摘要:
A packaged image sensing device of improved sensitivity is formed by providing a mechanism for enhancing the focusing of embedded microlenses on the photosensitive elements of the image sensor. Normally, the bonding material interposed between the packaging layers and the microlenses defocuses the microlenses. In one embodiment of the present invention, the focus is restored by interposing an intermediate optically refractive layer between the bonding material and the lenses. In another embodiment, a bonding material with a lower index of refraction is used. In a final embodiment, the microlenses are formed in a material of a higher index of refraction.
摘要:
A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.
摘要:
An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.
摘要:
An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.
摘要:
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要:
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要:
A method for forming an image sensor device. An alignment mark is formed on or in a substrate with distance from the alignment mark to the substrate edge less than about 3 mm. An array of active photosensing pixels is formed on the substrate. At least one dielectric layer is formed covering the substrate and the array. A color filter photoresist is formed on the least one dielectric layer. Subsequent to removal of the color filter photoresist from the alignment mark, the color filter photoresist is exposed with alignment to the alignment mark.
摘要:
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要:
A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
摘要:
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.