公开(公告)号：US11996357B2

公开(公告)日：2024-05-28

申请号：US17446186

申请日：2021-08-27

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Daisuke Minoura

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/49838

摘要： A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns.

公开(公告)号：US11792929B2

公开(公告)日：2023-10-17

申请号：US17588457

申请日：2022-01-31

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Daisuke Minoura

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/10 ,  H05K3/26 ,  H05K3/38 ,  H01L23/13 ,  H01L23/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/42

CPC分类号： H05K1/116 ,  H05K3/26 ,  H05K3/389 ,  H05K3/422 ,  H05K2201/0989

摘要： A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor penetrating through the second insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the second insulating layer. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is in contact with the connection conductor and the wiring pattern is covered by the coating film, the conductor pad of the first conductor layer has a surface facing the second insulating layer and having a first surface roughness higher than a surface roughness of a surface of the wiring pattern, and the coating film has opening such that the opening is exposing the conductor pad entirely.

公开(公告)号：US11882656B2

公开(公告)日：2024-01-23

申请号：US17708486

申请日：2022-03-30

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Daisuke Minoura

IPC分类号： H05K1/11 ,  H05K3/38 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K1/113 ,  H05K3/383 ,  H05K3/389 ,  H05K3/0035 ,  H05K3/428 ,  H05K2201/096 ,  H05K2201/09454 ,  H05K2201/09827 ,  H05K2203/072 ,  H05K2203/0723

摘要： A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

公开(公告)号：US11617262B2

公开(公告)日：2023-03-28

申请号：US17588414

申请日：2022-01-31

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Daisuke Minoura

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/38

摘要： A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

公开(公告)号：US20140223998A1

公开(公告)日：2014-08-14

申请号：US14119444

申请日：2012-03-07

申请人： IBIDEN CO., LTD.

发明人： Takashi Yamakawa ,  Yasuhiro Ishii ,  Daisuke Minoura

IPC分类号： G01N15/08

CPC分类号： G01N15/0826 ,  F01N9/002 ,  F01N9/007 ,  F01N11/002 ,  F01N2900/0418 ,  F01N2900/1606 ,  G01N2015/084 ,  Y02T10/47

摘要： A particulate collection filter state detection device for detecting a state of a filter for collecting particulates in an exhaust gas, according to the present invention, includes first pressure detection means for detecting a first pressure produced at an upstream side of the filter on an exhaust gas flow path, second pressure detection means for detecting a second pressure produced at a downstream side of the filter on the exhaust gas flow path, and filter state determination means for determining a state of the filter, wherein the filter state determination means are composed of an operation part and a storage part, wherein values of the first and second pressures detected by the first and second pressure detection means are stored in the storage part, wherein values of the first and second pressures detected by the first and second pressure detection means are transmitted from the storage part to the operation part, and wherein a state of the filter is determined in the operation part by applying Fourier transformation to each of values of the first and second pressures and comparing spectral intensities and/or phases at a predetermined frequency obtained by the Fourier transformation, so as to conduct determination of a state of such a filter at a good precision.

摘要翻译： 根据本发明的用于检测用于收集废气中的微粒的过滤器的状态的微粒收集过滤器状态检测装置包括：第一压力检测装置，用于检测在过滤器的上游侧产生的排气上的第一压力 流路，第二压力检测装置，用于检测在排气流路上的过滤器的下游侧产生的第二压力;以及过滤器状态确定装置，用于确定过滤器的状态，其中过滤器状态确定装置由 操作部分和存储部分，其中由第一和第二压力检测装置检测到的第一和第二压力的值被存储在存储部分中，其中传输由第一和第二压力检测装置检测到的第一和第二压力的值 从存储部分到操作部分，并且其中在操作中确定过滤器的状态 通过对第一和第二压力的每一个值应用傅里叶变换，并且通过傅立叶变换获得的预定频率处的频谱强度和/或相位进行比较，从而以高精度进行这种滤波器的状态的确定。