公开(公告)号：US20160217911A1

公开(公告)日：2016-07-28

申请号：US15004030

申请日：2016-01-22

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/324

Abstract: An inductor component includes a resin insulating layer having an opening portion, a first coil formed on a first surface of the resin insulating layer such that the first coil is surrounding the opening portion, a second coil that is formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface such that the second coil is surrounding opening portion, a via conductor formed through the resin insulating layer such that the via conductor is connecting the first coil and the second coil, and a magnetic body structure having an opening portion magnetic body filling the opening portion of the resin insulating layer, a first surface magnetic body covering the first coil, and a second surface magnetic body covering the second coil.

Abstract translation: 电感器部件包括具有开口部的树脂绝缘层，形成在树脂绝缘层的第一表面上的第一线圈，使得第一线圈围绕开口部，形成在树脂的第二表面上的第二线圈 绝缘层，其相对于第一表面在相对侧上，使得第二线圈围绕开口部分;通孔导体，其形成为穿过树脂绝缘层，使得通孔导体连接第一线圈和第二线圈;以及磁体 具有填充树脂绝缘层的开口部的开口部磁性体，覆盖第一线圈的第一表面磁性体和覆盖第二线圈的第二表面磁性体的结构。

公开(公告)号：US20150137931A1

公开(公告)日：2015-05-21

申请号：US14603822

申请日：2015-01-23

Applicant: IBIDEN Co., Ltd.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Haruhiko MORITA

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F41/041 ,  H01F2027/2809 ,  Y10T29/4902

Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.

Abstract translation: 印刷布线板包括具有穿过绝缘层的第一穿透孔的绝缘层，包括填充在穿过绝缘层的第一穿透孔中的磁性材料的磁芯结构，使得包括形成第一磁性体层的磁芯结构 在第一贯通孔中形成绝缘层，导体层形成在绝缘层上并具有使电感器图案围绕磁芯结构的圆周的电感图案。 导体层的磁芯结构和电感器图案形成电感器件。

公开(公告)号：US20150092356A1

公开(公告)日：2015-04-02

申请号：US14504842

申请日：2014-10-02

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi Kariya

IPC: H05K1/03 ,  H05K3/04 ,  H05K3/18 ,  H05K3/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/244 ,  H05K3/282 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0392 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1383 ,  Y10T29/49156

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.

Abstract translation: 一种制造印刷电路板的方法，包括在层间绝缘层的中心部分的第一焊盘上形成可移除层以安装IC芯片，在中间层和可去除层上形成具有露出第二焊盘的开口的树脂绝缘层， 层间层，用于连接第二基板，在树脂层上，在开口和第二焊盘上形成种子层，在种子层上形成具有抗蚀剂开口的电镀抗蚀剂，该抗蚀剂开口露出具有大于开口的直径的树脂层的开口， 通过电解电镀填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，去除抗蚀剂，除去暴露在树脂层上的种子层，以及去除可去除层上的可去除层和树脂层， 在树脂层中形成第一焊盘。

公开(公告)号：US20140118976A1

公开(公告)日：2014-05-01

申请号：US14067080

申请日：2013-10-30

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Liyi CHEN ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/30

CPC classification number: H05K3/4644 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.

Abstract translation: 印刷电路板包括具有开口的芯基板，容纳在基板的开口中并包括电感器和无源部件的电子部件装置，连接电子装置中的电感器和无源部件的布线结构，填充树脂体填充空间 在衬底和电子器件之间的衬底的开口中的第一堆积层，在衬底的第一表面上包括第一层间绝缘层，第一绝缘层上的第一导电层和第一绝缘层中的第一通孔导体 以及第二累积层，其在基板的第一表面的相反侧的第二表面上包括第二层间绝缘层，第二绝缘层上的第二导电层和第二绝缘层中的第二通孔导体 。

公开(公告)号：US20150250054A1

公开(公告)日：2015-09-03

申请号：US14633864

申请日：2015-02-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46 ,  H05K3/22 ,  H05K3/02 ,  H01L23/00 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/09 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/144 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。

公开(公告)号：US20150092357A1

公开(公告)日：2015-04-02

申请号：US14504969

申请日：2014-10-02

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L25/00 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/244 ,  H05K3/282 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0392 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1383

Abstract: A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist.

