公开(公告)号：US06300267B1

公开(公告)日：2001-10-09

申请号：US09434059

申请日：1999-11-04

申请人： Hung-tse Daniel Chen ,  Barry Jay Thaler

发明人： Hung-tse Daniel Chen ,  Barry Jay Thaler

IPC分类号： C09D1100

CPC分类号： C04B35/499 ,  C03C8/14 ,  C03C8/16 ,  C03C14/004 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3218 ,  C04B2235/3227 ,  C04B2235/3241 ,  C04B2235/3251 ,  C04B2235/3272 ,  C04B2235/3294 ,  C04B2235/3298 ,  C04B2235/36 ,  H01G4/1254 ,  H01G4/20

摘要： Various mixtures of lead magnesium niobate and lead titanate are made, each mixture having a different Curie temperature, wherein these mixtures are mixed together to form capacitor inks that can be used to make capacitors embedded in multilayer ceramic circuit boards. These capacitors have extended temperature ranges of operation as well as low loss tangents and high dielectric constants.

摘要翻译： 制备铌酸铅镁和钛酸铅的各种混合物，每个混合物具有不同的居里温度，其中这些混合物混合在一起形成可用于制造嵌入多层陶瓷电路板的电容器的电容器油墨。 这些电容器具有扩展的操作温度范围以及低损耗切线和高介电常数。

公开(公告)号：US06739047B2

公开(公告)日：2004-05-25

申请号：US10284544

申请日：2002-10-30

申请人： Mark Stuart Hammond ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  Leszek Hozer ,  Hung-tse Daniel Chen ,  Bernard Dov Geller ,  Gerard Frederickson

发明人： Mark Stuart Hammond ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  Leszek Hozer ,  Hung-tse Daniel Chen ,  Bernard Dov Geller ,  Gerard Frederickson

IPC分类号： H05K302

CPC分类号： H01L23/36 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/30107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

摘要翻译： 用于电子部件的封装包括金属支撑基板，其具有穿过其的开口图案和绝缘材料体，例如玻璃或陶瓷，并且粘合到支撑基板的表面上。 主体由多层绝缘材料形成，并且导电通孔延伸穿过多个层到支撑基板; 所述绝缘体在其中具有开口，电子部件直接安装在所述图案化基板的所述开口中。 基板可以切割成一个或多个模块，并直接焊接到其上安装有附加装置的母板上。

公开(公告)号：US06518502B2

公开(公告)日：2003-02-11

申请号：US09852901

申请日：2001-05-10

申请人： Mark Stuart Hammond ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  Leszek Hozer ,  Hung-tse Daniel Chen ,  Bernard Dov Geller ,  Gerard Frederickson

发明人： Mark Stuart Hammond ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  Leszek Hozer ,  Hung-tse Daniel Chen ,  Bernard Dov Geller ,  Gerard Frederickson

IPC分类号： H01L2302

CPC分类号： H01L23/36 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/30107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

摘要翻译： 用于电子部件的封装包括金属支撑基板，其具有穿过其的开口图案和绝缘材料体，例如玻璃或陶瓷，并且粘合到支撑基板的表面上。 主体由多层绝缘材料形成，并且导电通孔延伸穿过多个层到支撑基板; 所述绝缘体在其中具有开口，电子部件直接安装在所述图案化基板的所述开口中。 基板可以切割成一个或多个模块，并直接焊接到其上安装有附加装置的母板上。