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1.发明申请Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor 失效通过旋涂和多层陶瓷电容器制造多层陶瓷电容器的方法公开(公告)号：US20050128680A1
公开(公告)日：2005-06-16
申请号：US11011092
申请日：2004-12-15
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
摘要翻译： 本文公开了通过旋涂工艺制造多层陶瓷电容器的方法和通过上述方法获得的多层陶瓷电容器。 本发明的方法提供了通过旋涂形成的多个电介质层，其中涂覆介电层的过程和印刷内电极的过程可以作为单一工艺提供。 因此，在电介质层形成得较薄的同时容易控制电介质层的厚度。 此外，由于电介质层和内部电极依次形成，所以可以省略介电层的分离和分层工艺以及压缩陶瓷多层体的工艺。 因此，陶瓷多层体不需要被压缩，因此在多层陶瓷电容器中不会发生卷绕现象。
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公开(公告)号：US20050132548A1
公开(公告)日：2005-06-23
申请号：US11002183
申请日：2004-12-03
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译： 一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。 该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度 设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。
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3.发明申请Sol composition for dielectric ceramic, and dielectric ceramic and multilayered ceramic capacitor using the same 审中-公开电介质陶瓷的溶胶组合物，以及使用其的介电陶瓷和多层陶瓷电容器公开(公告)号：US20060121258A1
公开(公告)日：2006-06-08
申请号：US11052796
申请日：2005-02-09
申请人： Yong Kim , Hyo Shin , Hyoung Kim , Ho Choo , Jung Lee
发明人： Yong Kim , Hyo Shin , Hyoung Kim , Ho Choo , Jung Lee
CPC分类号： C04B35/624 , C04B35/468 , C04B35/62218 , C04B35/62615 , C04B35/6325 , C04B2235/449 , C04B2235/77 , C04B2235/79 , Y10T428/24926
摘要： Disclosed herein is a sol composition for ultrathin dielectric ceramic films, and dielectric ceramic and a multilayered ceramic capacitor manufactured using the same. The sol composition, composed of BaTiO3 as a main ingredient and an auxiliary ingredient, includes a polymeric sol having a metal precursor solution of BaTiO3 and an organic solvent, and an organic additive dissolved in the organic solvent to act as the auxiliary ingredient, in which the amount of the organic additive corresponds to the required amount of the auxiliary ingredient of the dielectric ceramic. Further, the ultrathin dielectric ceramic film, which is manufactured by a sol-gel process, includes the auxiliary ingredient, and hence, is advantageous in making low temperature sintering possible, and having a high dielectric constant, a high sintered density, and TCC characteristic meeting the X5R of EIA standard.
摘要翻译： 本文公开了一种用于超薄介电陶瓷膜的溶胶组合物，以及使用其制造的介电陶瓷和多层陶瓷电容器。 以BaTiO 3 3 +作为主要成分和辅助成分组成的溶胶组合物包括具有BaTiO 3 3金属前体溶液和有机溶剂的聚合物溶胶，和 溶解在有机溶剂中的有机添加剂用作辅助成分，其中有机添加剂的量对应于所需量的电介质陶瓷的辅助成分。 此外，通过溶胶 - 凝胶法制造的超薄介电陶瓷膜包括辅助成分，因此有利于低温烧结成为可能，并且具有高介电常数，高烧结密度和TCC特性 符合EIA标准的X5R。
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公开(公告)号：US20060270078A1
公开(公告)日：2006-11-30
申请号：US11439189
申请日：2006-05-24
申请人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
发明人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译： 本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。
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公开(公告)号：US20070018190A1
公开(公告)日：2007-01-25
申请号：US11489578
申请日：2006-07-20
申请人： Yong Kim , Young Oh , Hyoung Kim , Taek Lee , Seog Choi
发明人： Yong Kim , Young Oh , Hyoung Kim , Taek Lee , Seog Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。
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公开(公告)号：US20070155033A1
公开(公告)日：2007-07-05
申请号：US11649914
申请日：2007-01-05
IPC分类号： H01L21/00
CPC分类号： B29C41/12 , B29C41/20 , B29C41/36 , B29C41/50 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.
摘要翻译： 一种制造LED封装的方法。 该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。 这防止了由于附加界面而形成中间层而导致额外的工艺和成本，并且消除了可靠性和光提取效率的降低。
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7.发明申请Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor 失效通过毛细管成型用于制造pdp隔壁的糊剂和糊剂组合物的方法公开(公告)号：US20060121815A1
公开(公告)日：2006-06-08
申请号：US10521196
申请日：2003-07-15
IPC分类号： H01J9/24
摘要： Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.
摘要翻译： 公开了一种制造等离子体显示面板（PDP）的后板阻挡肋的方法，其包括以下步骤：通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中，然后烧结浆料 。 这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。 因此，该方法可以提高PDP的质量并降低后板的制造成本。
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公开(公告)号：US20070063214A1
公开(公告)日：2007-03-22
申请号：US11524278
申请日：2006-09-21
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/58
摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
摘要翻译： 本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。 发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。 荧光体分散在透镜结构的至少一部分中。
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9.发明申请Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor 审中-公开通过使用水溶液蚀刻厚膜及其组合物来制造pdp隔壁的方法公开(公告)号：US20050156522A1
公开(公告)日：2005-07-21
申请号：US10510036
申请日：2002-04-08
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36 , H01J2211/366
摘要： Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.
摘要翻译： 公开了一种制造用于等离子体显示面板（PDP）的隔壁的方法，其包括以下步骤：通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜（或“生胶条”） 肋骨，其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状，并烧结蚀刻的厚膜。 这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。 因此，该方法可以提高DPD的质量并降低后板的制造成本。
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10.发明申请Dual connection device for memory mediums and mobile communication terminals with the same 有权用于存储介质的双连接设备和具有相同功能的移动通信终端公开(公告)号：US20050233763A1
公开(公告)日：2005-10-20
申请号：US11050802
申请日：2005-02-07
CPC分类号： H04B1/3816 , G06K7/0021 , G06K7/0034 , H04M1/026
摘要： A dual connection device for memory mediums has a body portion electrically connected with a mobile communication terminal, a first receiving portion formed to the body portion for receiving therein a first memory medium, a second receiving portion formed to the body portion as to be arranged piled up to the first receiving portion for receiving therein a second memory medium, a first connection terminal installed in the first receiving portion so as to be electrically connected with a terminal of the first memory medium, and a second connection terminal installed in the second receiving portion so as to be electrically connected with a terminal of the second memory medium. Since a plurality of memory mediums are connected with a terminal mobile communication terminal by the connection device, it is possible to make the mobile communication terminal have a slim and compact size, accomplish a simplified assembly process, and obtain increased productivity and cost reduction due to simplification of assembly process.
摘要翻译： 用于存储介质的双连接装置具有与移动通信终端电连接的主体部分，形成在主体部分上用于在其中容纳第一存储介质的第一接收部分，形成在主体部分上的第二接收部分，以布置成堆 直到第一接收部分用于在其中接收第二存储介质;第一连接端子，安装在第一接收部分中以便与第一存储介质的端子电连接，第二连接端子安装在第二接收部分中 以便与第二存储介质的端子电连接。 由于多个存储介质通过连接装置与终端移动通信终端连接，所以可以使移动通信终端具有纤细且紧凑的尺寸，实现简化的组装过程，并且由于 装配过程简化。
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