Abstract translation: 一种制造印刷电路板的方法包括在层间树脂绝缘层上形成树脂绝缘层和导电电路，使得树脂绝缘层具有露出层间层中心部分的焊盘部分的第一开口和暴露外围焊盘部分的第二开口 在所述第一和第二开口和所述垫部分上在所述树脂绝缘层上形成种子层，在所述种子层上形成电镀抗蚀剂，使得所述抗蚀剂具有抵抗开口暴露所述第二开口并且具有直径 大于第二开口，通过种子层用电解电镀材料填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，从树脂绝缘层除去抗蚀剂，并且通过在树脂绝缘层上暴露的种子层除去 去除抗蚀剂。

公开(公告)号：US20130223033A1

公开(公告)日：2013-08-29

申请号：US13729106

申请日：2012-12-28

Applicant: IBIDEN Co., Ltd.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H01F27/28 ,  H05K1/18

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.

Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。

公开(公告)号：US20150098204A1

公开(公告)日：2015-04-09

申请号：US14509354

申请日：2014-10-08

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi Kariya

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/144 ,  H01L21/4853 ,  H01L23/00 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K3/4007 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist.

Abstract translation: 一种制造印刷电路板的方法包括在层间层上形成树脂层，使得树脂层具有在中心部分露出电路的第一开口和在层间层的周边部分露出电路的第二开口，在电路中形成焊料凸块 所述第一开口在所述凸起和树脂层上形成电镀抗蚀剂，使得所述抗蚀剂具有直径大于所述第二开口的开口并露出所述第二开口，在所述开口中和所述电路上通过所述开口和所述电路在所述电路上形成种子层 第二开口，在抗蚀剂上施加电解电镀，使得电解电镀填充开口并在开口中的抗蚀剂和金属柱上形成镀膜，蚀刻电镀，使得镀膜被去除，并且凹陷形成在 帖子，并删除抗蚀剂。

公开(公告)号：US20160042861A1

公开(公告)日：2016-02-11

申请号：US14820666

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Toshihiko ONOGI ,  Kazuhiro YOSHIKAWA ,  Yuki TANAKA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H01F27/28 ,  H01F27/245

CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F2027/2809

Abstract: A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

Abstract translation: 印刷布线板包括具有空腔的芯基板，位于基板的空腔中的电感器部件，形成在基板的第一表面上的第一累积层和形成在基板的第二表面上的第二累积层。 电感器部件包括具有第一开口的绝缘层和形成在第一开口之间的第二开口，分别形成在第一开口中的导电通孔，形成在第二开口中的磁体，形成在绝缘体的第一表面上的第一互连 并且连接绝缘层的第一表面上的导电通孔，以及形成在绝缘层的第二表面上并连接绝缘层的第二表面上的导电通孔的第二互连和第一互连，第二互连 并且导电通孔被定位成形成螺旋结构。

公开(公告)号：US20140034373A1

公开(公告)日：2014-02-06

申请号：US13954431

申请日：2013-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Yasuhiko MANO

IPC: H01F5/00 ,  H01F41/32 ,  H05K1/16

CPC classification number: H01F5/003 ,  H01F5/00 ,  H01F17/0013 ,  H01F41/32 ,  H01F2017/0066 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/083 ,  H05K2201/09672 ,  Y10T29/4902

Abstract: An inductor element has a support layer, a first conductive layer formed on the support layer and having a first inductor pattern and a first pad at one end of the first inductor pattern, a first insulation layer formed on the support layer and first conductive layer and including a magnetic material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor pattern and a second pad at one end of the second inductor pattern, and a via conductor formed through the first insulation layer and connecting the first and second conductive layers. The magnetic material layer is covering at least part of the first inductor pattern, the resin layer is covering the first pad and has opening exposing at least part of the first pad, and the via conductor is formed in the opening of the first insulation layer.

Abstract translation: 电感器元件具有支撑层，形成在支撑层上并具有第一电感器图案的第一导电层和位于第一电感器图案的一端的第一焊盘，形成在支撑层和第一导电层上的第一绝缘层和 包括磁性材料层和树脂层，形成在第一绝缘层上并具有第二电感器图案的第二导电层和在第二电感器图案的一端的第二焊盘，以及通过第一绝缘层形成的通孔导体和 连接第一和第二导电层。 磁性材料层覆盖第一电感器图案的至少一部分，树脂层覆盖第一焊盘，并且具有暴露第一焊盘的至少一部分的开口，并且通孔导体形成在第一绝缘层的开口中。