Multiple tier array capacitor
    8.
    发明授权
    Multiple tier array capacitor 有权
    多层阵列电容

    公开(公告)号:US06532143B2

    公开(公告)日:2003-03-11

    申请号:US09751612

    申请日:2000-12-29

    IPC分类号: H01G430

    摘要: A capacitor includes multiple tiers (302, 304, 306, 1210, 1212, 1310, 1312, 1380, FIGS. 3, 12, 13), which provide capacitance to a load at different inductance values. Each tier includes multiple layers (311-325, 1220, 1222, 1320, 1322, 1382, FIGS. 3, 12, 13) of patterned conductive material, which are separated by layers of dielectric material. In one embodiment, tiers are stacked in a vertical direction, and are electrically connected through vias (330, 332, 334, 1230, 1232, FIGS. 3, 12) that extend through some or all of the tiers. In another embodiment, one or more tiers (1310, 1312, FIG. 13) are located in a center region (1404, FIG. 14) of the capacitor, and one or more other tiers (1380, FIG. 13) are located in a peripheral region (1408, FIG. 14) of the capacitor. In that embodiment, the center tiers and peripheral tiers are electrically connected through one or more additional layers (1370, FIG. 13) of patterned conductive material. The capacitors of the various embodiments can be used as discrete devices, which are mountable on or embeddable within a housing (e.g., a package, interposer, socket or PC board), or they can be integrally fabricated within the housing.

    摘要翻译: 电容器包括多层(302,304,306,1210,1212,1310,1312,1380,图3,12,13),其以不同的电感值向负载提供电容。 每个层包括被介电材料层隔开的图案化导电材料的多层(311-325,1220,1222,1320,1322,1382,图3,12,13)。 在一个实施例中,层是沿垂直方向堆叠的,并且通过延伸穿过一些或所有层的通孔(330,332,334,1230,1232,图3,12)电连接。 在另一个实施例中,一个或多个层(1310,1312,图13)位于电容器的中心区域(1404,图14)中,并且一个或多个其他层(图13中的1380)位于 电容器的外围区域(1408,图14)。 在该实施例中,中心层和外围层通过图案化导电材料的一个或多个附加层(1370,图13)电连接。 各种实施例的电容器可以用作可安装在壳体(例如,封装,插入件,插座或PC板)中或嵌入其中的分立器件,或者它们可以一体地制造在壳体内。