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公开(公告)号：US20180035534A1
公开(公告)日：2018-02-01
申请号：US15661107
申请日：2017-07-27
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Ryuzo NISHIKAWA , Haruhiko MORITA
CPC classification number: H05K1/0242 , H05K1/0298 , H05K3/02 , H05K3/46 , H05K3/4688
Abstract: A printed wiring board includes a base substrate, a first insulative resin layer laminated on first surface of the base substrate, and a first conductive layer laminated on the first insulative resin layer. The base substrate includes conductive layers and insulative resin layers, the base substrate, first insulative resin layer and first conductive layer include a high-frequency substrate portion including portion of an outermost conductive layer in the base substrate, portion of the first insulative resin layer and portion of the first conductive layer, the first conductive layer has wiring patterns including microstrip lines and the portion forming the high-frequency substrate portion, the first insulative resin layer has dielectric constant of 3.5 or lower and dielectric loss tangent of 0.005 or lower, and the wiring pattern is formed such that side surfaces of the wiring pattern are substantially parallel to a thickness direction of the first insulative resin layer.
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公开(公告)号：US20160095207A1
公开(公告)日：2016-03-31
申请号：US14865061
申请日：2015-09-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Dongdong WANG , Michimasa TAKAHASHI
CPC classification number: H05K3/4691 , H05K1/0206 , H05K1/0207 , H05K2201/0323 , H05K2201/096
Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
Abstract translation: 挠性刚性布线板包括柔性基板，位于柔性基板的第一侧上的第一非柔性基板，位于柔性基板第二侧上的第二非柔性基板，第一绝缘层 柔性基板和第一和第二非柔性基板的表面以及层压在柔性基板的第二表面上的第二绝缘层以及第一和第二非柔性基板。 第一和第二绝缘层中的每一个具有暴露柔性基板的一部分的开口部分，使得柔性基板的该部分形成连接非柔性刚性部分的柔性部分，并且第一和第二非柔性基板包括热 散热部分包括具有高于第一和第二绝缘层的热导率的导热性的散热材料。
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公开(公告)号：US20210028340A1
公开(公告)日：2021-01-28
申请号：US16937715
申请日：2020-07-24
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI
Abstract: A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.
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公开(公告)号：US20190387613A1
公开(公告)日：2019-12-19
申请号：US16556292
申请日：2019-08-30
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Ryuzo NISHIKAWA , Haruhiko MORITA
Abstract: A method for manufacturing a printed wiring board includes laminating a first insulative resin layer including low dielectric constant material on a first surface of a base substrate, forming a first conductive layer including a metal foil on the first insulative resin layer, laminating a second insulative resin layer including prepreg material on a second surface of the base substrate on the opposite side with respect to the first surface, and forming a second conductive layer including a metal foil on the second insulative resin layer. The first insulative resin layer is formed such that a dielectric constant of the first insulative resin layer is set lower than a dielectric constant of the second insulative resin layer.
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公开(公告)号：US20210028342A1
公开(公告)日：2021-01-28
申请号：US16937645
申请日：2020-07-24
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI
Abstract: A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.
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Patent Agency Ranking
公开(公告)号：US20180342342A1
公开(公告)日：2018-11-29
申请号：US15988034
申请日：2018-05-24
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI
Abstract: A coil built-in substrate includes insulating layers, coil forming layers having spiral coil patterns such that each of the insulating layers is interposed between adjacent coil forming layers, connection conductors penetrating the insulating layers such that each of the connection conductors is connecting one spiral coil pattern of one coil forming layer to another spiral coil pattern of another coil forming layer, and a tubular core structure including a magnetic material and penetrates through the insulating layers such that the tubular core structure is penetrating center portions of the coil patterns in the coil forming layers.
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公开(公告)号：US20180033549A1
公开(公告)日：2018-02-01
申请号：US15659866
申请日：2017-07-26
Applicant: IBIDEN CO. , LTD.
Inventor： Hirotaka TANIGUCHI
CPC classification number: H01F41/043 , H01F17/0013 , H01F41/041 , H01F41/125 , H01F2017/002 , Y10T29/49073
Abstract: A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction.
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公开(公告)号：US20220330432A1
公开(公告)日：2022-10-13
申请号：US17680369
申请日：2022-02-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Akihide ISHIHARA
Abstract: A wiring substrate includes an insulating layer, and a build-up part formed on the insulating layer and including an interlayer insulating layer and a conductor layer. The build-up part has a cavity penetrating through the build-up part such that the cavity is formed to accommodate an electronic component and has an inner wall and a bottom surface having a groove and that the groove is extending entirely in an outer edge part of the bottom surface and formed continuously from the inner wall surface of the cavity.
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公开(公告)号：US20190288398A1
公开(公告)日：2019-09-19
申请号：US16355936
申请日：2019-03-18
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI
Abstract: A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.
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公开(公告)号：US20160066429A1
公开(公告)日：2016-03-03
申请号：US14837143
申请日：2015-08-27
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Dongdong WANG , Michimasa TAKAHASHI
CPC classification number: H05K1/0278 , H05K1/0281 , H05K1/186 , H05K3/4069 , H05K3/421 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2201/09845 , H05K2203/072 , H05K2203/0723 , H05K2203/1184 , H05K2203/308
Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.
Abstract translation: 挠性刚性布线板包括柔性基材结构，从柔性基材结构的相对端延伸的刚性基材结构，嵌入刚性基材结构中的电子部件，层压在第一表面上的第一堆积层 柔性基材结构和刚性基材结构，并具有暴露柔性基材结构的曝光部分，以及层压在柔性基材结构和刚性基材结构的第二表面上的第二堆积层，并具有露出柔性基体 材料结构。 第一和第二积层形成为使得由第一和第二积聚层的暴露部分暴露的柔性基底材料结构形成可弯曲部分，并且刚性基底材料结构和第一和第二积聚层形成不可弯曲部分 连接到可弯曲部分。
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