22
摘要： A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.
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